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ORCIDSheldon X.-D. Tan
Xiang-Dong Tan
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- affiliation: University of California, Riverside, Department of Electrical and Computer Engineering, CA, US
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2020 – today
- 2023
[j102]Jinwei Zhang
, Sheriff Sadiqbatcha, Liang Chen, Cuong Thi, Sachin Sachdeva, Hussam Amrouch, Sheldon X.-D. Tan:
Hot-spot aware thermoelectric array based cooling for multicore processors. Integr. 89: 73-82 (2023)- [j101]Han Zhou, Yibo Liu, Wentian Jin, Sheldon X.-D. Tan:
GridNetOpt: Fast Full-Chip EM-Aware Power Grid Optimization Accelerated by Deep Neural Networks. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 42(5): 1662-1675 (2023) - [c176]Jincong Lu, Jinwei Zhang, Wentian Jin, Sachin Sachdeva, Sheldon X.-D. Tan:
Learning Based Spatial Power Characterization and Full-Chip Power Estimation for Commercial TPUs. ASP-DAC 2023: 98-103 - [c175]Shuyuan Yu, Sheldon X.-D. Tan:
PAALM: Power Density Aware Approximate Logarithmic Multiplier Design. ASP-DAC 2023: 128-133 - 2022
- [j100]Sheriff Sadiqbatcha, Jinwei Zhang, Hussam Amrouch, Sheldon X.-D. Tan:
Real-Time Full-Chip Thermal Tracking: A Post-Silicon, Machine Learning Perspective. IEEE Trans. Computers 71(6): 1411-1424 (2022) - [j99]Jinwei Zhang, Sheriff Sadiqbatcha, Michael O'Dea, Hussam Amrouch, Sheldon X.-D. Tan:
Full-Chip Power Density and Thermal Map Characterization for Commercial Microprocessors Under Heat Sink Cooling. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41(5): 1453-1466 (2022) - [j98]Liang Chen, Sheriff Sadiqbatcha, Hussam Amrouch, Sheldon X.-D. Tan:
Electrothermal Simulation and Optimal Design of Thermoelectric Cooler Using Analytical Approach. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41(9): 3066-3077 (2022) - [c174]Shuyuan Yu, Maliha Tasnim, Sheldon X.-D. Tan:
HEALM: Hardware-Efficient Approximate Logarithmic Multiplier with Reduced Error. ASP-DAC 2022: 37-42 - [c173]Mohammadamir Kavousi, Liang Chen, Sheldon X.-D. Tan:
Fast Electromigration Stress Analysis Considering Spatial Joule Heating Effects. ASP-DAC 2022: 208-213 - [c172]Liang Chen, Wentian Jin, Sheldon X.-D. Tan:
Fast Thermal Analysis for Chiplet Design based on Graph Convolution Networks. ASP-DAC 2022: 485-492 - [c171]Shuyuan Yu, Sheldon X.-D. Tan:
Scaled-CBSC: scaled counting-based stochastic computing multiplication for improved accuracy. DAC 2022: 1003-1008 - [c170]Wentian Jin, Liang Chen, Subed Lamichhane, Mohammadamir Kavousi, Sheldon X.-D. Tan:
HierPINN-EM: Fast Learning-Based Electromigration Analysis for Multi-Segment Interconnects Using Hierarchical Physics-Informed Neural Network. ICCAD 2022: 28 - [c169]Sheldon X.-D. Tan:
EDAML 2022 Invited Speaker 9: Thermal and Power Monitoring and Estimation for Commercial Multicore Processors - A Machine Learning Perspective. IPDPS Workshops 2022: 1190 - [c168]Marcus Chow, Ali Jahanshahi, Ana Cardenas Beltran, Sheldon X.-D. Tan, Daniel Wong:
GPUCalorie: Floorplan Estimation for GPU Thermal Evaluation. ISPASS 2022: 239-241 - 2021
- [j97]Sheldon X.-D. Tan, Toshihiro Hattori:
The 2021 Asia and South Pacific Design Automation Conference (ASPDAC). IEEE Des. Test 38(3): 121-122 (2021) - [j96]Han Zhou, Liang Chen, Sheldon X.-D. Tan:
