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ORCIDSung Kyu Lim
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- affiliation: Georgia Institute of Technology, Atlanta GA, USA
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2020 – today
- 2025
[j111]Pruek Vanna-Iampikul
, Seungmin Woo, Serhat Erdogan, Lingjun Zhu, Mohanalingam Kathaperumal, Ravi Agarwal, Ram Gupta, Kevin Rinebold, Madhavan Swaminathan, Sung Kyu Lim:
Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 44(5): 1954-1967 (2025)- [j110]Gauthaman Murali, Min Gyu Park, Sung Kyu Lim:
3DNN-Xplorer: A Machine Learning Framework for Design Space Exploration of Heterogeneous 3-D DNN Accelerators. IEEE Trans. Very Large Scale Integr. Syst. 33(2): 358-370 (2025) - [c211]Pruek Vanna-Iampikul, Jun-Sik Yoon, Chaeryung Park, Gary Yeap, Sung Kyu Lim:
Placement-Aware 3D Net-to-Pad Assignment for Array-Style Hybrid Bonding 3D ICs. ISPD 2025: 200-208 - [c210]Zheng Yang, Zhen Zhuang, Bei Yu, Tsung-Yi Ho, Martin D. F. Wong, Sung Kyu Lim:
ML-Based Fine-Grained Modeling of DC Current Crowding in Power Delivery TSVs for Face-to-Face 3D ICs. ISPD 2025: 233-241 - [c209]Amaan Rahman, Hang Yang, Cong Hao, Sung Kyu Lim:
Invited: Modeling and Design Methodology for Backside Integration of Voltage Converters. ISPD 2025: 242-250 - [i7]Xun Jiang, Haoran Lu, Yuxuan Zhao, Jiarui Wang, Zizheng Guo, Heng Wu, Bei Yu, Sung Kyu Lim, Runsheng Wang, Ru Huang, Yibo Lin:
A Systematic Approach for Multi-objective Double-side Clock Tree Synthesis. CoRR abs/2503.12512 (2025) - 2024
- [j109]Sai Pentapati, Kyungwook Chang, Sung Kyu Lim:
Pin-3D: Effective Physical Design Methodology for Multidie Co-Optimization in Monolithic 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 43(4): 1009-1022 (2024) - [j108]Nesara Eranna Bethur, Anthony Agnesina, Moritz Brunion, Alberto García Ortiz, Francky Catthoor, Dragomir Milojevic, Manu Komalan, Matheus A. Cavalcante, Samuel Riedel, Luca Benini, Sung Kyu Lim:
Hier-3D: A Methodology for Physical Hierarchy Exploration of 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 43(7): 1957-1970 (2024) - [j107]Yen-Hsiang Huang, Sai Pentapati, Anthony Agnesina, Moritz Brunion, Sung Kyu Lim:
On Legalization of Die Bonding Bumps and Pads for 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 43(9): 2741-2754 (2024) - [j106]Yi-Chen Lu, Haoxing Ren, Hao-Hsiang Hsiao, Sung Kyu Lim:
GAN-Place: Advancing Open Source Placers to Commercial-quality Using Generative Adversarial Networks and Transfer Learning. ACM Trans. Design Autom. Electr. Syst. 29(2): 32:1-32:17 (2024) - [j105]Jinwoo Kim, Lingjun Zhu, Hakki Mert Torun, Madhavan Swaminathan, Sung Kyu Lim:
A PPA Study for Heterogeneous 3-D IC Options: Monolithic, Hybrid Bonding, and Microbumping. IEEE Trans. Very Large Scale Integr. Syst. 32(3): 401-412 (2024) - [j104]Sai Pentapati, Sung Kyu Lim:
Heterogeneous Monolithic 3-D IC Designs: Challenges, EDA Solutions, and Power, Performance, Cost Tradeoffs. IEEE Trans. Very Large Scale Integr. Syst. 32(3): 413-421 (2024) - [c208]Hao-Hsiang Hsiao, Pruek Vanna-Iampikul, Yi-Chen Lu, Sung Kyu Lim:
ML-based Physical Design Parameter Optimization for 3D ICs: From Parameter Selection to Optimization. DAC 2024: 252:1-252:6 - [c207]Nesara Eranna Bethur, Pruek Vanna-Iampikul, Odysseas Zografos, Lingjun Zhu, Giuliano Sisto, Dragomir Milojevic, Alberto García Ortiz, Geert Hellings, Julien Ryckaert, Francky Catthoor, Sung Kyu Lim:
GNN-assisted Back-side Clock Routing Methodology for Advance Technologies. DAC 2024: 287:1-287:6 - [c206]Aditya Sridharan Iyer, Daehyun Kim, Saibal Mukhopadhyay, Sung Kyu Lim:
Multi-Tier 3D SRAM Module Design: Targeting Bit-Line and Word-Line Folding. ICCAD 2024: 40:1-40:9 - [c205]Seungmin Woo, Pruek Vanna-Iampikul, Sung Kyu Lim:
AI-Driven Evaluation and Optimization of Bump Pitch Effects on Chiplet and Interposer Design Quality. ICCAD 2024: 140:1-140:9 - [c204]Boxun Xu, Junyoung Hwang, Pruek Vanna-Iampikul, Sung Kyu Lim, Peng Li:
Spiking Transformer Hardware Accelerators in 3D Integration. ICCAD 2024: 229:1-229:9 - [c203]Lingjun Zhu, Jiawei Hu, Gauthaman Murali, Sung Kyu Lim:
Hetero-3D: Maximizing Performance and Power Delivery Benefits of Heterogeneous 3D ICs. ISLPED 2024: 1-6 - [c202]Hao-Hsiang Hsiao, Yi-Chen Lu, Pruek Vanna-Iampikul, Sung Kyu Lim:
FastTuner: Transferable Physical Design Parameter Optimization using Fast Reinforcement Learning. ISPD 2024: 93-101 - [c201]Pruek Vanna-Iampikul, Hang Yang, Jungyoun Kwak, Joyce X. Hu, Amaan Rahman, Nesara Eranna Bethur, Callie Hao, Shimeng Yu, Sung Kyu Lim:
Back-side Design Methodology for Power Delivery Network and Clock Routing. VLSI Technology and Circuits 2024: 1-2 - [i6]Boxun Xu, Junyoung Hwang, Pruek Vanna-Iampikul, Sung Kyu Lim, Peng Li:
Spiking Transformer Hardware Accelerators in 3D Integration. CoRR abs/2411.07397 (2024) - [i5]Boxun Xu, Junyoung Hwang, Pruek Vanna-Iampikul, Yuxuan Yin, Sung Kyu Lim, Peng Li:
Towards 3D Acceleration for low-power Mixture-of-Experts and Multi-Head Attention Spiking Transformers. CoRR abs/2412.05540 (2024) - 2023
- [j103]Jeffrey S. Vetter, Prasanna Date, Farah Fahim, Shruti R. Kulkarni, Petro Maksymovych, A. Alec Talin, Marc González Tallada, Pruek Vanna-Iampikul, Aaron R. Young, David Brooks, Yu Cao, Gu-Yeon Wei, Sung Kyu Lim, Frank Liu, Matthew J. Marinella, Bobby G. Sumpter, Narasinga Rao Miniskar:
Abisko: Deep codesign of an architecture for spiking neural networks using novel neuromorphic materials. Int. J. High Perform. Comput. Appl. 37(3-4): 351-379 (2023) - [j102]Anthony Agnesina, Kyungwook Chang, Sung Kyu Lim:
Parameter Optimization of VLSI Placement Through Deep Reinforcement Learning. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 42(4): 1295-1308 (2023) - [j101]Pruek Vanna-Iampikul, Chengjia Shao, Yi-Chen Lu, Sai Pentapati, Yun Heo, Jae-Seung Choi, Sung Kyu Lim:
Snap-3D: A Constrained Placement-Driven Physical Design Methodology for High Performance 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 42(7): 2331-2335 (2023) - [j100]Shao-Chun Hung, Sanmitra Banerjee, Arjun Chaudhuri, Jinwoo Kim, Sung Kyu Lim, Krishnendu Chakrabarty:
Transferable Graph Neural Network-Based Delay-Fault Localization for Monolithic 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 42(11): 4296-4309 (2023) - [j99]Yi-Chen Lu, Siddhartha Nath, Sai Pentapati, Sung Kyu Lim:
ECO-GNN: Signoff Power Prediction Using Graph Neural Networks with Subgraph Approximation. ACM Trans. Design Autom. Electr. Syst. 28(4): 55:1-55:22 (2023) - [j98]Gauthaman Murali, Anthony Agnesina, Sung Kyu Lim:
A PPA Study of Reinforced Placement Parameter Autotuning: Pseudo-3D vs. True-3D Placers. ACM Trans. Design Autom. Electr. Syst. 28(5): 75:1-75:22 (2023) - [j97]Pruek Vanna-Iampikul, Yi-Chen Lu, Da Eun Shim, Sung Kyu Lim:
GNN-based Multi-bit Flip-flop Clustering and Post-clustering Design Optimization for Energy-efficient 3D ICs. ACM Trans. Design Autom. Electr. Syst. 28(5): 76:1-76:26 (2023) - [j96]Arjun Chaudhuri, Sanmitra Banerjee, Jinwoo Kim, Sung Kyu Lim, Krishnendu Chakrabarty:
Built-In Self-Test of High-Density and Realistic ILV Layouts in Monolithic 3-D ICs. IEEE Trans. Very Large Scale Integr. Syst. 31(3): 296-309 (2023) - [j95]Gauthaman Murali, Aditya Iyer, Lingjun Zhu, Jianming Tong, Francisco Muñoz-Martínez, Srivatsa Rangachar Srinivasa, Tanay Karnik, Tushar Krishna, Sung Kyu Lim:
On Continuing DNN Accelerator Architecture Scaling Using Tightly Coupled Compute-on-Memory 3-D ICs. IEEE Trans. Very Large Scale Integr. Syst. 31(10): 1603-1613 (2023) - [c200]Yi-Chen Lu, Wei-Ting Chan, Deyuan Guo, Sudipto Kundu, Vishal Khandelwal, Sung Kyu Lim:
RL-CCD: Concurrent Clock and Data Optimization using Attention-Based Self-Supervised Reinforcement Learning. DAC 2023: 1-6 - [c199]Pruek Vanna-Iampikul, Lingjun Zhu, Serhat Erdogan, Mohanalingam Kathaperumal, Ravi Agarwal, Ram Gupta, Kevin Rinebold, Sung Kyu Lim:
Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits. DAC 2023: 1-6 - [c198]Lingjun Zhu, Sung Kyu Lim:
