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"Interrelationship of thermal parameters, microstructure and microhardness ..."

Rudimylla S. Septimio et al. (2017)

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DOI: 10.1016/J.MICROREL.2017.08.007

access: closed

type: Journal Article

metadata version: 2020-10-26

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  - journals/mr/SeptimioCVGC17
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  - https://dblp.org/rec/journals/mr/SeptimioCVGC17
Rudimylla S. Septimio, Thiago A. Costa, Talita A. Vida, Amauri Garcia, Noé Cheung:
Interrelationship of thermal parameters, microstructure and microhardness of directionally solidified Bi-Zn solder alloys. Microelectron. Reliab. 78: 100-110 (2017)

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