Robust power grid network design considering EM aging effects for multi-segment wires. Integr. 77: 38-47 (2021) - [j95]Liang Chen, Sheldon X.-D. Tan, Zeyu Sun, Shaoyi Peng, Min Tang, Junfa Mao:
A Fast Semi-Analytic Approach for Combined Electromigration and Thermomigration Analysis for General Multisegment Interconnects. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 40(2): 350-363 (2021) - [j94]Xiaoyi Wang, Shaobin Ma, Sheldon X.-D. Tan, Chase Cook, Liang Chen, Jianlei Yang, Wenjian Yu:
Fast Physics-Based Electromigration Analysis for Full-Chip Networks by Efficient Eigenfunction-Based Solution. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 40(3): 507-520 (2021) - [j93]Sheriff Sadiqbatcha, Jinwei Zhang, Hengyang Zhao, Hussam Amrouch, Jörg Henkel, Sheldon X.-D. Tan:
Post-Silicon Heat-Source Identification and Machine-Learning-Based Thermal Modeling Using Infrared Thermal Imaging. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 40(4): 694-707 (2021) - [c167]Shuyuan Yu, Yibo Liu, Sheldon X.-D. Tan:
COSAIM: Counter-based Stochastic-behaving Approximate Integer Multiplier for Deep Neural Networks. DAC 2021: 499-504 - [c166]Wentian Jin, Liang Chen, Sheriff Sadiqbatcha, Shaoyi Peng, Sheldon X.-D. Tan:
EMGraph: Fast Learning-Based Electromigration Analysis for Multi-Segment Interconnect Using Graph Convolution Networks. DAC 2021: 919-924 - [c165]Wentian Jin, Shaoyi Peng, Sheldon X.-D. Tan:
Data-Driven Electrostatics Analysis based on Physics-Constrained Deep learning. DATE 2021: 1382-1387 - [c164]Yibo Liu, Shuyuan Yu, Shaoyi Peng, Sheldon X.-D. Tan:
Runtime Long-Term Reliability Management Using Stochastic Computing in Deep Neural Networks. ISQED 2021: 553-558 - [c163]Subed Lamichhane, Shaoyi Peng, Wentian Jin, Sheldon X.-D. Tan:
Fast Electrostatic Analysis For VLSI Aging based on Generative Learning. MLCAD 2021: 1-6 - [c162]Shuyuan Yu, Yibo Liu, Sheldon X.-D. Tan:
Approximate Divider Design Based on Counting-Based Stochastic Computing Division. MLCAD 2021: 1-6 - [c161]Hussam Amrouch, Animesh Basak Chowdhury, Wentian Jin, Ramesh Karri, Farshad Khorrami, Prashanth Krishnamurthy, Ilia Polian, Victor M. van Santen, Benjamin Tan, Sheldon X.-D. Tan:
Special Session: Machine Learning for Semiconductor Test and Reliability. VTS 2021: 1-11 - 2020
- [j92]Shaoyi Peng, Sheldon X.-D. Tan:
GLU3.0: Fast GPU-based Parallel Sparse LU Factorization for Circuit Simulation. IEEE Des. Test 37(3): 78-90 (2020) - [j91]Shaoyi Peng, Ertugrul Demircan, Mehul D. Shroff, Sheldon X.-D. Tan:
Full-chip wire-oriented back-end-of-line TDDB hotspot detection and lifetime analysis. Integr. 70: 90-98 (2020) - [j90]Sheldon X.-D. Tan, Zeyu Sun, Sheriff Sadiqbatcha:
Interconnect Electromigration Modeling and Analysis for Nanometer ICs: From Physics to Full-Chip. IPSJ Trans. Syst. LSI Des. Methodol. 13: 42-55 (2020) - [j89]Sheriff Sadiqbatcha, Zeyu Sun, Sheldon X.-D. Tan:
Accelerating Electromigration Aging: Fast Failure Detection for Nanometer ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 39(4): 885-894 (2020) - [j88]Hai Wang, Xingxing Guo, Sheldon X.-D. Tan, Chi Zhang, He Tang, Yuan Yuan:
Leakage-Aware Predictive Thermal Management for Multicore Systems Using Echo State Network. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 39(7): 1400-1413 (2020) - [j87]Liang Chen, Sheldon X.-D. Tan, Zeyu Sun, Shaoyi Peng, Min Tang, Junfa Mao:
Fast Analytic Electromigration Analysis for General Multisegment Interconnect Wires. IEEE Trans. Very Large Scale Integr. Syst. 28(2): 421-432 (2020) - [c160]Shaobin Ma, Xiaoyi Wang, Sheldon X.-D. Tan, Liang Chen, Jian He:
An Adaptive Electromigration Assessment Algorithm for Full-chip Power/Ground Networks. ASP-DAC 2020: 38-43 - [c159]Han Zhou, Shuyuan Yu, Zeyu Sun, Sheldon X.-D. Tan:
Reliable Power Grid Network Design Framework Considering EM Immortalities for Multi-Segment Wires. ASP-DAC 2020: 74-79 - [c158]Sheriff Sadiqbatcha, Yue Zhao, Jinwei Zhang, Hussam Amrouch, Jörg Henkel, Sheldon X.-D. Tan:
Machine Learning Based Online Full-Chip Heatmap Estimation. ASP-DAC 2020: 229-234 - [c157]Shuyuan Yu, Han Zhou, Shaoyi Peng, Hussam Amrouch, Jörg Henkel, Sheldon X.-D. Tan:
Run-Time Accuracy Reconfigurable Stochastic Computing for Dynamic Reliability and Power Management: Work-in-Progress. CASES 2020: 1-3 - [c156]Jinwei Zhang, Sheriff Sadiqbatcha, Wentian Jin, Sheldon X.-D. Tan:
Accurate Power Density Map Estimation for Commercial Multi-Core Microprocessors. DATE 2020: 1085-1090 - [c155]Mohammadamir Kavousi, Liang Chen, Sheldon X.-D. Tan:
Electromigration Immortality Check considering Joule Heating Effect for Multisegment Wires. ICCAD 2020: 6:1-6:8 - [c154]Wentian Jin, Sheriff Sadiqbatcha, Jinwei Zhang, Sheldon X.-D. Tan:
Full-Chip Thermal Map Estimation for Commercial Multi-Core CPUs with Generative Adversarial Learning. ICCAD 2020: 14:1-14:9 - [c153]Han Zhou, Wentian Jin, Sheldon X.-D. Tan:
GridNet: Fast Data-Driven EM-Induced IR Drop Prediction and Localized Fixing for On-Chip Power Grid Networks. ICCAD 2020: 160:1-160:9 - [c152]Wentian Jin, Sheriff Sadiqbatcha, Zeyu Sun, Han Zhou, Sheldon X.-D. Tan:
EM-GAN: Data-Driven Fast Stress Analysis for Multi-Segment Interconnects. ICCD 2020: 296-303 - [c151]Shaoyi Peng, Wentian Jin, Liang Chen, Sheldon X.-D. Tan:
Data-Driven Fast Electrostatics and TDDB Aging Analysis. MLCAD 2020: 71-76 - [c150]Jinwei Zhang, Sheriff Sadiqbatcha, Yuanqi Gao, Michael O'Dea, Nanpeng Yu, Sheldon X.-D. Tan:
HAT-DRL: Hotspot-Aware Task Mapping for Lifetime Improvement of Multicore System using Deep Reinforcement Learning. MLCAD 2020: 77-82 - [i5]Wentian Jin, Sheriff Sadiqbatcha, Jinwei Zhang, Sheldon X.-D. Tan:
EM-GAN: Fast Stress Analysis for Multi-Segment Interconnect Using Generative Adversarial Networks. CoRR abs/2004.13181 (2020) - [i4]Shuyuan Yu, Han Zhou, Shaoyi Peng, Hussam Amrouch, Jörg Henkel, Sheldon X.-D. Tan:
Run-Time Accuracy Reconfigurable Stochastic Computing for Dynamic Reliability and Power Management. CoRR abs/2004.13320 (2020)
2010 – 2019
- 2019
- [j86]Chase Cook, Sheriff Sadiqbatcha, Zeyu Sun, Sheldon X.-D. Tan:
Reliability based hardware Trojan design using physics-based electromigration models. Integr. 66: 9-15 (2019) - [j85]Chase Cook, Hengyang Zhao, Takashi Sato, Masayuki Hiromoto, Sheldon X.-D. Tan:
GPU-based Ising computing for solving max-cut combinatorial optimization problems. Integr. 69: 335-344 (2019) - [j84]Hai Wang, Diya Tang, Ming Zhang, Sheldon X.-D. Tan, Chi Zhang, He Tang, Yuan Yuan:
GDP: A Greedy Based Dynamic Power Budgeting Method for Multi/Many-Core Systems in Dark Silicon. IEEE Trans. Computers 68(4): 526-541 (2019) - [j83]Han Zhou, Zeyu Sun, Sheriff Sadiqbatcha, Naehyuck Chang, Sheldon X.-D. Tan:
EM-Aware and Lifetime-Constrained Optimization for Multisegment Power Grid Networks. IEEE Trans. Very Large Scale Integr. Syst. 27(4): 940-953 (2019) - [j82]Zeyu Sun, Sheriff Sadiqbatcha, Hengyang Zhao, Sheldon X.-D. Tan:
Saturation-Volume Estimation for Multisegment Copper Interconnect Wires. IEEE Trans. Very Large Scale Integr. Syst. 27(7): 1666-1674 (2019) - [c149]Ke Yang, Shaoyi Peng, Sheldon X.-D. Tan, Hai-Bao Chen:
Multi-Thread Assembling for Fast FEM Power Delivery DC Integrity Analysis. ASICON 2019: 1-4 - [c148]Sheriff Sadiqbatcha, Hengyang Zhao, Hussam Amrouch, Jörg Henkel, Sheldon X.-D. Tan:
Hot Spot Identification and System Parameterized Thermal Modeling for Multi-Core Processors Through Infrared Thermal Imaging. DATE 2019: 48-53 - [c147]Zeyu Sun, Taeyoung Kim, Marcus Chow, Shaoyi Peng, Han Zhou, Hyoseung Kim, Daniel Wong, Sheldon X.-D. Tan:
Long-Term Reliability Management For Multitasking GPGPUs. SMACD 2019: 213-216 - [c146]Zeyu Sun, Han Zhou, Sheldon X.-D. Tan:
Dynamic Reliability Management for Multi-Core Processor Based on Deep Reinforcement Learning. SMACD 2019: 217-220 - [e1]Sheldon X.-D. Tan, Mehdi Baradaran Tahoori, Taeyoung Kim, Shengcheng Wang, Zeyu Sun, Saman Kiamehr:
Long-Term Reliability of Nanometer VLSI Systems, Modeling, Analysis and Optimization. Springer 2019, ISBN 978-3-030-26171-9 - [i3]Shaoyi Peng, Sheldon X.-D. Tan:
GLU3.0: Fast GPU-based Parallel Sparse LU Factorization for Circuit Simulation. CoRR abs/1908.00204 (2019) - [i2]Chase Cook, Wentian Jin, Sheldon X.-D. Tan:
GPU-based Ising Computing for Solving Balanced Min-Cut Graph Partitioning Problem. CoRR abs/1908.00210 (2019) - 2018
- [j81]Sheldon X.-D. Tan, Hussam Amrouch, Taeyoung Kim, Zeyu Sun, Chase Cook, Jörg Henkel:
Recent advances in EM and BTI induced reliability modeling, analysis and optimization (invited). Integr. 60: 132-152 (2018) - [j80]Taeyoung Kim, Sheldon X.-D. Tan, Chase Cook, Zeyu Sun:
Detection of counterfeited ICs via on-chip sensor and post-fabrication authentication policy. Integr. 63: 31-40 (2018) - [j79]Taeyoung Kim, Zao Liu, Sheldon X.-D. Tan:
Dynamic reliability management based on resource-based EM modeling for multi-core microprocessors. Microelectron. J. 74: 106-115 (2018) - [j78]Hai Wang, Jiachun Wan, Sheldon X.-D. Tan, Chi Zhang, He Tang, Yuan Yuan, Keheng Huang, Zhenghong Zhang:
A Fast Leakage-Aware Full-Chip Transient Thermal Estimation Method. IEEE Trans. Computers 67(5): 617-630 (2018) - [j77]Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Chase Cook, Sheldon X.-D. Tan:
Fast Electromigration Immortality Analysis for Multisegment Copper Interconnect Wires. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 37(12): 3137-3150 (2018) - [j76]Hengyang Zhao, Qi Hua, Hai-Bao Chen, Yaoyao Ye, Hai Wang, Sheldon X.-D. Tan, Esteban Tlelo-Cuautle:
Thermal-Sensor-Based Occupancy Detection for Smart Buildings Using Machine-Learning Methods. ACM Trans. Design Autom. Electr. Syst. 23(4): 54:1-54:21 (2018) - [j75]Shaoyi Peng, Han Zhou, Taeyoung Kim, Hai-Bao Chen, Sheldon X.-D. Tan:
