![](https://dblp1.uni-trier.de/img/logo.ua.320x120.png)
![](https://dblp1.uni-trier.de/img/dropdown.dark.16x16.png)
![](https://dblp1.uni-trier.de/img/peace.dark.16x16.png)
Остановите войну!
for scientists:
![search dblp search dblp](https://dblp1.uni-trier.de/img/search.dark.16x16.png)
![search dblp](https://dblp1.uni-trier.de/img/search.dark.16x16.png)
default search action
Mariappan Murugesan
Person information
Refine list
![note](https://dblp1.uni-trier.de/img/note-mark.dark.12x12.png)
refinements active!
zoomed in on ?? of ?? records
view refined list in
export refined list as
2020 – today
- 2023
- [c28]Mariappan Murugesan, M. Sawa, E. Sone, Makoto Motoyoshi, Mitsumasa Koyanagi, Takafumi Fukushima
:
Copper Electrode Surface Features and Cu-SiO2Hybrid Bonding. 3DIC 2023: 1-4 - [c27]Jiayi Shen, Chang Liu, Tadaaki Hoshi, Atsushi Sinoda, Hisashi Kino, Tetsu Tanaka, Mariappan Murugesan, Mitsumasa Koyanagi, Takafumi Fukushima
:
Impact of Super-long-throw PVD on TSV Metallization and Die-to-Wafer 3D Integration Based on Via-last. 3DIC 2023: 1-4 - 2021
- [c26]Takafumi Fukushima
, Shinichi Sakuyama, Masatomo Takahashi, Hiroyuki Hashimoto, Jichoel Bea, Theodorus Marcello, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi, Mariappan Murugesan:
Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing. 3DIC 2021: 1-4 - [c25]Mariappan Murugesan, E. Sone, A. Simomura, Makoto Motoyoshi, M. Sawa, K. Fukuda, Mitsumasa Koyanagi, Takafumi Fukushima
:
Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications. 3DIC 2021: 1-4
2010 – 2019
- 2019
- [c24]Rui Liang, Sungho Lee, Yuki Miwa, Kousei Kumahara, Mariappan Murugesan, Hisashi Kino
, Takafumi Fukushima
, Tetsu Tanaka:
Impacts of Deposition Temperature and Annealing Condition on Ozone-Ethylene Radical Generation-TEOS-CVD SiO2 for Low-Temperature TSV Liner Formation. 3DIC 2019: 1-4 - [c23]Mariappan Murugesan, Mitsumasa Koyanagi, Takafumi Fukushima
:
Growth Optimization of Multi-Layer Graphene for Thermal-TSV Application in 3D-LSI. 3DIC 2019: 1-5 - [c22]Mariappan Murugesan, Mitsumasa Koyanagi, Hiroyuki Hashimoto, Ji Chel Bea, Takafumi Fukushima
:
Fabrication and Morphological Characterization of Nano-Scale Interconnects for 3D-Integration. 3DIC 2019: 1-4 - 2018
- [c21]Mariappan Murugesan, Takafumi Fukushima
, Ji Chel Bea, Hiroyuki Hashimoto, Mitsu Koyanagi:
Intra- and inter-chip electrical interconnection formed by directed self assembly of nanocomposite containing diblock copolymer and nanometal. IRPS 2018: 4 - 2016
- [j2]Takafumi Fukushima
, Hideto Hashiguchi, Hiroshi Yonekura, Hisashi Kino
, Mariappan Murugesan
, Ji Chel Bea, Kang Wook Lee, Tetsu Tanaka
, Mitsumasa Koyanagi:
Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration. Micromachines 7(10): 184 (2016) - [c20]Takafumi Fukushima
, Mariappan Murugesan, Shin Ohsaki, Hiroyuki Hashimoto, Jichoel Bea, Kang Wook Lee, Tetsu Tanaka
, Mitsumasa Koyanagi:
New concept of TSV formation methodology using Directed Self-Assembly (DSA). 3DIC 2016: 1-4 - [c19]Makoto Motoyoshi, Kohki Yanagimura, Taikoh Fushimi, Junichi Takanohashi, Mariappan Murugesan, Masahiro Aoyagi, Mitsumasa Koyanagi:
3 Dimensional stacked pixel detector and sensor technology using less than 3-μmφ robust bump junctions. 3DIC 2016: 1-4 - [c18]Mariappan Murugesan, Jichel Bea, Takafumi Fukushima
, Makoto Motoyoshi, Tetsu Tanaka
, Mitsumasa Koyanagi:
Improving the integrity of Ti barrier layer in Cu-TSVs through self-formed TiSix for via-last TSV technology. 3DIC 2016: 1-4 - 2015
- [c17]Takafumi Fukushima
, Taku Suzuki, Hideto Hashiguchi, Chisato Nagai, Jichoel Bea, Hiroyuki Hashimoto, Mariappan Murugesan, Kang Wook Lee, Tetsu Tanaka
