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Soon-Wook Kim , Lan Peng , Andy Miller , Gerald Beyer , Eric Beyne , Chung-Sun Lee : Permanent wafer bonding in the low temperature by using various plasma enhanced chemical vapour deposition dielectrics. 3DIC 2015 : TS7.2.1-TS7.2.4 share record
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Hisashi Kino , Hideto Hashiguchi , Seiya Tanikawa , Yohei Sugawara , Shunsuke Ikegaya , Takafumi Fukushima , Mitsumasa Koyanagi , Tetsu Tanaka : Consideration of microbump layout for reduction of local bending stress due to CTE Mismatch in 3D IC. 3DIC 2015 : TS8.26.1-TS8.26.4 share record
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Sayuri Kohara , Keishi Okamoto , Hirokazu Noma , Kazushige Toriyama , Hiroyuki Mori : Warpage analysis of organic substrates for 2.1D packaging. 3DIC 2015 : TS8.17.1-TS8.17.5 share record
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Kazuo Kondo , Shingo Mukahara , Masayuki Yokoi , Jin Onuki : No pumping at 450°C with electrodeposited copper TSV. 3DIC 2015 : TS4.1.1-TS4.1.4 share record
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Chung H. Lam : Neuromorphic semiconductor memory. 3DIC 2015 : KN3.1-KN3.4 share record
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K. W. Lee , Ji Chel Bea , Mitsu Koyanagi , Takafumi Fukushima , Tetsu Tanaka : Advanced 2.5D/3D hetero-integration technologies at GINTI, Tohoku University. 3DIC 2015 : FS2.1-FS2.5 share record
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Hyunsuk Lee , Kyungjun Cho , Heegon Kim , Sumin Choi , Jaemin Lim , Joungho Kim : Electrical performance of high bandwidth memory (HBM) interposer channel in terabyte/s bandwidth graphics module. 3DIC 2015 : TS2.2.1-TS2.2.4 share record
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K. W. Lee , Chisato Nagai , Ai Nakamura , Hiroki Aizawa , Ji Chel Bea , Mitsumasa Koyanagi , Hideto Hashiguchi , Takafumi Fukushima , Tanaka Tanaka : Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers. 3DIC 2015 : TS1.2.1-TS1.2.4 share record
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Jiatong Liu , Ken Suzuki , Hideo Miura : Variation of thermal stress in TSV structures caused by crystallinity of electroplated copper interconnections. 3DIC 2015 : TS8.5.1-TS8.5.5 share record
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Wei-Chung Lo : 3D research activities in ITRI. 3DIC 2015 : FS3.1 share record
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Samson Melamed , Katsuya Kikuchi , Masahiro Aoyagi : Investigation of effects of metalization on heat spreading in bump-bonded 3D systems. 3DIC 2015 : TS8.30.1-TS8.30.4 share record
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Takahide Murayama , Yasuhiro Morikawa : TSV etching and VDP process integration for high reliability. 3DIC 2015 : TS8.11.1-TS8.11.4 export record
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conf/3dic/MurugesanBHLKFT15 share record
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Mariappan Murugesan , Jichoel Bea , Hiroyuki Hashimoto , K. W. Lee , Mitsu Koyanagi , Takafumi Fukushima , Tetsu Tanaka : Mitigating thermo mechanical stress in high-density 3D-LSI through dielectric liners in Cu- through silicon Via _ µ-RS and µ-XRD study. 3DIC 2015 : TS8.10.1-TS8.10.5 share record
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Tomoji Nakamura , Yoriko Mizushima , Young-Suk Kim , Ryuichi Sugie , Takayuki Ohba : Characterization of stress distribution in ultra-thinned DRAM wafer. 3DIC 2015 : TS3.2.1-TS3.2.5 share record
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Kosuke Nanbara , Akihiro Odoriba , Masaki Hashizume , Hiroyuki Yotsuyanagi , Shyue-Kung Lu : Electrical interconnect test of 3D ICs made of dies without ESD protection circuits with a built-in test circuit. 3DIC 2015 : TS8.22.1-TS8.22.5 share record
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Susheela Narasimhan : Power tile optimization and packaging for efficient temperature management of ASIC's in networking applications. 3DIC 2015 : TS8.36.1 share record
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Gopi Neela , Jeffrey Draper : Congestion-aware optimal techniques for assigning inter-tier signals to 3D-vias in a 3DIC. 3DIC 2015 : TS8.23.1-TS8.23.6 share record
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Tomoharu Ogita : Invited talk: Technology and overview of Sony's 3D stacked CMOS image sensor. 3DIC 2015 : TS9.1.1 share record
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Hanju Oh , Gary S. May , Muhannad S. Bakir : Silicon interposer platform with low-loss through-silicon vias using air. 3DIC 2015 : TS11.3.1-TS11.3.4 share record
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Kohei Ohta , Atsushi Hirate , Yuto Miyachi , Tomohiro Shimizu , Shoso Shingubara : All-wet TSV filling with highly adhesive displacement plated Cu seed layer. 3DIC 2015 : TS8.4.1-TS8.4.3 export record
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conf/3dic/PanigrahiBGVS15 share record
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Asisa Kumar Panigrahi , Satish Bonam , Tamal Ghosh , Siva Rama Krishna Vanjari , Shiv Govind Singh : Long term efficacy of ultra-thin Ti passivation layer for achieving low temperature, low pressure Cu-Cu Wafer-on-Wafer bonding. 3DIC 2015 : TS8.13.1-TS8.13.5 share record
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Robert Patti : Invited talk: Progress in 3D integrated circuits. 3DIC 2015 : TS2.1.1 share record
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Gaël Pillonnet , Nicolas Jeanniot , Pascal Vivet : 3D ICs: An opportunity for fully-integrated, dense and efficient power supplies. 3DIC 2015 : TS6.4.1-TS6.4.8 export record
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conf/3dic/RaghupathyDPR15 share record
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Arun Raghupathy , Hoa Do , Brian Philofsky , Gamal Refai-Ahmed : Best engineering practice for thermal characterization of stacked dice FPGA devices. 3DIC 2015 : TS8.21.1-TS8.21.8 share record
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Mostafizur Rahman , Santosh Khasanvis , Jiajun Shi , Mingyu Li , Csaba Andras Moritz : Fine-grained 3-D integrated circuit fabric using vertical nanowires. 3DIC 2015 : TS9.3.1-TS9.3.7 share record
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Vempati Srinivasa Rao : IME's capabilities and programs in 2.5D/3DIC. 3DIC 2015 : FS5.1 share record
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R. Ranga Reddy , Sugandh Tanna , Shiv Govind Singh , Om Krishna Singh : TSV noise coupling in 3D IC using guard ring. 3DIC 2015 : TS8.35.1-TS8.35.5 export record
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conf/3dic/Refai-AhmedBTP15 share record
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Gamal Refai-Ahmed , Ivor Barber , Anthony Torza , Brian Philofsky : A holistic view of chip-level thermal architecture from heterogeneous stacked dice to system level in telecoms applications. 3DIC 2015 : TS10.1.1-TS10.1.4 share record
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Pornvitoo Rittinon , Ken Suzuki , Hideo Miura : Thermal stability of electroplated copper thin-film interconnections. 3DIC 2015 : TS4.2.1-TS4.2.6 share record
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Cristiano Santos , Rafael Prieto , Pascal Vivet , Jean-Philippe Colonna , Perceval Coudrain , Ricardo Reis : Graphite-based heat spreaders for hotspot mitigation in 3D ICs. 3DIC 2015 : TS10.4.1-TS10.4.4