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"Recovery-aware proactive TSV repair for electromigration in 3D ICs."
Shengcheng Wang et al. (2017)
- Shengcheng Wang, Hengyang Zhao, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori:
Recovery-aware proactive TSV repair for electromigration in 3D ICs. DATE 2017: 220-225
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