Physics-Based Compact TDDB Models for Low-k BEOL Copper Interconnects With Time-Varying Voltage Stressing. IEEE Trans. Very Large Scale Integr. Syst. 26(2): 239-248 (2018) - [j74]Shengcheng Wang, Taeyoung Kim, Zeyu Sun, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori:
Recovery-Aware Proactive TSV Repair for Electromigration Lifetime Enhancement in 3-D ICs. IEEE Trans. Very Large Scale Integr. Syst. 26(3): 531-543 (2018) - [j73]Chase Cook, Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Sheldon X.-D. Tan:
Fast Electromigration Stress Evolution Analysis for Interconnect Trees Using Krylov Subspace Method. IEEE Trans. Very Large Scale Integr. Syst. 26(5): 969-980 (2018) - [j72]Hengyang Zhao, Sheldon X.-D. Tan:
Postvoiding FEM Analysis for Electromigration Failure Characterization. IEEE Trans. Very Large Scale Integr. Syst. 26(11): 2483-2493 (2018) - [c145]Han Zhou, Yijing Sun, Zeyu Sun, Hengyang Zhao, Sheldon X.-D. Tan:
Electromigration-lifetime constrained power grid optimization considering multi-segment interconnect wires. ASP-DAC 2018: 399-404 - [c144]Zeyu Sun, Sheriff Sadiqbatcha, Hengyang Zhao, Sheldon X.-D. Tan:
Accelerating electromigration aging for fast failure detection for nanometer ICs. ASP-DAC 2018: 623-630 - [c143]Hengyang Zhao, Sheldon X.-D. Tan:
Multi-physics-based FEM analysis for post-voiding analysis of electromigration failure effects. ICCAD 2018: 124 - [c142]Ana Dalia Pano-Azucena, Esteban Tlelo-Cuautle, Sheldon X.-D. Tan:
Electronic System for Chaotic Time Series Prediction Associated to Human Disease. ICHI 2018: 323-327 - [c141]Ana Dalia Pano-Azucena, Esteban Tlelo-Cuautle, Sheldon X.-D. Tan:
Prediction of chaotic time series by using ANNs, ANFIS and SVMs. MOCAST 2018: 1-4 - [c140]Chase Cook, Sheriff Sadiqbatcha, Zeyu Sun, Sheldon X.-D. Tan:
Reliability Based Hardware Trojan Design Using Physics-Based Electromigration Models. SMACD 2018: 5-8 - [c139]Sheriff Sadiqbatcha, Chase Cook, Zeyu Sun, Sheldon X.-D. Tan:
Accelerating Electromigration Wear-Out Effects Based on Configurable Sink-Structured Wires. SMACD 2018: 21-24 - [i1]Yuan Cheng, Guangya Li, Hai-Bao Chen, Sheldon X.-D. Tan, Hao Yu:
DEEPEYE: A Compact and Accurate Video Comprehension at Terminal Devices Compressed with Quantization and Tensorization. CoRR abs/1805.07935 (2018) - 2017
- [j71]Xin Huang, Valeriy Sukharev, Taeyoung Kim, Sheldon X.-D. Tan:
Dynamic electromigration modeling for transient stress evolution and recovery under time-dependent current and temperature stressing. Integr. 58: 518-527 (2017) - [j70]Krishnendu Chakrabarty, Massimo Alioto, Bevan M. Baas, Chirn Chye Boon, Meng-Fan Chang, Naehyuck Chang, Yao-Wen Chang, Chip-Hong Chang, Shih-Chieh Chang, Poki Chen, Masud H. Chowdhury, Pasquale Corsonello, Ibrahim Abe M. Elfadel, Said Hamdioui, Masanori Hashimoto, Tsung-Yi Ho, Houman Homayoun, Yuh-Shyan Hwang, Rajiv V. Joshi, Tanay Karnik, Mehran Mozaffari Kermani, Chulwoo Kim, Tae-Hyoung Kim, Jaydeep P. Kulkarni, Eren Kursun, Erik Larsson, Hai (Helen) Li, Huawei Li, Patrick P. Mercier, Prabhat Mishra, Makoto Nagata, Arun S. Natarajan, Koji Nii, Partha Pratim Pande, Ioannis Savidis, Mingoo Seok, Sheldon X.-D. Tan, Mark M. Tehranipoor, Aida Todri-Sanial, Miroslav N. Velev, Xiaoqing Wen, Jiang Xu, Wei Zhang, Zhengya Zhang, Stacey Weber Jackson:
