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"Degradation of adhesion between Cu and epoxy-based dielectric during ..."

Key-one Ahn, Se-Hoon Park, Young-Ho Kim (2017)

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DOI: 10.1016/J.MICROREL.2017.07.083

access: closed

type: Journal Article

metadata version: 2021-04-07

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Key-one Ahn, Se-Hoon Park, Young-Ho Kim:
Degradation of adhesion between Cu and epoxy-based dielectric during exposure to hot humid environments. Microelectron. Reliab. 78: 1-10 (2017)

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