INVITED: Design Automation Needs for Monolithic 3D ICs: Accomplishments and Gaps. DAC 2023: 1-4 - [c197]Tathagata Srimani, Robert M. Radway, Jinwoo Kim, Kartik Prabhu, Dennis Rich, Carlo Gilardi, Priyanka Raina, Max M. Shulaker, Sung Kyu Lim, Subhasish Mitra:
Ultra-Dense 3D Physical Design Unlocks New Architectural Design Points with Large Benefits. DATE 2023: 1-6 - [c196]Jonti Talukdar, Arjun Chaudhuri, Jinwoo Kim, Sung Kyu Lim, Krishnendu Chakrabarty:
Securing Heterogeneous 2.5D ICs Against IP Theft through Dynamic Interposer Obfuscation. DATE 2023: 1-2 - [c195]Gauthaman Murali, Aditya Iyer, Navneeth Ravichandran, Sung Kyu Lim:
3DNN-Xplorer: A Machine Learning Framework for Design Space Exploration of Heterogeneous 3D DNN Accelerators. ICCAD 2023: 1-9 - [c194]Narasinga Rao Miniskar, Pruek Vanna-Iampikul, Aaron R. Young, Sung Kyu Lim, Frank Liu, Jieun Yoo, Corrinne Mills, Nhan Tran, Farah Fahim, Jeffrey S. Vetter:
A 3D Implementation of Convolutional Neural Network for Fast Inference. ISCAS 2023: 1-5 - [c193]Sandra Maria Shaji, Lingjun Zhu, Jun-Sik Yoon, Sung Kyu Lim:
A Comparative Study on Front-Side, Buried and Back-Side Power Rail Topologies in 3nm Technology Node. ISLPED 2023: 1-6 - [c192]Sai Pentapati, Anthony Agnesina, Moritz Brunion, Yen-Hsiang Huang, Sung Kyu Lim:
On Legalization of Die Bonding Bumps and Pads for 3D ICs. ISPD 2023: 62-70 - [c191]Yi-Chen Lu, Haoxing Ren, Hao-Hsiang Hsiao, Sung Kyu Lim:
DREAM-GAN: Advancing DREAMPlace towards Commercial-Quality using Generative Adversarial Learning. ISPD 2023: 141-148 - 2022
- [j94]Yandong Luo, Sourav Dutta, Ankit Kaul, Sung Kyu Lim, Muhannad S. Bakir, Suman Datta, Shimeng Yu:
A Compute-in-Memory Hardware Accelerator Design With Back-End-of-Line (BEOL) Transistor Based Reconfigurable Interconnect. IEEE J. Emerg. Sel. Topics Circuits Syst. 12(2): 445-457 (2022) - [j93]Edward Lee, Daehyun Kim, Jinwoo Kim, Sung Kyu Lim, Saibal Mukhopadhyay:
A ReRAM Memory Compiler for Monolithic 3D Integrated Circuits in a Carbon Nanotube Process. ACM J. Emerg. Technol. Comput. Syst. 18(1): 20:1-20:20 (2022) - [j92]Lingjun Zhu, Arjun Chaudhuri, Sanmitra Banerjee, Gauthaman Murali, Pruek Vanna-Iampikul, Krishnendu Chakrabarty, Sung Kyu Lim:
Design Automation and Test Solutions for Monolithic 3D ICs. ACM J. Emerg. Technol. Comput. Syst. 18(1): 21:1-21:49 (2022) - [j91]Arjun Chaudhuri, Sanmitra Banerjee, Jinwoo Kim, Heechun Park, Bon Woong Ku, Sukeshwar Kannan, Krishnendu Chakrabarty, Sung Kyu Lim:
Built-in Self-Test and Fault Localization for Inter-Layer Vias in Monolithic 3D ICs. ACM J. Emerg. Technol. Comput. Syst. 18(1): 22:1-22:37 (2022) - [j90]Bon Woong Ku, Catherine D. Schuman, Md Musabbir Adnan, Tiffany M. Mintz, Raphael C. Pooser, Kathleen E. Hamilton, Garrett S. Rose, Sung Kyu Lim:
Unsupervised Digit Recognition Using Cosine Similarity In A Neuromemristive Competitive Learning System. ACM J. Emerg. Technol. Comput. Syst. 18(2): 38:1-38:20 (2022) - [j89]Kyungwook Chang, Saurabh Sinha, Brian Cline, Greg Yeric, Sung Kyu Lim:
Design-Aware Partitioning-Based 3-D IC Design Flow With 2-D Commercial Tools. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41(3): 410-423 (2022) - [j88]Yi-Chen Lu, Jeehyun Lee, Anthony Agnesina, Kambiz Samadi, Sung Kyu Lim:
A Clock Tree Prediction and Optimization Framework Using Generative Adversarial Learning. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41(9): 3104-3117 (2022) - [j87]Yi-Chen Lu, Sai Pentapati, Lingjun Zhu, Gauthaman Murali, Kambiz Samadi, Sung Kyu Lim:
A Machine Learning-Powered Tier Partitioning Methodology for Monolithic 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41(11): 4575-4586 (2022) - [j86]Sai Pentapati, Sung Kyu Lim:
Metal Layer Sharing: A Routing Optimization Technique for Monolithic 3D ICs. IEEE Trans. Very Large Scale Integr. Syst. 30(9): 1355-1367 (2022) - [c190]Matheus A. Cavalcante, Anthony Agnesina, Samuel Riedel, Moritz Brunion, Alberto García-Ortiz, Dragomir Milojevic, Francky Catthoor, Sung Kyu Lim, Luca Benini:
MemPool-3D: Boosting Performance and Efficiency of Shared-L1 Memory Many-Core Clusters with 3D Integration. DATE 2022: 394-399 - [c189]Yi-Chen Lu, Sung Kyu Lim:
On Advancing Physical Design Using Graph Neural Networks. ICCAD 2022: 2:1-2:7 - [c188]Anthony Agnesina, Moritz Brunion, Alberto García Ortiz, Francky Catthoor, Dragomir Milojevic, Manu Komalan, Matheus A. Cavalcante, Samuel Riedel, Luca Benini, Sung Kyu Lim:
Hier-3D: A Hierarchical Physical Design Methodology for Face-to-Face-Bonded 3D ICs. ISLPED 2022: 15:1-15:6 - [c187]Lingjun Zhu, Nesara Eranna Bethur, Yi-Chen Lu, Youngsang Cho, Yunhyeok Im, Sung Kyu Lim:
3D IC Tier Partitioning of Memory Macros: PPA vs. Thermal Tradeoffs. ISLPED 2022: 19:1-19:6 - [c186]Gauthaman Murali, Sandra Maria Shaji, Anthony Agnesina, Guojie Luo, Sung Kyu Lim:
ART-3D: Analytical 3D Placement with Reinforced Parameter Tuning for Monolithic 3D ICs. ISPD 2022: 97-104 - [c185]Sai Pentapati, Sung Kyu Lim:
Routing Layer Sharing: A New Opportunity for Routing Optimization in Monolithic 3D ICs. ISPD 2022: 127-134 - [c184]Yi-Chen Lu, Tian Yang, Sung Kyu Lim, Haoxing Ren:
Placement Optimization via PPA-Directed Graph Clustering. MLCAD 2022: 1-6 - [c183]Yi-Chen Lu, Wei-Ting Chan, Vishal Khandelwal, Sung Kyu Lim:
Driving Early Physical Synthesis Exploration through End-of-Flow Total Power Prediction. MLCAD 2022: 97-102 - 2021
- [j85]Heechun Park, Bon Woong Ku, Kyungwook Chang, Da Eun Shim, Sung Kyu Lim:
Pseudo-3D Physical Design Flow for Monolithic 3D ICs: Comparisons and Enhancements. ACM Trans. Design Autom. Electr. Syst. 26(5): 37:1-37:25 (2021) - [j84]Gauthaman Murali, Xiaoyu Sun, Shimeng Yu, Sung Kyu Lim:
Heterogeneous Mixed-Signal Monolithic 3-D In-Memory Computing Using Resistive RAM. IEEE Trans. Very Large Scale Integr. Syst. 29(2): 386-396 (2021) - [j83]Gauthaman Murali, Heechun Park, Eric Qin, Hakki Mert Torun, Majid Ahadi Dolatsara, Madhavan Swaminathan, Tushar Krishna, Sung Kyu Lim:
Clock Delivery Network Design and Analysis for Interposer-Based 2.5-D Heterogeneous Systems. IEEE Trans. Very Large Scale Integr. Syst. 29(4): 605-616 (2021) - [j82]Lingjun Zhu, Lennart Bamberg, Sai Surya Kiran Pentapati, Kyungwook Chang, Francky Catthoor, Dragomir Milojevic, Manu Komalan, Brian Cline, Saurabh Sinha, Xiaoqing Xu, Alberto García-Ortiz, Sung Kyu Lim:
High-Performance Logic-on-Memory Monolithic 3-D IC Designs for Arm Cortex-A Processors. IEEE Trans. Very Large Scale Integr. Syst. 29(6): 1152-1163 (2021) - [j81]Shao-Chun Hung, Yi-Chen Lu, Sung Kyu Lim, Krishnendu Chakrabarty:
Power Supply Noise-Aware At-Speed Delay Fault Testing of Monolithic 3-D ICs. IEEE Trans. Very Large Scale Integr. Syst. 29(11): 1875-1888 (2021) - [c182]Yi-Chen Lu, Siddhartha Nath, Vishal Khandelwal, Sung Kyu Lim:
RL-Sizer: VLSI Gate Sizing for Timing Optimization using Deep Reinforcement Learning. DAC 2021: 733-738 - [c181]Sai Surya Kiran Pentapati, Sung Kyu Lim:
Heterogeneous Monolithic 3D ICs: EDA Solutions, and Power, Performance, Cost Tradeoffs. DAC 2021: 925-930 - [c180]Jinwoo Kim, Lingjun Zhu, Hakki Mert Torun, Madhavan Swaminathan, Sung Kyu Lim:
Micro-bumping, Hybrid Bonding, or Monolithic? A PPA Study for Heterogeneous 3D IC Options. DAC 2021: 1189-1194 - [c179]Gauthaman Murali, Sung Kyu Lim:
Heterogeneous 3D ICs: Current Status and Future Directions for Physical Design Technologies. DATE 2021: 146-151 - [c178]Bahar Asgari, Ramyad Hadidi, Jiashen Cao, Da Eun Shim, Sung Kyu Lim, Hyesoon Kim:
FAFNIR: Accelerating Sparse Gathering by Using Efficient Near-Memory Intelligent Reduction. HPCA 2021: 908-920 - [c177]Sanmitra Banerjee, Arjun Chaudhuri, Jinwoo Kim, Gauthaman Murali, Mark Nelson, Sung Kyu Lim, Krishnendu Chakrabarty:
ParaMitE: Mitigating Parasitic CNFETs in the Presence of Unetched CNTs. ICCAD 2021: 1-9 - [c176]Johann Knechtel, Jayanth Gopinath, Jitendra Bhandari, Mohammed Ashraf, Hussam Amrouch, Shekhar Borkar, Sung Kyu Lim, Ozgur Sinanoglu, Ramesh Karri:
Security Closure of Physical Layouts ICCAD Special Session Paper. ICCAD 2021: 1-9 - [c175]Yi-Chen Lu, Siddhartha Nath, Vishal Khandelwal, Sung Kyu Lim:
Doomed Run Prediction in Physical Design by Exploiting Sequential Flow and Graph Learning. ICCAD 2021: 1-9 - [c174]Anthony Agnesina, Moritz Brunion, Jinwoo Kim, Alberto García Ortiz, Dragomir Milojevic, Francky Catthoor, Manu Perumkunnil, Sung Kyu Lim:
