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Sukeshwar Kannan
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2020 – today
- 2022
- [j8]Arjun Chaudhuri, Sanmitra Banerjee, Jinwoo Kim, Heechun Park, Bon Woong Ku, Sukeshwar Kannan, Krishnendu Chakrabarty, Sung Kyu Lim:
Built-in Self-Test and Fault Localization for Inter-Layer Vias in Monolithic 3D ICs. ACM J. Emerg. Technol. Comput. Syst. 18(1): 22:1-22:37 (2022) - 2020
- [c14]Nicholas C. Harris, Ryan Braid, Darius Bunandar, Jim Carr, Brad Dobbie, Carlos Dorta-Quinones, Jon Elmhurst, Martin Forsythe, Michael Gould, Shashank Gupta, Sukeshwar Kannan, Tyler Kenney, Gary Kong, Tomo Lazovich, Scott Mckenzie, Carl Ramey, Chithira Ravi, Michael Scott, John Sweeney, Ozgur Yildirim, Katrina Zhang:
Accelerating Artificial Intelligence with Silicon Photonics. OFC 2020: 1-4
2010 – 2019
- 2019
- [j7]Abhishek Koneru, Sukeshwar Kannan, Krishnendu Chakrabarty:
A Design-for-Test Solution Based on Dedicated Test Layers and Test Scheduling for Monolithic 3-D Integrated Circuits. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 38(10): 1942-1955 (2019) - [c13]Arjun Chaudhuri, Sukeshwar Kannan, Luke England, Jack Golz:
Compact Scalable Dynamic TSV IR Drop Compensation for Power Delivery in 3D Packages. MWSCAS 2019: 1179-1182 - 2017
- [j6]Abhishek Koneru, Sukeshwar Kannan, Krishnendu Chakrabarty:
Impact of Electrostatic Coupling and Wafer-Bonding Defects on Delay Testing of Monolithic 3D Integrated Circuits. ACM J. Emerg. Technol. Comput. Syst. 13(4): 54:1-54:23 (2017) - [j5]Mehdi Sadi, Sukeshwar Kannan, LeRoy Winemberg, Mark M. Tehranipoor:
SoC Speed Binning Using Machine Learning and On-Chip Slack Sensors. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 36(5): 842-854 (2017) - [j4]Ran Wang, Zipeng Li, Sukeshwar Kannan, Krishnendu Chakrabarty:
Prebond Testing and Test-Path Design for the Silicon Interposer in 2.5-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 36(8): 1406-1419 (2017) - [c12]Abhishek Koneru, Sukeshwar Kannan, Krishnendu Chakrabarty:
A Design-for-Test Solution for Monolithic 3D Integrated Circuits. ICCD 2017: 685-688 - [c11]Mehdi Sadi, Sukeshwar Kannan, Luke England, Mark M. Tehranipoor:
Design of a digital IP for 3D-IC die-to-die clock synchronization. ISCAS 2017: 1-4 - 2016
- [c10]Luke England, Sukeshwar Kannan, Rahul Agarwal, Daniel Smith:
Impact of TSV integration on 14nm FinFET device performance. 3DIC 2016: 1-5 - [c9]Ran Wang, Zipeng Li, Sukeshwar Kannan, Krishnendu Chakrabarty:
Pre-bond testing of the silicon interposer in 2.5D ICs. DATE 2016: 978-983 - [c8]Sukeshwar Kannan, Mehdi Sadi, Luke England:
Power delivery in 3D packages: current crowding effects, dynamic IR drop and compensation network using sensors (invited paper). ICCAD 2016: 55 - 2015
- [c7]Sukeshwar Kannan, Rahul Agarwal, Arnaud Bousquet, Geetha Aluri, Hui-Shan Chang:
Device performance analysis on 20nm technology thin wafers in a 3D package. IRPS 2015: 4 - 2013
- [j3]Sukeshwar Kannan, Kaushal Kannan, Bruce C. Kim, Friedrich Taenzler, Richard Antley, Ken Moushegian, Kenneth M. Butler, Doug Mirizzi:
Physics-Based Low-Cost Test Technique for High Voltage LDMOS. J. Electron. Test. 29(6): 745-762 (2013) - [c6]Kaushal Kannan, Sukeshwar Kannan, Bruce C. Kim, Sang-Bock Cho:
Development of hybrid electrical model for CNT based Through Silicon Vias. ISCAS 2013: 1022-1026 - [c5]Sukeshwar Kannan, Bruce C. Kim, Anurag Gupta, Friedrich Taenzler, Richard Antley, Ken Moushegian:
Physics Based Fault Models for Testing High-Voltage LDMOS. VLSI Design 2013: 285-290 - 2012
- [j2]Sukeshwar Kannan, Bruce C. Kim, Byoungchul Ahn:
Fault Modeling and Multi-Tone Dither Scheme for Testing 3D TSV Defects. J. Electron. Test. 28(1): 39-51 (2012) - [c4]Sukeshwar Kannan, Bruce C. Kim, Anurag Gupta, Seok-Ho Noh, Li Li, Sang-Bock Cho:
Modeling and characterization of CNT-based TSV for high frequency applications. ISCAS 2012: 1584-1589 - [c3]Sukeshwar Kannan, Bruce C. Kim, Sang-Bock Cho, Byoungchul Ahn:
Analysis of propagation delay in 3 - D stacked DRAM. ISCAS 2012: 1839-1842 - 2011
- [j1]Sukeshwar Kannan, Bruce C. Kim, Ganesh Srinivasan, Friedrich Taenzler, Richard Antley, Craig Force:
Embedded RF Circuit Diagnostic Technique with Multi-Tone Dither Scheme. J. Electron. Test. 27(3): 241-252 (2011) - 2010
- [c2]Sukeshwar Kannan, Bruce C. Kim, Ganesh Srinivasan, Friedrich Taenzlar, Richard Antley, Craig Force, Falah Mohammed:
RADPro: Automatic RF analyzer and diagnostic program generation tool. ITC 2010: 325-333
2000 – 2009
- 2009
- [c1]Sukeshwar Kannan, Bruce C. Kim:
Automatic diagnostic tool for Analog-Mixed Signal and RF load boards. ITC 2009: 1
Coauthor Index
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