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Takayuki Ohba
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2020 – today
- 2023
- [c12]Norio Chujo, Koji Sakui, Shinji Sugatani, Hiroyuki Ryoson, Tomoji Nakamura, Takayuki Ohba:
Bumpless Build Cube (BBCube) 3D: Heterogeneous 3D Integration Using WoW and CoW to Provide TB/s Bandwidth with Lowest Bit Access Energy. VLSI Technology and Circuits 2023: 1-2 - 2022
- [c11]Kyosuke Kobinata, Tatsuya Funaki, Yoshiaki Satake, Hitoshi Matsuno, Seiji Hidaka, Shunsuke Abe, Hiroyuki Ito, Chih-Cheng Hsiao, Sheng Yi Li, Young-Suk Kim, Takayuki Ohba:
Low-ESL (<1 pH @ 8.5 GHz) Multi-Terminal Si Capacitor Embedded in 3D Functional Interposer for Power Delivery Network. VLSI Technology and Circuits 2022: 385-386 - 2021
- [c10]Zhwen Chen, Young-Suk Kim, Tadashi Fukuda, Koji Sakui, Takayuki Ohba, Tatsuji Kobayashi, Takashi Obara:
Reliability of Wafer-Level Ultra-Thinning down to 3 µm using 20 nm-Node DRAMs. IRPS 2021: 1-6
2010 – 2019
- 2019
- [c9]Chia-Hsuan Lee, Hsin-Chi Chang, Jui-Han Liu, Hiroyuki Ito, Young-Suk Kim, Kuan-Neng Chen, Takayuki Ohba:
Temperature Cycling Reliability of WOW Bumpless Through Silicon Vias. 3DIC 2019: 1-4 - [c8]Koji Sakui, Takayuki Ohba:
High Bandwidth Memory (HBM) and High Bandwidth NAND (HBN) with the Bumpless TSV Technology. 3DIC 2019: 1-4 - [c7]Koji Sakui, Takayuki Ohba:
Three-dimensional Integration (3DI) with Bumpless Interconnects for Tera-scale Generation : High Speed, Low Power, and Ultra-small Operating Platform. CICC 2019: 1-6 - 2015
- [j1]Takayuki Ohba, Young-Suk Kim, Yoriko Mizushima, Nobuhide Maeda, Koji Fujimoto, Shoichi Kodama:
Review of wafer-level three-dimensional integration (3DI) using bumpless interconnects for tera-scale generation. IEICE Electron. Express 12(7): 20152002 (2015) - [c6]Tomoji Nakamura, Yoriko Mizushima, Young-Suk Kim, Ryuichi Sugie, Takayuki Ohba:
Characterization of stress distribution in ultra-thinned DRAM wafer. 3DIC 2015: TS3.2.1-TS3.2.5 - 2014
- [c5]Yoriko Mizushima, Young-Suk Kim, Tomoji Nakamura, Shoichi Kodama, Nobuhide Maeda, Koji Fujimoto, Takayuki Ohba:
Impact of Thermomechanical Stresses on Ultra-thin Si Stacked Structure. 3DIC 2014: 1-5 - 2013
- [c4]Tadao Nakamura, Yoriko Mizushima, Hideki Kitada, Young-Suk Kim, Nobuhide Maeda, Shoichi Kodama, Ryuichi Sugie, Hiroshi Hashimoto, Akihito Kawai, Kazuhisa Arai, Akira Uedono, Takayuki Ohba:
Influence of wafer thinning process on backside damage in 3D integration. 3DIC 2013: 1-6 - 2011
- [c3]Nobuhide Maeda, Young-Suk Kim, Y. Hikosaka, T. Eshita, Hideki Kitada, K. Fujimoto, Yoriko Mizushima, K. Suzuki, Tadao Nakamura, Akihito Kawai, Kazuhisa Arai, Takayuki Ohba:
Development of ultra-thinning technology for logic and memory heterogeneous stack applications. 3DIC 2011: 1-4 - [c2]Tomoji Nakamura, Hideki Kitada, Yoriko Mizushima, Nobuhide Maeda, Koji Fujimoto, Takayuki Ohba:
Comparative study of side-wall roughness effects on leakage currents in through-silicon via interconnects. 3DIC 2011: 1-4 - [c1]Osamu Nakatsuka, Hideki Kitada, Young-Suk Kim, Yoriko Mizushima, Tomoji Nakamura, Takayuki Ohba, Shigeaki Zaima:
Characterization of local strain around trough silicon via interconnects in wafer-on-wafer structures. 3DIC 2011: 1-4
Coauthor Index
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