Editorial. IEEE Trans. Very Large Scale Integr. Syst. 25(1): 1-20 (2017) - [j69]Taeyoung Kim, Zeyu Sun, Hai-Bao Chen, Hai Wang, Sheldon X.-D. Tan:
Energy and Lifetime Optimizations for Dark Silicon Manycore Microprocessor Considering Both Hard and Soft Errors. IEEE Trans. Very Large Scale Integr. Syst. 25(9): 2561-2574 (2017) - [c138]Wei He, Hengyang Zhao, Zhongdong Qi, Hai-Bao Chen, Sheldon X.-D. Tan:
Fast two-dimensional finite element analysis for power network DC integrity checks of PCBs. ASICON 2017: 76-79 - [c137]Jiangtao Peng, Hai-Bao Chen, Hengyang Zhao, Zeyu Sun, Sheldon X.-D. Tan:
Dynamic temperature-aware reliability modeling for multi-branch interconnect trees. ASICON 2017: 92-95 - [c136]Shengcheng Wang, Hengyang Zhao, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori:
Recovery-aware proactive TSV repair for electromigration in 3D ICs. DATE 2017: 220-225 - [c135]Xiaoyi Wang, Hongyu Wang, Jian He, Sheldon X.-D. Tan, Yici Cai, Shengqi Yang:
Physics-based electromigration modeling and assessment for multi-segment interconnects in power grid networks. DATE 2017: 1727-1732 - [c134]Xiaoyi Wang, Yan Yan, Jian He, Sheldon X.-D. Tan, Chase Cook, Shengqi Yang:
Fast physics-based electromigration analysis for multi-branch interconnect trees. ICCAD 2017: 169-176 - [c133]Shengcheng Wang, Zeyu Sun, Yuan Cheng, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori:
Leveraging recovery effect to reduce electromigration degradation in power/ground TSV. ICCAD 2017: 811-818 - [c132]Ana Dalia Pano-Azucena, Esteban Tlelo-Cuautle, Luis Gerardo de la Fraga, Carlos Sánchez-López, Jose de Jesus Rangel-Magdaleno, Sheldon X.-D. Tan:
Prediction of chaotic time-series with different MLE values using FPGA-based ANNs. SMACD 2017: 1-4 - [c131]Yaoyao Ye, Taeyoung Kim, Hai-Bao Chen, Hai Wang, Esteban Tlelo-Cuautle, Sheldon X.-D. Tan:
Comprehensive detection of counterfeit ICs via on-chip sensor and post-fabrication authentication policy. SMACD 2017: 1-4 - 2016
- [j68]Kai He, Xin Huang, Sheldon X.-D. Tan:
EM-Based On-Chip Aging Sensor for Detection of Recycled ICs. IEEE Des. Test 33(5): 56-64 (2016) - [j67]Kai He, Sheldon X.-D. Tan, Hengyang Zhao, Xuexin Liu, Hai Wang, Guoyong Shi:
Parallel GMRES solver for fast analysis of large linear dynamic systems on GPU platforms. Integr. 52: 10-22 (2016) - [j66]Xin Huang, Valeriy Sukharev, Jun-Ho Choy, Marko Chew, Taeyoung Kim, Sheldon X.-D. Tan:
Electromigration assessment for power grid networks considering temperature and thermal stress effects. Integr. 55: 307-315 (2016) - [j65]Xin Li, Sheldon X.-D. Tan, Yu Wang:
Editorial: Special Issue on The 14th International Conference on Computer-Aided Design and Computer Graphics (CAD/Graphics 2015). Integr. 55: 425 (2016) - [j64]Hai-Bao Chen, Sheldon X.-D. Tan, Xin Huang, Taeyoung Kim, Valeriy Sukharev:
Analytical Modeling and Characterization of Electromigration Effects for Multibranch Interconnect Trees. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 35(11): 1811-1824 (2016) - [j63]Xin Huang, Armen Kteyan, Sheldon X.-D. Tan, Valeriy Sukharev:
