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ORCIDKambiz Samadi
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2020 – today
- 2022
[j13]Yi-Chen Lu
, Jeehyun Lee, Anthony Agnesina, Kambiz Samadi, Sung Kyu Lim:
A Clock Tree Prediction and Optimization Framework Using Generative Adversarial Learning. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41(9): 3104-3117 (2022)- [j12]Yi-Chen Lu, Sai Pentapati, Lingjun Zhu, Gauthaman Murali, Kambiz Samadi, Sung Kyu Lim:
A Machine Learning-Powered Tier Partitioning Methodology for Monolithic 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41(11): 4575-4586 (2022) - 2020
- [c28]Yi-Chen Lu, Sai Surya Kiran Pentapati, Lingjun Zhu, Kambiz Samadi, Sung Kyu Lim:
TP-GNN: A Graph Neural Network Framework for Tier Partitioning in Monolithic 3D ICs. DAC 2020: 1-6
2010 – 2019
- 2019
- [c27]Andrew B. Kahng, Seokhyeong Kang, Seungwon Kim, Kambiz Samadi, Bangqi Xu:
Power Delivery Pathfinding for Emerging Die-to-Wafer Integration Technology. DATE 2019: 842-847 - [c26]Yi-Chen Lu, Jeehyun Lee, Anthony Agnesina, Kambiz Samadi, Sung Kyu Lim:
GAN-CTS: A Generative Adversarial Framework for Clock Tree Prediction and Optimization. ICCAD 2019: 1-8 - [i2]Soroush Ghodrati, Hardik Sharma, Sean Kinzer, Amir Yazdanbakhsh, Kambiz Samadi, Nam Sung Kim, Doug Burger, Hadi Esmaeilzadeh:
Mixed-Signal Charge-Domain Acceleration of Deep Neural networks through Interleaved Bit-Partitioned Arithmetic. CoRR abs/1906.11915 (2019) - 2018
- [c25]Amir Yazdanbakhsh, Michael Brzozowski, Behnam Khaleghi, Soroush Ghodrati, Kambiz Samadi, Nam Sung Kim, Hadi Esmaeilzadeh:
FlexiGAN: An End-to-End Solution for FPGA Acceleration of Generative Adversarial Networks. FCCM 2018: 65-72 - [c24]Amir Yazdanbakhsh, Kambiz Samadi, Nam Sung Kim, Hadi Esmaeilzadeh:
GANAX: A Unified MIMD-SIMD Acceleration for Generative Adversarial Networks. ISCA 2018: 650-661 - [c23]Vahideh Akhlaghi, Amir Yazdanbakhsh, Kambiz Samadi, Rajesh K. Gupta, Hadi Esmaeilzadeh:
SnaPEA: Predictive Early Activation for Reducing Computation in Deep Convolutional Neural Networks. ISCA 2018: 662-673 - [i1]Amir Yazdanbakhsh, Hajar Falahati, Philip J. Wolfe, Kambiz Samadi, Nam Sung Kim, Hadi Esmaeilzadeh:
GANAX: A Unified MIMD-SIMD Acceleration for Generative Adversarial Networks. CoRR abs/1806.01107 (2018) - 2017
- [j11]Sandeep Kumar Samal, Kambiz Samadi, Pratyush Kamal, Yang Du, Sung Kyu Lim:
Full Chip Impact Study of Power Delivery Network Designs in Gate-Level Monolithic 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 36(6): 992-1003 (2017) - [j10]Shreepad Panth, Sandeep Kumar Samal, Kambiz Samadi, Yang Du, Sung Kyu Lim:
Tier Degradation of Monolithic 3-D ICs: A Power Performance Study at Different Technology Nodes. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 36(8): 1265-1273 (2017) - [j9]Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim:
Shrunk-2-D: A Physical Design Methodology to Build Commercial-Quality Monolithic 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 36(10): 1716-1724 (2017) - [j8]Yang Song, Kambiz Samadi, Bill Lin:
A Single-Tier Virtual Queuing Memory Controller Architecture for Heterogeneous MPSoCs. ACM Trans. Design Autom. Electr. Syst. 22(3): 56:1-56:23 (2017) - 2016
- [j7]Sandeep Kumar Samal, Shreepad Panth, Kambiz Samadi, Mehdi Saedi, Yang Du, Sung Kyu Lim:
Adaptive Regression-Based Thermal Modeling and Optimization for Monolithic 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 35(10): 1707-1720 (2016) - [c22]Yang Song, Kambiz Samadi, Bill Lin:
Single-tier virtual queuing: an efficacious memory controller architecture for MPSoCs with multiple realtime cores. DAC 2016: 6:1-6:6 - [c21]Wei-Ting Jonas Chan, Yang Du, Andrew B. Kahng, Siddhartha Nath, Kambiz Samadi:
BEOL stack-aware routability prediction from placement using data mining techniques. ICCD 2016: 41-48 - 2015
- [j6]Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim:
Placement-Driven Partitioning for Congestion Mitigation in Monolithic 3D IC Designs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 34(4): 540-553 (2015) - [c20]Wei-Ting Jonas Chan, Siddhartha Nath, Andrew B. Kahng, Yang Du, Kambiz Samadi:
3DIC benefit estimation and implementation guidance from 2DIC implementation. DAC 2015: 30:1-30:6 - [c19]Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim:
