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"Compact thermal modeling for packaged microprocessor design with practical ..."

Zao Liu et al. (2014)

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DOI: 10.1016/J.VLSI.2013.07.003

access: closed

type: Journal Article

metadata version: 2020-02-20

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Zao Liu, Sheldon X.-D. Tan, Hai Wang, Yingbo Hua, Ashish Gupta:
Compact thermal modeling for packaged microprocessor design with practical power maps. Integr. 47(1): 71-85 (2014)

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