Physics-Based Electromigration Models and Full-Chip Assessment for Power Grid Networks. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 35(11): 1848-1861 (2016) - [j62]Yue Zhao, Taeyoung Kim, Hosoon Shin, Sheldon X.-D. Tan, Xin Li, Hai-Bao Chen, Hai Wang:
Statistical Rare-Event Analysis and Parameter Guidance by Elite Learning Sample Selection. ACM Trans. Design Autom. Electr. Syst. 21(4): 56:1-56:21 (2016) - [j61]Hai Wang, Jian Ma, Sheldon X.-D. Tan, Chi Zhang, He Tang, Keheng Huang, Zhenghong Zhang:
Hierarchical Dynamic Thermal Management Method for High-Performance Many-Core Microprocessors. ACM Trans. Design Autom. Electr. Syst. 22(1): 1:1-1:21 (2016) - [j60]Kai He, Sheldon X.-D. Tan, Hai Wang, Guoyong Shi:
GPU-Accelerated Parallel Sparse LU Factorization Method for Fast Circuit Analysis. IEEE Trans. Very Large Scale Integr. Syst. 24(3): 1140-1150 (2016) - [j59]Kai He, Sheldon X.-D. Tan:
Corrections to "GPU-Accelerated Parallel Sparse LU Factorization Method for Fast Circuit Analysis". IEEE Trans. Very Large Scale Integr. Syst. 24(3): 1212 (2016) - [c130]Xin Huang, Valeriy Sukharev, Taeyoung Kim, Hai-Bao Chen, Sheldon X.-D. Tan:
Electromigration recovery modeling and analysis under time-dependent current and temperature stressing. ASP-DAC 2016: 244-249 - [c129]Wandi Liu, Hai Wang, Hengyang Zhao, Shujuan Wang, Hai-Bao Chen, Yuzhuo Fu, Jian Ma, Xin Li, Sheldon X.-D. Tan:
Thermal modeling for energy-efficient smart building with advanced overfitting mitigation technique. ASP-DAC 2016: 417-422 - [c128]Taeyoung Kim, Zeyu Sun, Chase Cook, Hengyang Zhao, Ruiwen Li, Daniel Wong, Sheldon X.-D. Tan:
Invited - Cross-layer modeling and optimization for electromigration induced reliability. DAC 2016: 30:1-30:6 - [c127]Xin Huang, Valeriy Sukharev, Zhongdong Qi, Taeyoung Kim, Sheldon X.-D. Tan:
Physics-based full-chip TDDB assessment for BEOL interconnects. DAC 2016: 45:1-45:6 - [c126]Taeyoung Kim, Xin Huang, Hai-Bao Chen, Valeriy Sukharev, Sheldon X.-D. Tan:
Learning-based dynamic reliability management for dark silicon processor considering EM effects. DATE 2016: 463-468 - [c125]Taeyoung Kim, Zeyu Sun, Chase Cook, Jagadeesh Gaddipati, Hai Wang, Hai-Bao Chen, Sheldon X.-D. Tan:
Dynamic reliability management for near-threshold dark silicon processors. ICCAD 2016: 70 - [c124]Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Taeyoung Kim, Xin Huang, Sheldon X.-D. Tan:
Voltage-based electromigration immortality check for general multi-branch interconnects. ICCAD 2016: 113 - [c123]Xiaoming Chen, Xin Li, Sheldon X.-D. Tan:
Overview of cyber-physical temperature estimation in smart buildings: From modeling to measurements. INFOCOM Workshops 2016: 251-256 - [c122]Hengyang Zhao, Zhongdong Qi, Shujuan Wang, Kambiz Vafai, Hai Wang, Hai-Bao Chen, Sheldon X.-D. Tan:
Learning-based occupancy behavior detection for smart buildings. ISCAS 2016: 954-957 - [c121]Lang Zhang, Hai Wang, Sheldon X.-D. Tan:
Fast stress analysis for runtime reliability enhancement of 3D IC using artificial neural network. ISQED 2016: 173-178 - [c120]Hengyang Zhao, Sheldon X.-D. Tan, Hai Wang, Hai-Bao Chen:
Online Unusual Behavior Detection for Temperature Sensor Networks. ISVLSI 2016: 59-62 - [c119]Chase Cook, Zeyu Sun, Taeyoung Kim, Sheldon X.-D. Tan:
Finite difference method for electromigration analysis of multi-branch interconnects. SMACD 2016: 1-4 - [c118]