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"Physics-Based Compact TDDB Models for Low-k BEOL Copper Interconnects With ..."

Shaoyi Peng et al. (2018)

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DOI: 10.1109/TVLSI.2017.2764880

access: closed

type: Journal Article

metadata version: 2024-02-28

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  persistent URL:
  - https://dblp.org/rec/journals/tvlsi/PengZKCT18
Shaoyi Peng, Han Zhou, Taeyoung Kim, Hai-Bao Chen, Sheldon X.-D. Tan:
Physics-Based Compact TDDB Models for Low-k BEOL Copper Interconnects With Time-Varying Voltage Stressing. IEEE Trans. Very Large Scale Integr. Syst. 26(2): 239-248 (2018)

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