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"Warpage analysis of organic substrates for 2.1D packaging."

Sayuri Kohara et al. (2015)

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DOI: 10.1109/3DIC.2015.7334586

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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Sayuri Kohara, Keishi Okamoto, Hirokazu Noma, Kazushige Toriyama, Hiroyuki Mori:
Warpage analysis of organic substrates for 2.1D packaging. 3DIC 2015: TS8.17.1-TS8.17.5

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