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"Dynamic temperature-aware reliability modeling for multi-branch ..."

Jiangtao Peng et al. (2017)

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DOI: 10.1109/ASICON.2017.8252419

access: closed

type: Conference or Workshop Paper

metadata version: 2021-02-19

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  dblp key:
  - conf/asicon/PengCZST17
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Jiangtao Peng, Hai-Bao Chen, Hengyang Zhao, Zeyu Sun, Sheldon X.-D. Tan:
Dynamic temperature-aware reliability modeling for multi-branch interconnect trees. ASICON 2017: 92-95

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