"Assembly yield prediction of plastically encapsulated packages with a ..."

Hsiu-Ping Wei et al. (2017)

Details and statistics

DOI: 10.1016/J.MICROREL.2017.09.006

access: closed

type: Journal Article

metadata version: 2020-02-22

a service of  Schloss Dagstuhl - Leibniz Center for Informatics