, Kazushi Asami, Yasuhiro Kitamura, Mitsumasa Koyanagi:
Transfer and non-transfer stacking technologies based on chip-to-wafer self-asembly for high-throughput and high-precision alignment and microbump bonding. 3DIC 2015: TS7.4.1-TS7.4.4 - [c16]Mariappan Murugesan, Jichoel Bea, Hiroyuki Hashimoto, K. W. Lee, Mitsu Koyanagi, Takafumi Fukushima
, Tetsu Tanaka
:
Mitigating thermo mechanical stress in high-density 3D-LSI through dielectric liners in Cu- through silicon Via _ µ-RS and µ-XRD study. 3DIC 2015: TS8.10.1-TS8.10.5 - [c15]Kang Wook Lee, Ji Chel Bea, Mariappan Murugesan, Takafumi Fukushima
, Tetsu Tanaka
, Mitsumasa Koyanagi:
Impacts of 3-D integration processes on device reliabilities in thinned DRAM chip for 3-D DRAM. IRPS 2015: 4 - 2014
- [c14]Takafumi Fukushima
, Yuka Ito, Mariappan Murugesan, Jicheol Bea, Kang Wook Lee, Koji Choki, Tetsu Tanaka
, Mitsumasa Koyanagi:
Tiny VCSEL chip self-assembly for advanced chip-to-wafer 3D and hetero integration. 3DIC 2014: 1-4 - [c13]K. W. Lee, Chisato Nagai, Ai Nakamura, Ji Chel Bea, Mariappan Murugesan, Takafumi Fukushima
, Tanaka Tanaka, Mitsumasa Koyanagi:
Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV. 3DIC 2014: 1-4 - [c12]Mariappan Murugesan, Takafumi Fukushima
, Ji Chel Bea, K. W. Lee, Mitsu Koyanagi, Y. Imai, S. Kimura, Tetsu Tanaka
:
Micro-XRD investigation of fine-pitch Cu-TSV induced thermo-mechanical stress in high-density 3D-LSI. 3DIC 2014: 1-4 - 2013
- [c11]Takafumi Fukushima
, Jichoel Bea, Mariappan Murugesan, Kang Wook Lee, Mitsumasa Koyanagi:
Development of via-last 3D integration technologies using a new temporary adhesive system. 3DIC 2013: 1-4 - [c10]Takafumi Fukushima
, Jichoel Bea, Mariappan Murugesan, Ho-Young Son
, M.-S. Suh, K.-Y. Byun, N.-S. Kim, Kang Wook Lee, Mitsumasa Koyanagi:
3D memory chip stacking by multi-layer self-assembly technology. 3DIC 2013: 1-4 - [c9]Kang Wook Lee, Seiya Tanikawa, Mariappan Murugesan, H. Naganuma, Jichoel Bea, Takafumi Fukushima
, Tetsu Tanaka
, Mitsumasa Koyanagi:
Impact of 3-D integration process on memory retention characteristics in thinned DRAM chip for 3-D memory. 3DIC 2013: 1-4 - [c8]Mariappan Murugesan, Jichoel Bea, Kang Wook Lee, Takafumi Fukushima
, Tetsu Tanaka
, Mitsumasa Koyanagi, Yuji Sutou
, H. Wang, J. Koike:
Effect of CVD Mn oxide layer as Cu diffusion barrier for TSV. 3DIC 2013: 1-4 - 2011
- [j1]Takafumi Fukushima
, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan
, Ji Chel Bea, Kang Wook Lee, Tetsu Tanaka
, Mitsumasa Koyanagi:
Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration. Micromachines 2(1): 49-68 (2011) - [c7]Takafumi Fukushima
, Yuki Ohara, Jichoel Bea, Mariappan Murugesan, Kang Wook Lee, Tetsu Tanaka
, Mitsumasa Koyanagi:
Temporary bonding strength control for self-assembly-based 3D integration. 3DIC 2011: 1-4 - [c6]Mariappan Murugesan, Hideto Hashiguchi, Harufumi Kobayashi, Takafumi Fukushima
, Tetsu Tanaka
, Mitsumasa Koyanagi:
W/Cu TSVs for 3D-LSI with minimum thermo-mechanical stress. 3DIC 2011: 1-4 - [c5]Mariappan Murugesan, Harufumi Kobayashi, Takafumi Fukushima
, Tetsu Tanaka
, Mitsumasa Koyanagi:
High density Cu-TSVs and reliability issues. 3DIC 2011: 1-4 - 2010
- [c4]Takafumi Fukushima
, Eiji Iwata, Jichoel Bea, Mariappan Murugesan, Kang Wook Lee, Tetsu Tanaka
, Mitsumasa Koyanagi:
Evaluation of alignment accuracy on chip-to-wafer self-assembly and mechanism on the direct chip bonding at room temperature. 3DIC 2010: 1-5 - [c3]Mariappan Murugesan, Yuki Ohara, Jichoel Bea, Kang Wook Lee, Takafumi Fukushima
