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ORCIDMicroelectronics Reliability, Volume 78
Volume 78, November 2017
- Key-one Ahn
, Se-Hoon Park, Young-Ho Kim:
Degradation of adhesion between Cu and epoxy-based dielectric during exposure to hot humid environments. 1-10 - Muhammad Sajid, Nikolay G. Chechenin, Frank Sill Torres, Usman Ali Gulzari, Muhammad Usman Butt, Zhu Ming, E. U. Khan:
Single Event Upset rate determination for 65 nm SRAM bit-cell in LEO radiation environments. 11-16 - Yang Wang, Wenxiao Liu, Wei Liu, Peng He, Zhonghua Fan, Xiaorong Wang, Dingkun Yu, Jiayu Guo, Bing Guo, Hangyan Shen:
Synthesis of SnAgCu nanoparticles with low melting point by the chemical reduction method. 17-24 - Erping Deng, Zhibin Zhao, Qingming Xin, Jingwei Zhang, Yongzhang Huang:
Analysis on the difference of the characteristic between high power IGBT modules and press pack IGBTs. 25-37 - Daniel Malagón, Sebastià A. Bota, Gabriel Torrens, Xavier Gili, Javier Praena, B. Fernández, Miguel Macías, José Manuel Quesada, Carlos Guerrero Sanchez, María del Carmen Jiménez-Ramos, Javier García López, José Luis Merino, Jaume Segura:
Soft error rate comparison of 6T and 8T SRAM ICs using mono-energetic proton and neutron irradiation sources. 38-45 - Su-Dan Huang, Lin Zhou, Guang-Zhong Cao, Huai-Yuan Liu, Yi-Min Hu, Gang Jing, Ming-Gao Cao, Wen-Peng Xiao, Yan Liu:
A novel multiple-stress-based predictive model of LEDs for rapid lifetime estimation. 46-52 - Hajime Ikuno:
A newly developed rapid uniform thermal cycle test system for electronic components. 53-64 - Mouhannad Dbeiss, Yvan Avenas, Henri Zara:
Comparison of the electro-thermal constraints on SiC MOSFET and Si IGBT power modules in photovoltaic DC/AC inverters. 65-71 - Qinhan Guo, Zhenjiang Zhao, Chunlong Shen:
Comparison study on microstructure and mechanical properties of Sn-10Bi and Sn-Ag-Cu solder alloys and joints. 72-79 - Bo Wang, Bin Gao, Huaqiang Wu, He Qian:
New structure with SiO2-gate-dielectric select gates in vertical-channel three-dimensional (3D) NAND flash memory. 80-84 - Igor Villalta, Unai Bidarte, Julen Gomez-Cornejo, Jesús Lázaro, Armando Astarloa:
Estimating the SEU failure rate of designs implemented in FPGAs in presence of MCUs. 85-92 - Masanori Usui, Toshikazu Satoh, Hidehiko Kimura, S. Tajima, Y. Hayashi, Daigo Setoyama, Masashi Kato:
Effects of thermal aging on Cu nanoparticle/Bi-Sn solder hybrid bonding. 93-99 - Rudimylla S. Septimio, Thiago A. Costa, Talita A. Vida, Amauri Garcia, Noé Cheung:
Interrelationship of thermal parameters, microstructure and microhardness of directionally solidified Bi-Zn solder alloys. 100-110 - Hua-Chiang Wen, Wu-Ching Chou, Po-Chen Lin, Yeau-Ren Jeng, Chien-Chang Chen, Hung-Ming Chen, Don Son Jiang, Chun-Hu Cheng:
Using nanoindentation to investigate the temperature cycling of Sn-37Pb solders. 111-117 - Ferenc Biró, Zoltán Hajnal, Csaba Dücso, István Bársony:
The critical impact of temperature gradients on Pt filament failure. 118-125 - Gusztáv Hantos, Jozsef Hegedus, Márta Rencz:
An efficient reliability testing method combined with thermal performance monitoring. 126-130 - Hualiang Huang, Jing Tian:
Effects of electric field and bias voltage on corrosion behavior of tin under a thin electrolyte layer. 131-142 - M. Yazdan Mehr, Mohammad Reza Toroghinejad, F. Karimzadeh, W. D. van Driel, G. Q. Zhang:
Reliability and diffusion-controlled through thickness oxidation of optical materials in LED-based products. 143-147 - Ales Chvála, Juraj Marek, Patrik Pribytny, Alexander Satka, Steve Stoffels, Niels Posthuma, Stefaan Decoutere, Daniel Donoval:
Analysis of multifinger power HEMTs supported by effective 3-D device electrothermal simulation. 148-155 - Xiao-Hong Zhao, Hong-Liang Lu, Yu-Ming Zhang, Yimen Zhang:
Model of phonon contribution to nonionizing energy loss (NIEL) for InP/InGaAs heterojunction. 156-160 - Goran S. Nikolic, Mile K. Stojcev, Tatjana R. Nikolic, Branislav D. Petrovic, Goran S. Jovanovic, Bojan Dimitrijevic:
Implementation and evaluation of 2D SEC-DED forward error correction scheme in wireless sensor networks. 161-180 - Shuye Zhang, Tiesong Lin, Peng He, Kyung-Wook Paik:
Effects of acrylic adhesives property and optimized bonding parameters on Sn-58Bi solder joint morphology for flex-on-board assembly. 181-189 - Raphael de Oliveira Rocha, Frank Sill Torres, Rodrigo Possamai Bastos:
Towards high-sensitive built-in current sensors enabling detection of radiation-induced soft errors. 190-196 - Hongyu Tang, Huaiyu Ye, Cell K. Y. Wong, Stanely Y. Y. Leung, Jiajie Fan, Xianping Chen, Xuejun Fan, Guoqi Zhang:
Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component. 197-204 - Alexis Ramos, Juan Antonio Maestro, Pedro Reviriego:
Characterizing a RISC-V SRAM-based FPGA implementation against Single Event Upsets using fault injection. 205-211 - Dong Wang, Fangfang Yang, Yang Zhao, Kwok-Leung Tsui:
Battery remaining useful life prediction at different discharge rates. 212-219 - Min-Seok Jang, Sung Woo Ma, Jongsoo Song, Myungmo Sung, Young-Ho Kim:
Adhesion of NCF to oxidized Si wafers after oxygen plasma treatment. 220-226 - S. Chatbouri, M. Troudi, A. Kalboussi, A. Souifi:
Interface traps effect on the charge transport mechanisms in metal oxide semiconductor structures based on silicon nanocrystals. 227-232 - Vincenzo d'Alessandro, Antonio Pio Catalano, Alessandro Magnani, Lorenzo Codecasa, Niccolò Rinaldi, Brian Moser, Peter J. Zampardi:
Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies. 233-242 - Jozef Osvald, Gabriel Vanko, L. Chow, N. C. Chen, L. B. Chang:
Transition voltage of AlGaN/GaN heterostructure MSM varactor with two-dimensional electron gas. 243-248 - Mayssam Jannoun, Younes Aoues, Emmanuel Pagnacco, Philippe Pougnet, Abdelkhalak El Hami:
Probabilistic fatigue damage estimation of embedded electronic solder joints under random vibration. 249-257 - Chun-Yu Lin, Rui-Hong Liu, Ming-Dou Ker:
Design of 2.4-GHz T/R switch with embedded ESD protection devices in CMOS process. 258-266 - Hsien-Chin Chiu, Min-Li Chou, Chun-Hu Cheng, Hsuan-Ling Kao, Cheng-Lin Cho:
Effect of body bias and temperature on low-frequency noise in 40-nm nMOSFETs. 267-271 - Huang-Kuang Kung, Chi-Lung Hsieh:
A theoretical study to improve wire sag of ultra-long wire bond loops for 3D/MCM packaging. 272-279 - Boan Pan, Ting Li, Yan Li, Guoyi Xu:
A reliable integrative autocorrelator device for particle fluctuation rate monitoring. 280-284 - Jiang Xia, LanXian Cheng, Guoyuan Li, Bin Li:
Reliability study of package-on-package stacking assembly under vibration loading. 285-293 - Guangjun Lu, W. D. van Driel, Xuejun Fan, Jiajie Fan, Cheng Qian, G. Q. Zhang:
Color shift acceleration on mid-power LED packages. 294-298 - Sanghamitra Ghosal, Partha Bhattacharyya:
A potential gas sensor device based on Pd/RGO/TiO2 nanotube ternary hybrid junction. 299-306 - Fan Liu, Zhiwei Liu, Jizhi Liu, Cheng Hui, Zhao Liu, Tian Rui, Shiyu Song, Juin J. Liou:
A novel vertical SCR for ESD protection in 40 V HV bipolar process. 307-310 - Muhammad Aamir, Riaz Muhammad, Naseer Ahmed, Muhammad Waqas:
Impact of thermal aging on the intermetallic compound particle size and mechanical properties of lead free solder for green electronics. 311-318 - Hsiu-Ping Wei, Bongtae Han, Byeng Dong Youn, Hyuk Shin, Ilho Kim, Hojeong Moon:
Assembly yield prediction of plastically encapsulated packages with a large number of manufacturing variables by advanced approximate integration method. 319-330 - Cheng-Tang Pan, Y. C. Chen, Shao-Yu Wang, Y. T. Cheng, Chung-Kun Yen, Y. L. Lin, W. C. Shih:
TSV by 355 UV laser for 4G component packaging with micro-electroforming. 331-338 - Kelvin P. L. Pun, Navdeep S. Dhaka, Chee-wah Cheung, Alan H. S. Chan:
Effect of ENEPIG metallization for solid-state gold-gold diffusion bonds. 339-348 - Mélanie Raine, Marc Gaillardin, Thierry Lagutere, Olivier Duhamel, Philippe Paillet:
Estimating the Single-Event Upset sensitivity of a memory array using simulation. 349-354 - Yuelin Wu, K. N. Subramanian, Scott Calabrese Barton, Andre Lee:
Electrochemical studies of Pd-doped Cu and Pd-doped Cu-Al intermetallics for understanding corrosion behavior in wire-bonding packages. 355-361 - Qi-Lin Gu, Peng Zhang, Yi Ru, Hao Song, Wen-Sheng Zhao, Wen-Yan Yin:
A comparative study on electrothermal characteristics of nanoscale multiple gate MOSFETs. 362-369 - Pengbo Wang, Jiajing Sun, Qian Jiang, Ting Li:
Cooling-controlled and reliable driving module for low-level light therapy LED helmet. 370-373 - Ting-Hong Su, Chia-Hung Chiang, Yow-Jon Lin:
Temperature dependence of current-voltage characteristics of MoS2/Si devices prepared by the chemical vapor deposition method. 374-378 - A. M. Colaco, Ciji Pearl Kurian, Savitha G. Kini, S. G. Colaco, Cherian Johny:
Thermal characterization of multicolor LED luminaire. 379-388 - Shubhankar Majumdar, Ankush Bag, Dhrubes Biswas:
Comparative analysis of parameter extraction techniques for AlGaN/GaN HEMT on silicon/sapphire substrate. 389-395 - Qi Tao, Gerald Pinter, Thomas Krivec:
Influence of cooling rate and annealing on the DSC Tg of an epoxy resin. 396-400 - Fulin Zhong, Zhenglun Kong, Guoyi Xu, Ting Li:
High stability and robustness of a developed novel laser acupuncture theranostic device. 401-405 - Yue Zhao, Lina Qiu, Ke Zhao, Kai Li, Yunlong Sun, Lingkang Meng, Zhe Huang, Ting Li:
Effect of 805 nm on reliability of 735/805/850-nm LED involved near-infrared spectroscopy biomedical device. 406-410 - Ting Li, Yu Su, Lanhui Wu, Boan Pan, Yan Li:
Reliability analysis of a newly developed detector for monitoring spine health. 411-414
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