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"Reliability study of package-on-package stacking assembly under vibration ..."

Jiang Xia et al. (2017)

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DOI: 10.1016/J.MICROREL.2017.09.012

access: closed

type: Journal Article

metadata version: 2022-01-27

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Jiang Xia, LanXian Cheng, Guoyuan Li, Bin Li:
Reliability study of package-on-package stacking assembly under vibration loading. Microelectron. Reliab. 78: 285-293 (2017)

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