, Tetsu Tanaka
, Mitsumasa Koyanagi:
Impact of microbump induced stress in thinned 3D-LSIs after wafer bonding. 3DIC 2010: 1-5
2000 – 2009
- 2009
- [c2]Ji Chel Bea, Mariappan Murugesan, Yuki Ohara, Akihiro Noriki
, Hisashi Kino
, Kang Wook Lee, Takafumi Fukushima
, Tetsu Tanaka
, Mitsumasa Koyanagi:
Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration. 3DIC 2009: 1-5 - [c1]Yuki Ohara, Akihiro Noriki, Katsuyuki Sakuma
, Kang Wook Lee, Mariappan Murugesan, Jichoel Bea, Fumiaki Yamada, Takafumi Fukushima
, Tetsu Tanaka
, Mitsumasa Koyanagi:
10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack. 3DIC 2009: 1-6
Coauthor Index
![](https://dblp1.uni-trier.de/img/cog.dark.24x24.png)
manage site settings
To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.
Unpaywalled article links
Add open access links from to the list of external document links (if available).
Privacy notice: By enabling the option above, your browser will contact the API of unpaywall.org to load hyperlinks to open access articles. Although we do not have any reason to believe that your call will be tracked, we do not have any control over how the remote server uses your data. So please proceed with care and consider checking the Unpaywall privacy policy.
Archived links via Wayback Machine
For web page which are no longer available, try to retrieve content from the of the Internet Archive (if available).
Privacy notice: By enabling the option above, your browser will contact the API of archive.org to check for archived content of web pages that are no longer available. Although we do not have any reason to believe that your call will be tracked, we do not have any control over how the remote server uses your data. So please proceed with care and consider checking the Internet Archive privacy policy.
Reference lists
Add a list of references from ,
, and
to record detail pages.
load references from crossref.org and opencitations.net
Privacy notice: By enabling the option above, your browser will contact the APIs of crossref.org, opencitations.net, and semanticscholar.org to load article reference information. Although we do not have any reason to believe that your call will be tracked, we do not have any control over how the remote server uses your data. So please proceed with care and consider checking the Crossref privacy policy and the OpenCitations privacy policy, as well as the AI2 Privacy Policy covering Semantic Scholar.
Citation data
Add a list of citing articles from and
to record detail pages.
load citations from opencitations.net
Privacy notice: By enabling the option above, your browser will contact the API of opencitations.net and semanticscholar.org to load citation information. Although we do not have any reason to believe that your call will be tracked, we do not have any control over how the remote server uses your data. So please proceed with care and consider checking the OpenCitations privacy policy as well as the AI2 Privacy Policy covering Semantic Scholar.
OpenAlex data
Load additional information about publications from .
Privacy notice: By enabling the option above, your browser will contact the API of openalex.org to load additional information. Although we do not have any reason to believe that your call will be tracked, we do not have any control over how the remote server uses your data. So please proceed with care and consider checking the information given by OpenAlex.
last updated on 2024-08-05 21:18 CEST by the dblp team
all metadata released as open data under CC0 1.0 license
see also: Terms of Use | Privacy Policy | Imprint