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"Impact of Electrostatic Coupling and Wafer-Bonding Defects on Delay ..."

Abhishek Koneru, Sukeshwar Kannan, Krishnendu Chakrabarty (2017)

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DOI: 10.1145/3041026

access: closed

type: Journal Article

metadata version: 2022-01-03

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  - journals/jetc/KoneruKC17
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  - https://dblp.org/rec/journals/jetc/KoneruKC17
Abhishek Koneru, Sukeshwar Kannan, Krishnendu Chakrabarty:
Impact of Electrostatic Coupling and Wafer-Bonding Defects on Delay Testing of Monolithic 3D Integrated Circuits. ACM J. Emerg. Technol. Comput. Syst. 13(4): 54:1-54:23 (2017)

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