Power, Performance, Area and Cost Analysis of Memory-on-Logic Face-to-Face Bonded 3D Processor Designs. ISLPED 2021: 1-6 - [c173]Lingjun Zhu, Tuan Ta, Rossana Liu, Rahul Mathur, Xiaoqing Xu, Shidhartha Das, Ankit Kaul, Alejandro Rico, Doug Joseph, Brian Cline, Sung Kyu Lim:
Power Delivery and Thermal-Aware Arm-Based Multi-Tier 3D Architecture. ISLPED 2021: 1-6 - [c172]Yi-Chen Lu, Sai Pentapati, Sung Kyu Lim:
The Law of Attraction: Affinity-Aware Placement Optimization using Graph Neural Networks. ISPD 2021: 7-14 - [c171]Pruek Vanna-Iampikul, Chengjia Shao, Yi-Chen Lu, Sai Pentapati, Sung Kyu Lim:
Snap-3D: A Constrained Placement-Driven Physical Design Methodology for Face-to-Face-Bonded 3D ICs. ISPD 2021: 39-46 - [c170]Sai Surya Kiran Pentapati, Bon Woong Ku, Sung Kyu Lim:
ML-Based Wire RC Prediction in Monolithic 3D ICs with an Application to Full-Chip Optimization. ISPD 2021: 75-82 - [c169]Lingjun Zhu, Sung Kyu Lim:
Physical Design Challenges and Solutions for Emerging Heterogeneous 3D Integration Technologies. ISPD 2021: 127-134 - [c168]Jan Moritz Joseph, Ananda Samajdar, Lingjun Zhu, Rainer Leupers, Sung Kyu Lim, Thilo Pionteck, Tushar Krishna:
Architecture, Dataflow and Physical Design Implications of 3D-ICs for DNN-Accelerators. ISQED 2021: 60-66 - [c167]Brian Crafton, Arijit Raychowdhury, Sung Kyu Lim:
Automatic Generation of Translators for Packet-Based and Emerging Protocols. ISQED 2021: 488-495 - [i4]Matheus A. Cavalcante, Anthony Agnesina, Samuel Riedel, Moritz Brunion, Alberto García-Ortiz, Dragomir Milojevic, Francky Catthoor, Sung Kyu Lim, Luca Benini:
MemPool-3D: Boosting Performance and Efficiency of Shared-L1 Memory Many-Core Clusters with 3D Integration. CoRR abs/2112.01168 (2021) - 2020
- [j80]Lingjun Zhu, Lennart Bamberg, Anthony Agnesina, Francky Catthoor, Dragomir Milojevic, Manu Komalan, Julien Ryckaert, Alberto García-Ortiz, Sung Kyu Lim:
Heterogeneous 3D Integration for a RISC-V System With STT-MRAM. IEEE Comput. Archit. Lett. 19(1): 51-54 (2020) - [j79]Arjun Chaudhuri, Sanmitra Banerjee, Heechun Park, Jinwoo Kim, Gauthaman Murali, Edward Lee, Daehyun Kim, Sung Kyu Lim, Saibal Mukhopadhyay, Krishnendu Chakrabarty:
Advances in Design and Test of Monolithic 3-D ICs. IEEE Des. Test 37(4): 92-100 (2020) - [j78]Bon Woong Ku, Kyungwook Chang, Sung Kyu Lim:
Compact-2D: A Physical Design Methodology to Build Two-Tier Gate-Level 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 39(6): 1151-1164 (2020) - [j77]Anthony Agnesina, Sung Kyu Lim, Etienne Lepercq, Jose Escobedo Del Cid:
Improving FPGA-Based Logic Emulation Systems through Machine Learning. ACM Trans. Design Autom. Electr. Syst. 25(5): 46:1-46:20 (2020) - [j76]Anthony Agnesina, James Yamaguchi, Christian Krutzik, John Carson, Jean Yang-Scharlotta, Sung Kyu Lim:
A COTS-Based Novel 3-D DRAM Memory Cube Architecture for Space Applications. IEEE Trans. Very Large Scale Integr. Syst. 28(9): 2055-2068 (2020) - [j75]Jinwoo Kim, Gauthaman Murali, Heechun Park, Eric Qin, Hyoukjun Kwon, Venkata Chaitanya Krishna Chekuri, Nael Mizanur Rahman, Nihar Dasari, Arvind Singh, Minah Lee, Hakki Mert Torun, Kallol Roy, Madhavan Swaminathan, Saibal Mukhopadhyay, Tushar Krishna, Sung Kyu Lim:
Architecture, Chip, and Package Codesign Flow for Interposer-Based 2.5-D Chiplet Integration Enabling Heterogeneous IP Reuse. IEEE Trans. Very Large Scale Integr. Syst. 28(11): 2424-2437 (2020) - [c166]Shao-Chun Hung, Yi-Chen Lu, Sung Kyu Lim, Krishnendu Chakrabarty:
Power Supply Noise-Aware Scan Test Pattern Reshaping for At-Speed Delay Fault Testing of Monolithic 3D ICs *. ATS 2020: 1-6 - [c165]Yi-Chen Lu, Sai Surya Kiran Pentapati, Lingjun Zhu, Kambiz Samadi, Sung Kyu Lim:
TP-GNN: A Graph Neural Network Framework for Tier Partitioning in Monolithic 3D ICs. DAC 2020: 1-6 - [c164]Lennart Bamberg, Alberto García Ortiz, Lingjun Zhu, Sai Pentapati, Da Eun Shim, Sung Kyu Lim:
Macro-3D: A Physical Design Methodology for Face-to-Face-Stacked Heterogeneous 3D ICs. DATE 2020: 37-42 - [c163]Sai Surya Kiran Pentapati, Kyungwook Chang, Vassilios Gerousis, Rwik Sengupta, Sung Kyu Lim:
Pin-3D: A Physical Synthesis and Post-Layout Optimization Flow for Heterogeneous Monolithic 3D ICs. ICCAD 2020: 4:1-4:9 - [c162]Jinwoo Kim, Gauthaman Murali, Pruek Vanna-Iampikul, Edward Lee, Daehyun Kim, Arjun Chaudhuri, Sanmitra Banerjee, Krishnendu Chakrabarty, Saibal Mukhopadhyay, Sung Kyu Lim:
RTL-to-GDS Design Tools for Monolithic 3D ICs. ICCAD 2020: 126:1-126:8 - [c161]Anthony Agnesina, Kyungwook Chang, Sung Kyu Lim:
VLSI Placement Parameter Optimization using Deep Reinforcement Learning. ICCAD 2020: 144:1-144:9 - [c160]Yi-Chen Lu, Siddhartha Nath, Sai Surya Kiran Pentapati, Sung Kyu Lim:
A Fast Learning-Driven Signoff Power Optimization Framework. ICCAD 2020: 161:1-161:9 - [c159]Jinwoo Kim, Venkata Chaitanya Krishna Chekuri, Nael Mizanur Rahman, Majid Ahadi Dolatsara, Hakki Mert Torun, Madhavan Swaminathan, Saibal Mukhopadhyay, Sung Kyu Lim:
Silicon vs. Organic Interposer: PPA and Reliability Tradeoffs in Heterogeneous 2.5D Chiplet Integration. ICCD 2020: 80-87 - [c158]Anthony Agnesina, Da Eun Shim, James Yamaguchi, Christian Krutzik, John Carson, Dan Nakamura, Sung Kyu Lim:
A Fault-Tolerant and High-Speed Memory Controller Targeting 3D Flash Memory Cubes for Space Applications. ICCD 2020: 425-432 - [c157]Bon Woong Ku, Sung Kyu Lim:
Pin-in-the-middle: an efficient block pin assignment methodology for block-level monolithic 3D ICs. ISLPED 2020: 85-90 - [c156]Lingjun Zhu, Kyungwook Chang, Dusan Petranovic, Saurabh Sinha, Yun Seop Yu, Sung Kyu Lim:
Full-Chip Electro-Thermal Coupling Extraction and Analysis for Face-to-Face Bonded 3D ICs. ISPD 2020: 39-46 - [c155]Heechun Park, Bon Woong Ku, Kyungwook Chang, Da Eun Shim, Sung Kyu Lim:
Pseudo-3D Approaches for Commercial-Grade RTL-to-GDS Tool Flow Targeting Monolithic 3D ICs. ISPD 2020: 47-54 - [c154]Brian Crafton, Samuel Spetalnick, Gauthaman Murali, Tushar Krishna, Sung Kyu Lim, Arijit Raychowdhury:
Breaking Barriers: Maximizing Array Utilization for Compute in-Memory Fabrics. VLSI-SOC 2020: 123-128 - [c153]Brian Crafton, Samuel Spetalnick, Gauthaman Murali, Tushar Krishna, Sung Kyu Lim, Arijit Raychowdhury:
Statistical Array Allocation and Partitioning for Compute In-Memory Fabrics. VLSI-SoC (Selected Papers) 2020: 323-341 - [i3]Fares Elsabbagh, Blaise Tine, Priyadarshini Roshan, Ethan Lyons, Euna Kim, Da Eun Shim, Lingjun Zhu, Sung Kyu Lim, Hyesoon Kim:
Vortex: OpenCL Compatible RISC-V GPGPU. CoRR abs/2002.12151 (2020) - [i2]Brian Crafton, Samuel Spetalnick, Gauthaman Murali, Tushar Krishna, Sung Kyu Lim, Arijit Raychowdhury:
Breaking Barriers: Maximizing Array Utilization for Compute In-Memory Fabrics. CoRR abs/2008.06741 (2020) - [i1]Jan Moritz Joseph, Ananda Samajdar, Lingjun Zhu, Rainer Leupers, Sung Kyu Lim, Thilo Pionteck, Tushar Krishna:
Architecture, Dataflow and Physical Design Implications of 3D-ICs for DNN-Accelerators. CoRR abs/2012.12563 (2020)
2010 – 2019
- 2019
- [j74]Sai Pentapati, Lingjun Zhu, Lennart Bamberg, Da Eun Shim, Alberto García Ortiz, Sung Kyu Lim:
A Logic-on-Memory Processor-System Design With Monolithic 3-D Technology. IEEE Micro 39(6): 38-45 (2019) - [j73]Tianchen Wang, Sandeep Kumar Samal, Sung Kyu Lim, Yiyu Shi:
Entropy Production-Based Full-Chip Fatigue Analysis: From Theory to Mobile Applications. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 38(1): 84-95 (2019) - [j72]Kyungwook Chang, Shidhartha Das, Saurabh Sinha, Brian Cline, Greg Yeric, Sung Kyu Lim:
System-Level Power Delivery Network Analysis and Optimization for Monolithic 3-D ICs. IEEE Trans. Very Large Scale Integr. Syst. 27(4): 888-898 (2019) - [c152]Heechun Park, Kyungwook Chang, Bon Woong Ku, Jinwoo Kim, Edward Lee, Daehyun Kim, Arjun Chaudhuri, Sanmitra Banerjee, Saibal Mukhopadhyay, Krishnendu Chakrabarty, Sung Kyu Lim:
RTL-to-GDS Tool Flow and Design-for-Test Solutions for Monolithic 3D ICs. DAC 2019: 101 - [c151]Jinwoo Kim, Gauthaman Murali, Heechun Park, Eric Qin, Hyoukjun Kwon, Venkata Chaitanya Krishna Chekuri, Nihar Dasari, Arvind Singh, Minah Lee, Hakki Mert Torun, Kallol Roy, Madhavan Swaminathan, Saibal Mukhopadhyay, Tushar Krishna, Sung Kyu Lim:
Architecture, Chip, and Package Co-design Flow for 2.5D IC Design Enabling Heterogeneous IP Reuse. DAC 2019: 178 - [c150]Arjun Chaudhuri, Sanmitra Banerjee, Heechun Park, Bon Woong Ku, Krishnendu Chakrabarty, Sung Kyu Lim:
Built-in Self-Test for Inter-Layer Vias in Monolithic 3D ICs. ETS 2019: 1-6 - [c149]Sai Surya Kiran Pentapati, Da Eun Shim, Sung Kyu Lim:
Logic Monolithic 3D ICs: PPA Benefits and EDA Tools Necessary. ACM Great Lakes Symposium on VLSI 2019: 445-450 - [c148]Anthony Agnesina, Etienne Lepercq, Jose Escobedo, Sung Kyu Lim:
Reducing Compilation Effort in Commercial FPGA Emulation Systems Using Machine Learning. ICCAD 2019: 1-8 - [c147]Yi-Chen Lu, Jeehyun Lee, Anthony Agnesina, Kambiz Samadi, Sung Kyu Lim:
GAN-CTS: A Generative Adversarial Framework for Clock Tree Prediction and Optimization. ICCAD 2019: 1-8 - [c146]Hakki Mert Torun, Huan Yu, Nihar Dasari, Venkata Chaitanya Krishna Chekuri, Arvind Singh, Jinwoo Kim, Sung Kyu Lim, Saibal Mukhopadhyay, Madhavan Swaminathan:
A Spectral Convolutional Net for Co-Optimization of Integrated Voltage Regulators and Embedded Inductors. ICCAD 2019: 1-8 - [c145]Da Eun Shim, Sai Pentapati, Jeehyun Lee, Yun Seop Yu, Sung Kyu Lim:
Tier Partitioning and Flip-flop Relocation Methods for Clock Trees in Monolithic 3D ICs. ISLPED 2019: 1-6 - 2018
- [j71]Kyungwook Chang, Deepak Kadetotad, Yu Cao, Jae-sun Seo, Sung Kyu Lim:
Power, Performance, and Area Benefit of Monolithic 3D ICs for On-Chip Deep Neural Networks Targeting Speech Recognition. ACM J. Emerg. Technol. Comput. Syst. 14(4): 42:1-42:19 (2018) - [c144]Anthony Agnesina, Amanvir Sidana, James Yamaguchi, Christian Krutzik, John Carson, Jean Yang-Scharlotta, Sung Kyu Lim:
A novel 3D DRAM memory cube architecture for space applications. DAC 2018: 24:1-24:6 - [c143]Bon Woong Ku, Yu Liu, Yingyezhe Jin, Sandeep Kumar Samal, Peng Li, Sung Kyu Lim:
Design and architectural co-optimization of monolithic 3D liquid state machine-based neuromorphic processor. DAC 2018: 165:1-165:6 - [c142]Pu Pang, Yixun Zhang, Tianjian Li, Sung Kyu Lim, Quan Chen, Xiaoyao Liang, Li Jiang:
In-growth test for monolithic 3D integrated SRAM. DATE 2018: 569-572 - [c141]Bon Woong Ku, Yu Liu, Yingyezhe Jin, Peng Li, Sung Kyu Lim:
Area-efficient and low-power face-to-face-bonded 3D liquid state machine design. ICCAD 2018: 121 - [c140]Kyungwook Chang, Sai Pentapati, Da Eun Shim, Sung Kyu Lim:
Road to High-Performance 3D ICs: Performance Optimization Methodologies for Monolithic 3D ICs. ISLPED 2018: 33:1-33:6 - [c139]Bon Woong Ku, Kyungwook Chang, Sung Kyu Lim:
Compact-2D: A Physical Design Methodology to Build Commercial-Quality Face-to-Face-Bonded 3D ICs. ISPD 2018: 90-97 - [c138]Md Musabbir Adnan, Sagarvarma Sayyaparaju, Garrett S. Rose, Catherine D. Schuman, Bon Woong Ku, Sung Kyu Lim:
A Twin Memristor Synapse for Spike Timing Dependent Learning in Neuromorphic Systems. SoCC 2018: 37-42 - 2017
- [j70]Sandeep Kumar Samal, Guoqing Chen, Sung Kyu Lim:
Improving Performance under Process and Voltage Variations in Near-Threshold Computing Using 3D ICs. ACM J. Emerg. Technol. Comput. Syst. 13(4): 59:1-59:18 (2017) - [j69]Sung Kyu Lim:
Bringing 3D ICs to Aerospace: Needs for Design Tools and Methodologies. J. Inform. and Commun. Convergence Engineering 15(2) (2017) - [j68]Seung-Ho Ok, Yong-Hwan Lee, Jae Hoon Shim, Sung Kyu Lim, Byungin Moon:
The Impact of 3D Stacking and Technology Scaling on the Power and Area of Stereo Matching Processors. Sensors 17(2): 426 (2017) - [j67]Sandeep Kumar Samal, Kambiz Samadi, Pratyush Kamal, Yang Du, Sung Kyu Lim:
Full Chip Impact Study of Power Delivery Network Designs in Gate-Level Monolithic 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 36(6): 992-1003 (2017) - [j66]Shreepad Panth, Sandeep Kumar Samal, Kambiz Samadi, Yang Du, Sung Kyu Lim:
Tier Degradation of Monolithic 3-D ICs: A Power Performance Study at Different Technology Nodes. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 36(8): 1265-1273 (2017) - [j65]Tiantao Lu, Caleb Serafy, Zhiyuan Yang, Sandeep Kumar Samal, Sung Kyu Lim, Ankur Srivastava:
TSV-Based 3-D ICs: Design Methods and Tools. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 36(10): 1593-1619 (2017) - [j64]Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim:
Shrunk-2-D: A Physical Design Methodology to Build Commercial-Quality Monolithic 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 36(10): 1716-1724 (2017) - [j63]Jaewon Jang, Minho Cheong, Jin-Ho Ahn, Sung Kyu Lim, Sungho Kang:
Chain-Based Approach for Fast Through-Silicon-Via Coupling Delay Estimation. IEEE Trans. Very Large Scale Integr. Syst. 25(3): 1178-1182 (2017) - [j62]Moongon Jung, Taigon Song, Yarui Peng, Sung Kyu Lim:
Design Methodologies for Low-Power 3-D ICs With Advanced Tier Partitioning. IEEE Trans. Very Large Scale Integr. Syst. 25(7): 2109-2117 (2017) - [j61]Kyungwook Chang, Kartik Acharya, Saurabh Sinha, Brian Cline, Greg Yeric, Sung Kyu Lim:
Impact and Design Guideline of Monolithic 3-D IC at the 7-nm Technology Node. IEEE Trans. Very Large Scale Integr. Syst. 25(7): 2118-2129 (2017) - [c137]Kyungwook Chang, Abhishek Koneru, Krishnendu Chakrabarty, Sung Kyu Lim:
Design automation and testing of monolithic 3D ICs: Opportunities, challenges, and solutions: (Invited paper). ICCAD 2017: 805-810 - [c136]Kyungwook Chang, Bon Woong Ku, Saurabh Sinha, Sung Kyu Lim:
Full-chip monolithic 3D IC design and power performance analysis with ASAP7 library: (Invited Paper). ICCAD 2017: 1005-1010 - [c135]Kyungwook Chang, Shidhartha Das, Saurabh Sinha, Brian Cline, Greg Yeric, Sung Kyu Lim:
Frequency and time domain analysis of power delivery network for monolithic 3D ICs. ISLPED 2017: 1-6 - [c134]Kyungwook Chang, Deepak Kadetotad, Yu Cao, Jae-sun Seo, Sung Kyu Lim:
Monolithic 3D IC designs for low-power deep neural networks targeting speech recognition. ISLPED 2017: 1-6 - [c133]Bon Woong Ku, Taigon Song, Arthur Nieuwoudt, Sung Kyu Lim:
Transistor-level monolithic 3D standard cell layout optimization for full-chip static power integrity. ISLPED 2017: 1-6 - [c132]Sandeep Kumar Samal, Sourabh Khandelwal, Asif Islam Khan, Sayeef S. Salahuddin, Chenming Hu, Sung Kyu Lim:
Full chip power benefits with negative capacitance FETs. ISLPED 2017: 1-6 - [c131]Austin Wyer, Md Musabbir Adnan, Bon Woong Ku, Sung Kyu Lim, Catherine D. Schuman, Raphael C. Pooser, Garrett S. Rose:
Evaluating online-learning in memristive neuromorphic circuits. NCS 2017: 5:1-5:8 - 2016
- [j60]Daehyun Kim, Sung Kyu Lim:
Guest Editors' Introduction: Advances in 3-D Integrated Circuits, Systems, and CAD Tools - Part 2. IEEE Des. Test 33(2): 7-8 (2016) - [j59]Lalinthip Tangjittaweechai, Mongkol Ekpanyapong, Thaisiri Watewai, Krit Athikulwongse, Sung Kyu Lim, Adriano Tavares:
Fast bidirectional shortest path on GPU. IEICE Electron. Express 13(6): 20160036 (2016) - [j58]Yun Seop Yu, Sung Kyu Lim:
Device Coupling Effects of Monolithic 3D Inverters. J. Inform. and Commun. Convergence Engineering 14(1) (2016) - [j57]Sandeep Kumar Samal, Guoqing Chen, Sung Kyu Lim:
Machine Learning Based Variation Modeling and Optimization for 3D ICs. J. Inform. and Commun. Convergence Engineering 14(4) (2016) - [j56]Young-Ho Gong, Jae Min Kim, Sung Kyu Lim, Sung Woo Chung:
Exploration of temperature-aware refresh schemes for 3D stacked eDRAM caches. Microprocess. Microsystems 42: 100-112 (2016) - [j55]Hourieh Attarzadeh, Sung Kyu Lim, Trond Ytterdal:
Design and Analysis of a Stochastic Flash Analog-to-Digital Converter in 3D IC technology for integration with ultrasound transducer array. Microelectron. J. 48: 39-49 (2016) - [j54]Sandeep Kumar Samal, Shreepad Panth, Kambiz Samadi, Mehdi Saedi, Yang Du, Sung Kyu Lim:
Adaptive Regression-Based Thermal Modeling and Optimization for Monolithic 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 35(10): 1707-1720 (2016) - [j53]Taigon Song, Shreepad Panth, Yoo-Jin Chae, Sung Kyu Lim:
More Power Reduction With 3-Tier Logic-on-Logic 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 35(12): 2056-2067 (2016) - [j52]Taigon Song, Chang Liu, Yarui Peng, Sung Kyu Lim:
Full-Chip Signal Integrity Analysis and Optimization of 3-D ICs. IEEE Trans. Very Large Scale Integr. Syst. 24(5): 1636-1648 (2016) - [c130]Kyungwook Chang, Saurabh Sinha, Brian Cline, Greg Yeric, Sung Kyu Lim:
Match-making for monolithic 3D IC: finding the right technology node. DAC 2016: 77:1-77:6 - [c129]Bon Woong Ku, Peter Debacker, Dragomir Milojevic, Praveen Raghavan, Sung Kyu Lim:
How much cost reduction justifies the adoption of monolithic 3D ICs at 7nm node? ICCAD 2016: 87 - [c128]Sandeep Kumar Samal, Deepak Nayak, Motoi Ichihashi, Srinivasa Banna, Sung Kyu Lim:
Tier partitioning strategy to mitigate BEOL degradation and cost issues in monolithic 3D ICs. ICCAD 2016: 129 - [c127]Kyungwook Chang, Saurabh Sinha, Brian Cline, Raney Southerland, Michael Doherty, Greg Yeric, Sung Kyu Lim:
Cascade2D: A design-aware partitioning approach to monolithic 3D IC with 2D commercial tools. ICCAD 2016: 130 - [c126]Kwang Min Kim, Saurabh Sinha, Brian Cline, Greg Yeric, Sung Kyu Lim:
Four-tier Monolithic 3D ICs: Tier Partitioning Methodology and Power Benefit Study. ISLPED 2016: 70-75 - [c125]Bon Woong Ku, Peter Debacker, Dragomir Milojevic, Praveen Raghavan, Diederik Verkest, Aaron Thean, Sung Kyu Lim:
Physical Design Solutions to Tackle FEOL/BEOL Degradation in Gate-level Monolithic 3D ICs. ISLPED 2016: 76-81 - [c124]Sandeep Kumar Samal, Deepak Nayak, Motoi Ichihashi, Srinivasa Banna, Sung Kyu Lim:
How to Cope with Slow Transistors in the Top-tier of Monolithic 3D ICs: Design Studies and CAD Solutions. ISLPED 2016: 320-325 - [c123]Kartik Acharya, Kyungwook Chang, Bon Woong Ku, Shreepad Panth, Saurabh Sinha, Brian Cline, Greg Yeric, Sung Kyu Lim:
Monolithic 3D IC design: Power, performance, and area impact at 7nm. ISQED 2016: 41-48 - 2015
- [j51]Dae Hyun Kim, Sung Kyu Lim:
Guest Editors' Introduction: Advances in 3-D Integrated Circuits, Systems, and CAD Tools. IEEE Des. Test 32(4): 6-7 (2015) - [j50]Dae Hyun Kim, Sung Kyu Lim:
Physical Design and CAD Tools for 3-D Integrated Circuits: Challenges and Opportunities. IEEE Des. Test 32(4): 8-22 (2015) - [j49]Taigon Song, Sung Kyu Lim:
Die-to-Die Parasitic Extraction Targeting Face-to-Face Bonded 3D ICs. J. Inform. and Commun. Convergence Engineering 13(3) (2015) - [j48]Taigon Song, Sung Kyu Lim:
Full-Chip Power/Performance Benefits of Carbon Nanotube-Based Circuits. J. Inform. and Commun. Convergence Engineering 13(3) (2015) - [j47]Daehyun Kim, Krit Athikulwongse, Michael B. Healy, Mohammad M. Hossain, Moongon Jung, Ilya Khorosh, Gokul Kumar, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Shreepad Panth, Mohit Pathak, Minzhen Ren, Guanhao Shen, Taigon Song, Dong Hyuk Woo, Xin Zhao, Joungho Kim, Ho Choi, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim:
Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory). IEEE Trans. Computers 64(1): 112-125 (2015) - [j46]Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim:
Placement-Driven Partitioning for Congestion Mitigation in Monolithic 3D IC Designs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 34(4): 540-553 (2015) - [j45]Yarui Peng, Dusan Petranovic, Sung Kyu Lim:
Multi-TSV and E-Field Sharing Aware Full-chip Extraction and Mitigation of TSV-to-Wire Coupling. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 34(12): 1964-1976 (2015) - [j44]Brandon Noia, Shreepad Panth, Krishnendu Chakrabarty, Sung Kyu Lim:
Scan Test of Die Logic in 3-D ICs Using TSV Probing. IEEE Trans. Very Large Scale Integr. Syst. 23(2): 317-330 (2015) - [c122]Neela Lohith Penmetsa, Christos P. Sotiriou, Sung Kyu Lim:
Low Power Monolithic 3D IC Design of Asynchronous AES Core. ASYNC 2015: 93-99 - [c121]Yarui Peng, Bon Woong Ku, Youn-Sik Park, Kwang-Il Park, Seong-Jin Jang, Joo-Sun Choi, Sung Kyu Lim:
Design, packaging, and architectural policy co-optimization for DC power integrity in 3D DRAM. DAC 2015: 91:1-91:6 - [c120]Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim:
Tier-partitioning for power delivery vs cooling tradeoff in 3D VLSI for mobile applications. DAC 2015: 92:1-92:6 - [c119]Yarui Peng, Taigon Song, Dusan Petranovic, Sung Kyu Lim:
Full-chip Inter-die Parasitic Extraction in Face-to-Face-Bonded 3D ICs. ICCAD 2015: 649-655 - [c118]Tianchen Wang, Sandeep Kumar Samal, Sung Kyu Lim, Yiyu Shi:
A Novel Entropy Production Based Full-Chip TSV Fatigue Analysis. ICCAD 2015: 744-751 - [c117]Taigon Song, Shreepad Panth, Yoo-Jin Chae, Sung Kyu Lim:
Three-Tier 3D ICs for More Power Reduction: Strategies in CAD, Design, and Bonding Selection. ICCAD 2015: 752-757 - [c116]Hourieh Attarzadeh, Sung Kyu Lim, Trond Ytterdal:
Stacking integration methodologies in 3D IC for 3D ultrasound image processing application: A stochastic flash ADC design case study. ISCAS 2015: 1266-1269 - [c115]Kyungwook Chang, Kartik Acharya, Saurabh Sinha, Brian Cline, Greg Yeric, Sung Kyu Lim:
Power benefit study of monolithic 3D IC at the 7nm technology node. ISLPED 2015: 201-206 - [c114]Li Jiang, Pu Pang, Naifeng Jing, Sung Kyu Lim, Xiaoyao Liang, Qiang Xu:
On diagnosable and tunable 3D clock network design for lifetime reliability enhancement. ITC 2015: 1-10 - 2014
- [j43]Moongon Jung, Joydeep Mitra, David Z. Pan, Sung Kyu Lim:
TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC. Commun. ACM 57(1): 107-115 (2014) - [j42]Sung Kyu Lim:
Research Needs for TSV-Based 3D IC Architectural Floorplanning. J. Inform. and Commun. Convergence Engineering 12(1): 46-52 (2014) - [j41]Shreepad Panth, Sandeep Kumar Samal, Yun Seop Yu, Sung Kyu Lim:
Design Challenges and Solutions for Ultra-High-Density Monolithic 3D ICs. J. Inform. and Commun. Convergence Engineering 12(3): 186-192 (2014) - [j40]Chang-Chih Chen, Muhammad Bashir, Linda S. Milor, Daehyun Kim, Sung Kyu Lim:
Simulation of system backend dielectric reliability. Microelectron. J. 45(10): 1327-1334 (2014) - [j39]Daehyun Kim, Saibal Mukhopadhyay, Sung Kyu Lim:
TSV-Aware Interconnect Distribution Models for Prediction of Delay and Power Consumption of 3-D Stacked ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 33(9): 1384-1395 (2014) - [j38]Jiwoo Pak, Sung Kyu Lim, David Z. Pan:
Electromigration Study for Multiscale Power/Ground Vias in TSV-Based 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 33(12): 1873-1885 (2014) - [j37]Yarui Peng, Taigon Song, Dusan Petranovic, Sung Kyu Lim:
Silicon Effect-Aware Full-Chip Extraction and Mitigation of TSV-to-TSV Coupling. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 33(12): 1900-1913 (2014) - [j36]Muhammad Muqarrab Bashir, Chang-Chih Chen, Linda Milor, Dae Hyun Kim, Sung Kyu Lim:
Backend Dielectric Reliability Full Chip Simulator. IEEE Trans. Very Large Scale Integr. Syst. 22(8): 1750-1762 (2014) - [j35]Krit Athikulwongse, Mongkol Ekpanyapong, Sung Kyu Lim:
Exploiting Die-to-Die Thermal Coupling in 3-D IC Placement. IEEE Trans. Very Large Scale Integr. Syst. 22(10): 2145-2155 (2014) - [c113]Moongon Jung, Taigon Song, Yang Wan, Yarui Peng, Sung Kyu Lim:
On Enhancing Power Benefits in 3D ICs: Block Folding and Bonding Styles Perspective. DAC 2014: 4:1-4:6 - [c112]Yarui Peng, Dusan Petranovic, Sung Kyu Lim:
Fast and Accurate Full-chip Extraction and Optimization of TSV-to-Wire Coupling. DAC 2014: 28:1-28:6 - [c111]Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim:
Power-Performance Study of Block-Level Monolithic 3D-ICs Considering Inter-Tier Performance Variations. DAC 2014: 62:1-62:6 - [c110]Sandeep Kumar Samal, Shreepad Panth, Kambiz Samadi, Mehdi Saedi, Yang Du, Sung Kyu Lim:
Fast and Accurate Thermal Modeling and Optimization for Monolithic 3D ICs. DAC 2014: 206:1-206:6 - [c109]Young-Joon Lee, Sung Kyu Lim:
On GPU bus power reduction with 3D IC technologies. DATE 2014: 1-6 - [c108]Sandeep Kumar Samal, Kambiz Samadi, Pratyush Kamal, Yang Du, Sung Kyu Lim:
Full chip impact study of power delivery network designs in monolithic 3D ICs. ICCAD 2014: 565-572 - [c107]Shreepad A. Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim:
