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"A holistic view of chip-level thermal architecture from heterogeneous ..."
Gamal Refai-Ahmed et al. (2015)
- Gamal Refai-Ahmed, Ivor Barber, Anthony Torza, Brian Philofsky:
A holistic view of chip-level thermal architecture from heterogeneous stacked dice to system level in telecoms applications. 3DIC 2015: TS10.1.1-TS10.1.4
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