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"TSV by 355 UV laser for 4G component packaging with micro-electroforming."

Cheng-Tang Pan et al. (2017)

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DOI: 10.1016/J.MICROREL.2017.09.023

access: closed

type: Journal Article

metadata version: 2022-10-18

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Cheng-Tang Pan, Y. C. Chen, Shao-Yu Wang, Y. T. Cheng, Chung-Kun Yen, Y. L. Lin, W. C. Shih:
TSV by 355 UV laser for 4G component packaging with micro-electroforming. Microelectron. Reliab. 78: 331-338 (2017)

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