Tier-partitioning for power delivery vs cooling tradeoff in 3D VLSI for mobile applications. DAC 2015: 92:1-92:6 - [c18]Karim Arabi, Kambiz Samadi, Yang Du:
3D VLSI: A Scalable Integration Beyond 2D. ISPD 2015: 1-7 - [c17]Marco Escalante, Andrew B. Kahng, Michael Kishinevsky, Ümit Y. Ogras, Kambiz Samadi:
Multi-product floorplan and uncore design framework for chip multiprocessors. SLIP 2015: 1-7 - 2014
- [c16]Mehdi Saedi, Kambiz Samadi, Arpit Mittal, Rajat Mittal:
Thermal implications of mobile 3D-ICs. 3DIC 2014: 1-7 - [c15]Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim:
Power-Performance Study of Block-Level Monolithic 3D-ICs Considering Inter-Tier Performance Variations. DAC 2014: 62:1-62:6 - [c14]Sandeep Kumar Samal, Shreepad Panth, Kambiz Samadi, Mehdi Saedi, Yang Du, Sung Kyu Lim:
Fast and Accurate Thermal Modeling and Optimization for Monolithic 3D ICs. DAC 2014: 206:1-206:6 - [c13]Sandeep Kumar Samal, Kambiz Samadi, Pratyush Kamal, Yang Du, Sung Kyu Lim:
Full chip impact study of power delivery network designs in monolithic 3D ICs. ICCAD 2014: 565-572 - [c12]Shreepad A. Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim:
Design and CAD methodologies for low power gate-level monolithic 3D ICs. ISLPED 2014: 171-176 - [c11]Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim:
Placement-driven partitioning for congestion mitigation in monolithic 3D IC designs. ISPD 2014: 47-54 - 2013
- [c10]Shreepad Panth, Kambiz Samadi, Sung Kyu Lim:
Test-TSV estimation during 3D-IC partitioning. 3DIC 2013: 1-7 - [c9]Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim:
High-density integration of functional modules using monolithic 3D-IC technology. ASP-DAC 2013: 681-686 - 2012
- [j5]Andrew B. Kahng, Bin Li, Li-Shiuan Peh, Kambiz Samadi:
ORION 2.0: A Power-Area Simulator for Interconnection Networks. IEEE Trans. Very Large Scale Integr. Syst. 20(1): 191-196 (2012) - 2010
- [b1]Kambiz Samadi:
Accurate estimators and optimizers for networks-on-chip. University of California, San Diego, USA, 2010 - [j4]Kwangok Jeong, Andrew B. Kahng, Binshan Lin, Kambiz Samadi:
Accurate Machine-Learning-Based On-Chip Router Modeling. IEEE Embed. Syst. Lett. 2(3): 62-66 (2010) - [j3]Luca P. Carloni, Andrew B. Kahng, Sudhakar Muddu, Alessandro Pinto, Kambiz Samadi, Puneet Sharma:
Accurate Predictive Interconnect Modeling for System-Level Design. IEEE Trans. Very Large Scale Integr. Syst. 18(4): 679-684 (2010) - [c8]Andrew B. Kahng, Bill Lin, Kambiz Samadi:
Improved on-chip router analytical power and area modeling. ASP-DAC 2010: 241-246 - [c7]Andrew B. Kahng, Bill Lin, Kambiz Samadi, Rohit Sunkam Ramanujam:
Trace-driven optimization of networks-on-chip configurations. DAC 2010: 437-442 - [c6]Andrew B. Kahng, Bill Lin, Kambiz Samadi, Rohit Sunkam Ramanujam:
Efficient trace-driven metaheuristics for optimization of networks-on-chip configurations. ICCAD 2010: 256-263 - [c5]Chung-Kuan Cheng, Andrew B. Kahng, Kambiz Samadi, Amirali Shayan Arani:
Worst-case performance prediction under supply voltage and temperature variation. SLIP 2010: 91-96
2000 – 2009
- 2009
- [c4]Andrew B. Kahng, Bin Li, Li-Shiuan Peh, Kambiz Samadi:
ORION 2.0: A fast and accurate NoC power and area model for early-stage design space exploration. DATE 2009: 423-428 - 2008
- [j2]Andrew B. Kahng, Kambiz Samadi:
CMP Fill Synthesis: A Survey of Recent Studies. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 27(1): 3-19 (2008) - [c3]Luca P. Carloni, Andrew B. Kahng, Swamy Muddu, Alessandro Pinto, Kambiz Samadi, Puneet Sharma:
Interconnect modeling for improved system-level design optimization. ASP-DAC 2008: 258-264 - [c2]Kwangok Jeong, Andrew B. Kahng, Kambiz Samadi:
Quantified Impacts of Guardband Reduction on Design Process Outcomes. ISQED 2008: 790-797 - [r1]Andrew B. Kahng, Kambiz Samadi:
CMP Fill Synthesis. Handbook of Algorithms for Physical Design Automation 2008 - 2006
- [j1]Puneet Gupta, Andrew B. Kahng, Chul-Hong Park, Kambiz Samadi, Xu Xu:
Wafer Topography-Aware Optical Proximity Correction. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 25(12): 2747-2756 (2006) - [c1]Andrew B. Kahng, Kambiz Samadi, Puneet Sharma:
Study of Floating Fill Impact on Interconnect Capacitance. ISQED 2006: 691-696
Coauthor Index
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