Design and CAD methodologies for low power gate-level monolithic 3D ICs. ISLPED 2014: 171-176 - [c106]Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim:
Placement-driven partitioning for congestion mitigation in monolithic 3D IC designs. ISPD 2014: 47-54 - 2013
- [j34]Krit Athikulwongse, Jae-Seok Yang, David Z. Pan, Sung Kyu Lim:
Impact of Mechanical Stress on the Full Chip Timing for Through-Silicon-Via-based 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 32(6): 905-917 (2013) - [j33]Moongon Jung, David Z. Pan, Sung Kyu Lim:
Chip/Package Mechanical Stress Impact on 3-D IC Reliability and Mobility Variations. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 32(11): 1694-1707 (2013) - [j32]Sai Manoj Pudukotai Dinakarrao, Hao Yu, Yang Shang, Chuan Seng Tan, Sung Kyu Lim:
Reliable 3-D Clock-Tree Synthesis Considering Nonlinear Capacitive TSV Model With Electrical-Thermal-Mechanical Coupling. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 32(11): 1734-1747 (2013) - [j31]Young-Joon Lee, Sung Kyu Lim:
Ultrahigh Density Logic Designs Using Monolithic 3-D Integration. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 32(12): 1892-1905 (2013) - [j30]Dae Hyun Kim, Krit Athikulwongse, Sung Kyu Lim:
Study of Through-Silicon-Via Impact on the 3-D Stacked IC Layout. IEEE Trans. Very Large Scale Integr. Syst. 21(5): 862-874 (2013) - [j29]Junghee Lee, Chrysostomos Nicopoulos, Hyung Gyu Lee, Shreepad Panth, Sung Kyu Lim, Jongman Kim:
IsoNet: Hardware-Based Job Queue Management for Many-Core Architectures. IEEE Trans. Very Large Scale Integr. Syst. 21(6): 1080-1093 (2013) - [c105]Shreepad Panth, Kambiz Samadi, Sung Kyu Lim:
Test-TSV estimation during 3D-IC partitioning. 3DIC 2013: 1-7 - [c104]Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim:
High-density integration of functional modules using monolithic 3D-IC technology. ASP-DAC 2013: 681-686 - [c103]Krit Athikulwongse, Dae Hyun Kim, Moongon Jung, Sung Kyu Lim:
Block-level designs of die-to-wafer bonded 3D ICs and their design quality tradeoffs. ASP-DAC 2013: 687-692 - [c102]Yang Shang, Chun Zhang, Hao Yu, Chuan Seng Tan, Xin Zhao, Sung Kyu Lim:
Thermal-reliable 3D clock-tree synthesis considering nonlinear electrical-thermal-coupled TSV model. ASP-DAC 2013: 693-698 - [c101]Moongon Jung, Taigon Song, Yang Wan, Young-Joon Lee, Debabrata Mohapatra, Hong Wang, Greg Taylor, Devang Jariwala, Vijay Pitchumani, Patrick Morrow, Clair Webb, Paul Fischer, Sung Kyu Lim:
How to reduce power in 3D IC designs: A case study with OpenSPARC T2 core. CICC 2013: 1-4 - [c100]Young-Joon Lee, Daniel B. Limbrick, Sung Kyu Lim:
Power benefit study for ultra-high density transistor-level monolithic 3D ICs. DAC 2013: 104:1-104:10 - [c99]Taigon Song, Chang Liu, Yarui Peng, Sung Kyu Lim:
Full-chip multiple TSV-to-TSV coupling extraction and optimization in 3D ICs. DAC 2013: 180:1-180:7 - [c98]Yarui Peng, Taigon Song, Dusan Petranovic, Sung Kyu Lim:
On accurate full-chip extraction and optimization of TSV-to-TSV coupling elements in 3D ICs. ICCAD 2013: 281-288 - [c97]Xin Zhao, Yang Wan, Michael Scheuermann, Sung Kyu Lim:
Transient modeling of TSV-wire electromigration and lifetime analysis of power distribution network for 3D ICs. ICCAD 2013: 363-370 - [c96]Chun Zhang, Moongon Jung, Sung Kyu Lim, Yiyu Shi:
Novel crack sensor for TSV-based 3D integrated circuits: design and deployment perspectives. ICCAD 2013: 371-378 - [c95]Jiwoo Pak, Sung Kyu Lim, David Z. Pan:
Electromigration study for multi-scale power/ground vias in TSV-based 3D ICs. ICCAD 2013: 379-386 - [c94]Seung-Ho Ok, Kyeong-Ryeol Bae, Sung Kyu Lim, Byungin Moon:
Design and analysis of 3D IC-based low power stereo matching processors. ISLPED 2013: 15-20 - [c93]Sandeep Kumar Samal, Yarui Peng, Yang Zhang, Sung Kyu Lim:
Design and analysis of ultra low power processors using sub/near-threshold 3D stacked ICs. ISLPED 2013: 21-26 - 2012
- [j28]Dae Hyun Kim, Sung Kyu Lim:
Design Quality Trade-Off Studies for 3-D ICs Built With Sub-Micron TSVs and Future Devices. IEEE J. Emerg. Sel. Topics Circuits Syst. 2(2): 240-248 (2012) - [j27]Chang-Chih Chen, Fahad Ahmed, Dae Hyun Kim, Sung Kyu Lim, Linda Milor:
Backend dielectric reliability simulator for microprocessor system. Microelectron. Reliab. 52(9-10): 1953-1959 (2012) - [j26]Moongon Jung, Joydeep Mitra, David Z. Pan, Sung Kyu Lim:
TSV Stress-Aware Full-Chip Mechanical Reliability Analysis and Optimization for 3-D IC. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 31(8): 1194-1207 (2012) - [j25]Xin Zhao, Jeremy R. Tolbert, Saibal Mukhopadhyay, Sung Kyu Lim:
Variation-Aware Clock Network Design Methodology for Ultralow Voltage (ULV) Circuits. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 31(8): 1222-1234 (2012) - [j24]Michael B. Healy, Sung Kyu Lim:
Distributed TSV Topology for 3-D Power-Supply Networks. IEEE Trans. Very Large Scale Integr. Syst. 20(11): 2066-2079 (2012) - [c92]Dae Hyun Kim, Rasit Onur Topaloglu, Sung Kyu Lim:
Block-level 3D IC design with through-silicon-via planning. ASP-DAC 2012: 335-340 - [c91]Xin Zhao, Sung Kyu Lim:
Through-silicon-via-induced obstacle-aware clock tree synthesis for 3D ICs. ASP-DAC 2012: 347-352 - [c90]David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Moongon Jung, Joydeep Mitra, Jiwoo Pak, Mohit Pathak, Jae-Seok Yang:
Design for manufacturability and reliability for TSV-based 3D ICs. ASP-DAC 2012: 750-755 - [c89]Sergej Deutsch, Krishnendu Chakrabarty, Shreepad Panth, Sung Kyu Lim:
TSV Stress-Aware ATPG for 3D Stacked ICs. Asian Test Symposium 2012: 31-36 - [c88]Young-Joon Lee, Inki Hong, Sung Kyu Lim:
Slew-aware buffer insertion for through-silicon-via-based 3D ICs. CICC 2012: 1-8 - [c87]Xin Zhao, Michael Scheuermann, Sung Kyu Lim:
Analysis of DC current crowding in through-silicon-vias and its impact on power integrity in 3D ICs. DAC 2012: 157-162 - [c86]Moongon Jung, David Z. Pan, Sung Kyu Lim:
Chip/package co-analysis of thermo-mechanical stress and reliability in TSV-based 3D ICs. DAC 2012: 317-326 - [c85]Krit Athikulwongse, Mohit Pathak, Sung Kyu Lim:
Exploiting die-to-die thermal coupling in 3D IC placement. DAC 2012: 741-746 - [c84]Jiwoo Pak, Sung Kyu Lim, David Z. Pan:
Electromigration-aware routing for 3D ICs with stress-aware EM modeling. ICCAD 2012: 325-332 - [c83]Young-Joon Lee, Patrick Morrow, Sung Kyu Lim:
Ultra high density logic designs using transistor-level monolithic 3D integration. ICCAD 2012: 539-546 - [c82]Xin Zhao, Sung Kyu Lim:
TSV array utilization in low-power 3D clock network design. ISLPED 2012: 21-26 - [c81]Young-Joon Lee, Sung Kyu Lim:
Fast delay estimation with buffer insertion for through-silicon-via-based 3D interconnects. ISQED 2012: 228-335 - [c80]Chang Liu, Sung Kyu Lim:
A design tradeoff study with monolithic 3D integration. ISQED 2012: 529-536 - [c79]Kaiyuan Yang, Dae Hyun Kim, Sung Kyu Lim:
Design quality tradeoff studies for 3D ICs built with nano-scale TSVs and devices. ISQED 2012: 740-746 - [c78]Dae Hyun Kim, Krit Athikulwongse, Michael B. Healy, Mohammad M. Hossain, Moongon Jung, Ilya Khorosh, Gokul Kumar, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Shreepad Panth, Mohit Pathak, Minzhen Ren, Guanhao Shen, Taigon Song, Dong Hyuk Woo, Xin Zhao, Joungho Kim, Ho Choi, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim:
3D-MAPS: 3D Massively parallel processor with stacked memory. ISSCC 2012: 188-190 - [c77]Brandon Noia, Shreepad Panth, Krishnendu Chakrabarty, Sung Kyu Lim:
Scan test of die logic in 3D ICs using TSV probing. ITC 2012: 1-8 - [c76]Shreepad Panth, Sung Kyu Lim:
Transition delay fault testing of 3D ICs with IR-drop study. VTS 2012: 270-275 - 2011
- [j23]Muhammad Bashir, Linda Milor, Dae Hyun Kim, Sung Kyu Lim:
Impact of irregular geometries on low-k dielectric breakdown. Microelectron. Reliab. 51(9-11): 1582-1586 (2011) - [j22]Xin Zhao, Dean L. Lewis, Hsien-Hsin S. Lee, Sung Kyu Lim:
Low-Power Clock Tree Design for Pre-Bond Testing of 3-D Stacked ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 30(5): 732-745 (2011) - [j21]Jeremy R. Tolbert, Xin Zhao, Sung Kyu Lim, Saibal Mukhopadhyay:
Analysis and Design of Energy and Slew Aware Subthreshold Clock Systems. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 30(9): 1349-1358 (2011) - [j20]Young-Joon Lee, Sung Kyu Lim:
Co-Optimization and Analysis of Signal, Power, and Thermal Interconnects in 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 30(11): 1635-1648 (2011) - [j19]Michael B. Healy, Fayez Mohamood, Hsien-Hsin S. Lee, Sung Kyu Lim:
Integrated microarchitectural floorplanning and run-time controller for inductive noise mitigation. ACM Trans. Design Autom. Electr. Syst. 16(4): 46:1-46:25 (2011) - [c75]Jae-Seok Yang, Jiwoo Pak, Xin Zhao, Sung Kyu Lim, David Z. Pan:
Robust Clock Tree Synthesis with timing yield optimization for 3D-ICs. ASP-DAC 2011: 621-626 - [c74]Moongon Jung, Joydeep Mitra, David Z. Pan, Sung Kyu Lim:
TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC. DAC 2011: 188-193 - [c73]Chang Liu, Taigon Song, Jonghyun Cho, Joohee Kim, Joungho Kim, Sung Kyu Lim:
Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC. DAC 2011: 783-788 - [c72]Michael B. Healy, Sung Kyu Lim:
A novel TSV topology for many-tier 3D power-delivery networks. DATE 2011: 261-264 - [c71]Mohit Pathak, Jiwoo Pak, David Z. Pan, Sung Kyu Lim:
Electromigration modeling and full-chip reliability analysis for BEOL interconnect in TSV-based 3D ICs. ICCAD 2011: 555-562 - [c70]Moongon Jung, Xi Liu, Suresh K. Sitaraman, David Z. Pan, Sung Kyu Lim:
Full-chip through-silicon-via interfacial crack analysis and optimization for 3D IC. ICCAD 2011: 563-570 - [c69]Dean L. Lewis, Shreepad Panth, Xin Zhao, Sung Kyu Lim, Hsien-Hsin S. Lee:
Designing 3D test wrappers for pre-bond and post-bond test of 3D embedded cores. ICCD 2011: 90-95 - [c68]Xin Zhao, Jeremy R. Tolbert, Chang Liu, Saibal Mukhopadhyay, Sung Kyu Lim:
Variation-aware clock network design methodology for ultra-low voltage (ULV) circuits. ISLPED 2011: 9-14 - [c67]Dae Hyun Kim, Rasit Onur Topaloglu, Sung Kyu Lim:
TSV density-driven global placement for 3D stacked ICs. ISOCC 2011: 135-138 - [c66]Chang Liu, Taigon Song, Sung Kyu Lim:
Signal integrity analysis and optimization for 3D ICs. ISQED 2011: 42-49 - [c65]Taigon Song, Chang Liu, Dae Hyun Kim, Sung Kyu Lim, Jonghyun Cho, Joohee Kim, Junso Pak, Seungyoung Ahn, Joungho Kim, Kihyun Yoon:
Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs. ISQED 2011: 122-128 - [c64]Michael B. Healy, Sung Kyu Lim:
Power-supply-network design in 3D integrated systems. ISQED 2011: 223-228 - [c63]Daehyun Kim, Suyoun Kim, Sung Kyu Lim:
Impact of nano-scale through-silicon vias on the quality of today and future 3D IC designs. SLIP 2011: 1-8 - [c62]Shreepad Panth, Sung Kyu Lim:
Scan chain and power delivery network synthesis for pre-bond test of 3D ICs. VTS 2011: 26-31 - 2010
- [j18]Jae Sub Oh, Kwang Il Choi, Young Su Kim, Min Ho Kang, Myeong Ho Song, Sung Kyu Lim, Dong Eun Yoo, Jeong Gyu Park, Hi Deok Lee, Ga Won Lee:
SONOS-Type Flash Memory with HfO2 Thinner than 4 nm as Trapping Layer Using Atomic Layer Deposition. IEICE Trans. Electron. 93-C(5): 590-595 (2010) - [j17]Muhammad Bashir, Linda S. Milor, Dae Hyun Kim, Sung Kyu Lim:
Methodology to determine the impact of linewidth variation on chip scale copper/low-k backend dielectric breakdown. Microelectron. Reliab. 50(9-11): 1341-1346 (2010) - [c61]Moongon Jung, Sung Kyu Lim:
A study of IR-drop noise issues in 3D ICs with through-silicon-vias. 3DIC 2010: 1-7 - [c60]Young-Joon Lee, Sung Kyu Lim:
Timing analysis and optimization for 3D stacked multi-core microprocessors. 3DIC 2010: 1-7 - [c59]Xin Zhao, Sung Kyu Lim:
Power and slew-aware clock network design for through-silicon-via (TSV) based 3D ICs. ASP-DAC 2010: 175-180 - [c58]Krit Athikulwongse, Xin Zhao, Sung Kyu Lim:
Buffered clock tree sizing for skew minimization under power and thermal budgets. ASP-DAC 2010: 474-479 - [c57]Michael B. Healy, Krit Athikulwongse, Rohan Goel, Mohammad M. Hossain, Dae Hyun Kim, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Moongon Jung, Brian Ouellette, Mohit Pathak, Hemant Sane, Guanhao Shen, Dong Hyuk Woo, Xin Zhao, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim:
Design and analysis of 3D-MAPS: A many-core 3D processor with stacked memory. CICC 2010: 1-4 - [c56]Jae-Seok Yang, Krit Athikulwongse, Young-Joon Lee, Sung Kyu Lim, David Z. Pan:
TSV stress aware timing analysis with applications to 3D-IC layout optimization. DAC 2010: 803-806 - [c55]Mohit Pathak, Young-Joon Lee, Thomas Moon, Sung Kyu Lim:
Through-silicon-via management during 3D physical design: When to add and how many? ICCAD 2010: 387-394 - [c54]Krit Athikulwongse, Ashutosh Chakraborty, Jae-Seok Yang, David Z. Pan, Sung Kyu Lim:
Stress-driven 3D-IC placement with TSV keep-out zone and regularity study. ICCAD 2010: 669-674 - [c53]Minki Cho, Chang Liu, Dae Hyun Kim, Sung Kyu Lim, Saibal Mukhopadhyay:
Design method and test structure to characterize and repair TSV defect induced signal degradation in 3D system. ICCAD 2010: 694-697 - [c52]Daehyun Kim, Sung Kyu Lim:
Through-silicon-via-aware delay and power prediction model for buffered interconnects in 3D ICs. SLIP 2010: 25-32
2000 – 2009
- 2009
- [j16]Mohit Pathak, Sung Kyu Lim:
Performance and Thermal-Aware Steiner Routing for 3-D Stacked ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 28(9): 1373-1386 (2009) - [j15]I. Faik Baskaya, David V. Anderson, Sung Kyu Lim:
Net-Sensitivity-Based Optimization of Large-Scale Field-Programmable Analog Array (FPAA) Placement and Routing. IEEE Trans. Circuits Syst. II Express Briefs 56-II(7): 565-569 (2009) - [c51]Michael B. Healy, Hsien-Hsin S. Lee, Gabriel H. Loh, Sung Kyu Lim:
Thermal optimization in multi-granularity multi-core floorplanning. ASP-DAC 2009: 43-48 - [c50]Young-Joon Lee, Yoon Jo Kim, Gang Huang, Muhannad S. Bakir, Yogendra K. Joshi, Andrei G. Fedorov, Sung Kyu Lim:
Co-design of signal, power, and thermal distribution networks for 3D ICs. DATE 2009: 610-615 - [c49]Ye Tao, Sung Kyu Lim:
Decoupling capacitor planning with analytical delay model on RLC power grid. DATE 2009: 839-844 - [c48]Faik Baskaya, David V. Anderson, Paul E. Hasler, Sung Kyu Lim:
A generic reconfigurable array specification and programming environment (GRASPER). ECCTD 2009: 619-622 - [c47]Xin Zhao, Dean L. Lewis, Hsien-Hsin S. Lee, Sung Kyu Lim:
Pre-bond testable low-power clock tree design for 3D stacked ICs. ICCAD 2009: 184-190 - [c46]Young-Joon Lee, Rohan Goel, Sung Kyu Lim:
Multi-functional interconnect co-optimization for fast and reliable 3D stacked ICs. ICCAD 2009: 645-651 - [c45]Dae Hyun Kim, Krit Athikulwongse, Sung Kyu Lim:
A study of Through-Silicon-Via impact on the 3D stacked IC layout. ICCAD 2009: 674-680 - [c44]Jeremy R. Tolbert, Xin Zhao, Sung Kyu Lim, Saibal Mukhopadhyay:
Slew-aware clock tree design for reliable subthreshold circuits. ISLPED 2009: 15-20 - [c43]Dae Hyun Kim, Saibal Mukhopadhyay, Sung Kyu Lim:
Through-silicon-via aware interconnect prediction and optimization for 3D stacked ICs. SLIP 2009: 85-92 - 2008
- [c42]Dae Hyun Kim, Sung Kyu Lim:
Bus-aware microarchitectural floorplanning. ASP-DAC 2008: 204-208 - [c41]Jacob R. Minz, Xin Zhao, Sung Kyu Lim:
Buffered clock tree synthesis for 3D ICs under thermal variations. ASP-DAC 2008: 504-509 - [c40]Michael B. Healy, Fayez Mohamood, Hsien-Hsin S. Lee, Sung Kyu Lim:
A unified methodology for power supply noise reduction in modern microarchitecture design. ASP-DAC 2008: 611-616 - [c39]Dae Hyun Kim, Sung Kyu Lim:
Global bus route optimization with application to microarchitectural design exploration. ICCD 2008: 658-663 - 2007
- [j14]Michael B. Healy, Mario Vittes, Mongkol Ekpanyapong, Chinnakrishnan S. Ballapuram, Sung Kyu Lim, Hsien-Hsin S. Lee, Gabriel H. Loh:
Multiobjective Microarchitectural Floorplanning for 2-D and 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 26(1): 38-52 (2007) - [j13]Eric Wong, Jacob R. Minz, Sung Kyu Lim:
Decoupling-Capacitor Planning and Sizing for Noise and Leakage Reduction. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 26(11): 2023-2034 (2007) - [j12]Sung Kyu Lim, Massoud Pedram:
Introduction to special issue on demonstrable software systems and hardware platforms. ACM Trans. Design Autom. Electr. Syst. 12(3): 20:1-20:3 (2007) - [c38]Mongkol Ekpanyapong, Xin Zhao, Sung Kyu Lim:
An Efficient Computation of Statistically Critical Sequential Paths Under Retiming. ASP-DAC 2007: 547-552 - [c37]Fayez Mohamood, Michael B. Healy, Sung Kyu Lim, Hsien-Hsin S. Lee:
Noise-Direct: A Technique for Power Supply Noise Aware Floorplanning Using Microarchitecture Profiling. ASP-DAC 2007: 786-791 - [c36]I. Faik Baskaya, Brian Gestner, Christopher M. Twigg, Sung Kyu Lim, David V. Anderson, Paul E. Hasler:
Rapid Prototyping of Large-scale Analog Circuits With Field Programmable Analog Array. FCCM 2007: 319-320 - [c35]Mohit Pathak, Sung Kyu Lim:
Thermal-aware Steiner routing for 3D stacked ICs. ICCAD 2007: 205-211 - [c34]Eric Wong, Sung Kyu Lim:
Whitespace redistribution for thermal via insertion in 3D stacked ICs. ICCD 2007: 267-272 - [c33]Mohit Pathak, Souvik Mukherjee, Madhavan Swaminathan, Ege Engin, Sung Kyu Lim:
Placement and routing of RF embedded passive designs in LCP substrate. ICCD 2007: 273-279 - 2006
- [j11]Peter G. Sassone, Sung Kyu Lim:
Traffic: a novel geometric algorithm for fast wire-optimized floorplanning. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 25(6): 1075-1086 (2006) - [j10]Mongkol Ekpanyapong, Jacob R. Minz, Thaisiri Watewai, Hsien-Hsin S. Lee, Sung Kyu Lim:
Profile-guided microarchitectural floor planning for deep submicron processor design. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 25(7): 1289-1300 (2006) - [j9]Jacob R. Minz, Sung Kyu Lim:
Block-level 3-D Global Routing With an Application to 3-D Packaging. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 25(10): 2248-2257 (2006) - [j8]Mongkol Ekpanyapong, Michael B. Healy, Sung Kyu Lim:
Profile-Driven Instruction Mapping for Dataflow Architectures. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 25(12): 3017-3025 (2006) - [j7]Eric Wong, Jacob R. Minz, Sung Kyu Lim:
Multi-Objective Module Placement For 3-D System-On-Package. IEEE Trans. Very Large Scale Integr. Syst. 14(5): 553-557 (2006) - [j6]I. Faik Baskaya, Sasank Reddy, Sung Kyu Lim, David V. Anderson:
Placement for large-scale floating-gate field-programable analog arrays. IEEE Trans. Very Large Scale Integr. Syst. 14(8): 906-910 (2006) - [c32]Mongkol Ekpanyapong, Thaisiri Watewai, Sung Kyu Lim:
Statistical Bellman-Ford algorithm with an application to retiming. ASP-DAC 2006: 959-964 - [c31]Jacob R. Minz, Somaskanda Thyagaraja, Sung Kyu Lim:
Optical routing for 3D system-on-package. DATE 2006: 337-338 - [c30]Eric Wong, Sung Kyu Lim:
3D floorplanning with thermal vias. DATE 2006: 878-883 - [c29]Michael B. Healy, Mario Vittes, Mongkol Ekpanyapong, Chinnakrishnan S. Ballapuram, Sung Kyu Lim, Hsien-Hsin S. Lee, Gabriel H. Loh:
Microarchitectural floorplanning under performance and thermal tradeoff. DATE 2006: 1288-1293 - [c28]Eric Wong, Jacob R. Minz, Sung Kyu Lim:
Decoupling capacitor planning and sizing for noise and leakage reduction. ICCAD 2006: 395-400 - [c27]Mongkol Ekpanyapong, Sung Kyu Lim:
Integrated retiming and simultaneous Vdd/Vth scaling for total power minimization. ISPD 2006: 142-148 - [c26]Fayez Mohamood, Michael B. Healy, Sung Kyu Lim, Hsien-Hsin S. Lee:
A Floorplan-Aware Dynamic Inductive Noise Controller for Reliable Processor Design. MICRO 2006: 3-14 - 2005
- [j5]Sung Kyu Lim:
Physical Design for 3D System on Package. IEEE Des. Test Comput. 22(6): 532-539 (2005) - [j4]Ramprasad Ravichandran, Sung Kyu Lim, Michael T. Niemier:
Automatic cell placement for quantum-dot cellular automata. Integr. 38(3): 541-548 (2005) - [j3]Sung Kyu Lim, Ramprasad Ravichandran, Michael T. Niemier:
Partitioning and placement for buildable QCA circuits. ACM J. Emerg. Technol. Comput. Syst. 1(1): 50-72 (2005) - [c25]Ramprasad Ravichandran, Michael T. Niemier, Sung Kyu Lim:
Partitioning and placement for buildable QCA circuits. ASP-DAC 2005: 424-427 - [c24]Mongkol Ekpanyapong, Michael B. Healy, Sung Kyu Lim:
Placement for configurable dataflow architecture. ASP-DAC 2005: 1127-1130 - [c23]Karthik Balakrishnan, Vidit Nanda, Siddharth Easwar, Sung Kyu Lim:
Wire congestion and thermal aware 3D global placement. ASP-DAC 2005: 1131-1134 - [c22]Michael B. Healy, Mongkol Ekpanyapong, Sung Kyu Lim:
MILP-based Placement and Routing for Dataflow Architecture. FPL 2005: 71-76 - [c21]I. Faik Baskaya, Sasank Reddy, Sung Kyu Lim, David V. Anderson:
Hierarchical Placement for Large-scale FPAA. FPL 2005: 421-426 - [c20]Brian Stephen Smith, Sung Kyu Lim:
QCA channel routing with wire crossing minimization. ACM Great Lakes Symposium on VLSI 2005: 217-220 - [c19]Jacob R. Minz, Sung Kyu Lim, Cheng-Kok Koh:
3D module placement for congestion and power noise reduction. ACM Great Lakes Symposium on VLSI 2005: 458-461 - [c18]Mongkol Ekpanyapong, Chinnakrishnan S. Ballapuram, Sung Kyu Lim, Hsien-Hsin S. Lee:
Wire-driven microarchitectural design space exploration. ISCAS (2) 2005: 1867-1870 - [c17]I. Faik Baskaya, Sasank Reddy, Sung Kyu Lim, Tyson S. Hall, David V. Anderson:
Mapping algorithm for large-scale field programmable analog array. ISPD 2005: 152-158 - [c16]Jacob R. Minz, Eric Wong, Sung Kyu Lim:
Reliability-aware floorplanning for 3D circuits. SoCC 2005: 81-82 - 2004
- [j2]Jason Cong, Sung Kyu Lim:
Edge separability-based circuit clustering with application to multilevel circuit partitioning. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 23(3): 346-357 (2004) - [j1]Jason Cong, Sung Kyu Lim:
Retiming-based timing analysis with an application to mincut-based global placement. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 23(12): 1684-1692 (2004) - [c15]Jacob R. Minz, Sung Kyu Lim:
Layer assignment for reliable system-on-package. ASP-DAC 2004: 31-37 - [c14]Mongkol Ekpanyapong, Sung Kyu Lim:
Performance-driven global placement via adaptive network characterization. ASP-DAC 2004: 137-142 - [c13]Mongkol Ekpanyapong, Jacob R. Minz, Thaisiri Watewai, Hsien-Hsin S. Lee, Sung Kyu Lim:
Profile-guided microarchitectural floorplanning for deep submicron processor design. DAC 2004: 634-639 - [c12]Jacob R. Minz, Mohit Pathak, Sung Kyu Lim:
Net and Pin Distribution for 3D Package Global Routing. DATE 2004: 1410-1411 - [c11]Ramprasad Ravichandran, Nihal Ladiwala, Jean Nguyen, Michael T. Niemier, Sung Kyu Lim:
Automatic cell placement for quantum-dot cellular automata. ACM Great Lakes Symposium on VLSI 2004: 332-337 - [c10]Mongkol Ekpanyapong, Karthik Balakrishnan, Vidit Nanda, Sung Kyu Lim:
Simultaneous delay and power optimization in global placement. ISCAS (5) 2004: 57-60 - [c9]Pun Hang Shiu, Ramprasad Ravichandran, Siddharth Easwar, Sung Kyu Lim:
Multi-layer floorplanning for reliable system-on-package. ISCAS (5) 2004: 69-72 - 2003
- [c8]Peter G. Sassone, Sung Kyu Lim:
A Novel Geometric Algorithm for Fast Wire-Optimized Floorplanning. ICCAD 2003: 74-80 - 2000
- [c7]Jason Cong, Sung Kyu Lim:
Edge separability based circuit clustering with application to circuit partitioning. ASP-DAC 2000: 429-434 - [c6]Jason Cong, Sung Kyu Lim:
Performance driven multiway partitioning. ASP-DAC 2000: 441-446 - [c5]Maogang Wang, Sung Kyu Lim, Jason Cong, Majid Sarrafzadeh:
Multi-way partitioning using bi-partition heuristics. ASP-DAC 2000: 667-672 - [c4]Jason Cong, Sung Kyu Lim, Chang Wu:
Performance driven multi-level and multiway partitioning with retiming. DAC 2000: 274-279 - [c3]Jason Cong, Sung Kyu Lim:
Physical Planning with Retiming. ICCAD 2000: 2-7
1990 – 1999
- 1998
- [c2]Jason Cong, Sung Kyu Lim:
Multiway partitioning with pairwise movement. ICCAD 1998: 512-516 - 1997
- [c1]Jason Cong, Honching Peter Li, Sung Kyu Lim, Toshiyuki Shibuya, Dongmin Xu:
Large scale circuit partitioning with loose/stable net removal and signal flow based clustering. ICCAD 1997: 441-446
Coauthor Index
Venakata Chaitanya Krishna Chekuri
aka: Venkata Chaitanya Krishna Chekuri
aka: Venkata Chaitanya Krishna Chekuri
Alberto García Ortiz
aka: Alberto García-Ortiz
aka: Alberto García-Ortiz
Shreepad Panth
aka: Shreepad A. Panth
aka: Shreepad A. Panth
Sai Pentapati
aka: Sai Surya Kiran Pentapati
aka: Sai Surya Kiran Pentapati
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