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Bongtae Han
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2020 – today
- 2022
- [j12]Alexandru Prisacaru
, Przemyslaw Gromala
, Bongtae Han
, Guo Qi Zhang
:
Degradation Estimation and Prediction of Electronic Packages Using Data-Driven Approach. IEEE Trans. Ind. Electron. 69(3): 2996-3006 (2022)
2010 – 2019
- 2017
- [j11]Alicja Palczynska, Alexandru Prisacaru, Przemyslaw Jakub Gromala, Bongtae Han
, Dirk Mayer
, Tobias Melz
:
Towards prognostics and health monitoring: The potential of fault detection by piezoresistive silicon stress sensor. Microelectron. Reliab. 74: 165-172 (2017) - [j10]Hsiu-Ping Wei, Bongtae Han
, Byeng Dong Youn, Hyuk Shin, Ilho Kim, Hojeong Moon:
Assembly yield prediction of plastically encapsulated packages with a large number of manufacturing variables by advanced approximate integration method. Microelectron. Reliab. 78: 319-330 (2017) - 2016
- [j9]Alicja Palczynska, Przemyslaw Jakub Gromala, Dirk Mayer
, Bongtae Han
, Tobias Melz
:
In-situ investigation of EMC relaxation behavior using piezoresistive stress sensor. Microelectron. Reliab. 62: 58-62 (2016) - [j8]Kenny Mahan
, Byung Kim, Bulong Wu, Bongtae Han
, Ilho Kim, Hojeong Moon, Young Nam Hwang:
Modified single cantilever adhesion test for EMC/PSR interface in thin semiconductor packages. Microelectron. Reliab. 63: 134-141 (2016) - 2014
- [j7]Dae-Suk Kim, Bongtae Han
, Youn-Jea Kim:
Degradation analysis of secondary lens system and its effect on performance of LED-based luminaire. Microelectron. Reliab. 54(1): 131-137 (2014) - 2013
- [j6]Bong-Min Song, Bongtae Han
, Joon-Hyun Lee:
Optimum design domain of LED-based solid state lighting considering cost, energy consumption and reliability. Microelectron. Reliab. 53(3): 435-442 (2013) - 2012
- [j5]Bong-Min Song, Bongtae Han
, Avram Bar-Cohen, Mehmet Arik
, Rajdeep Sharma, Stan Weaver:
Life prediction of LED-based recess downlight cooled by synthetic jet. Microelectron. Reliab. 52(5): 937-948 (2012) - [j4]Bongtae Han
:
Measurements of True Leak Rates of MEMS Packages. Sensors 12(3): 3082-3104 (2012) - 2010
- [j3]Changsoo Jang, Byeng Dong Youn
, Ping F. Wang, Bongtae Han
, Suk-Jin Ham:
Forward-stepwise regression analysis for fine leak batch testing of wafer-level hermetic MEMS packages. Microelectron. Reliab. 50(4): 507-513 (2010)
2000 – 2009
- 2008
- [j2]Arindam Goswami, Bongtae Han
:
On the applicability of MIL-Spec-based helium fine leak test to packages with sub-micro liter cavity volumes. Microelectron. Reliab. 48(11-12): 1815-1821 (2008) - 2005
- [j1]Jinwon Joo, Seungmin Cho, Bongtae Han
:
Characterization of flexural and thermo-mechanical behavior of plastic ball grid package assembly using moiré interferometry. Microelectron. Reliab. 45(3-4): 637-646 (2005)
Coauthor Index
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