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2020 – today
- 2023
[c12]S. Lee, N.-H. Lee, K. W. Lee, J. H. Kim, J. H. Jin, Y. S. Lee, Y. C. Hwang, H. S. Kim, S. Pae:
Development and Product Reliability Characterization of Advanced High Speed 14nm DDR5 DRAM with On-die ECC. IRPS 2023: 1-4- 2022
- [c11]Nam-Hyun Lee, Sunhang Lee, S.-H. Kim, G.-J. Kim, K. W. Lee, Y. S. Lee, Y. C. Hwang, H. S. Kim, S. Pae:
Transistor Reliability Characterization for Advanced DRAM with HK+MG & EUV process technology. IRPS 2022: 6
2010 – 2019
- 2015
- [c10]K. W. Lee, Ji Chel Bea, Mitsu Koyanagi, Takafumi Fukushima
, Tetsu Tanaka:
Advanced 2.5D/3D hetero-integration technologies at GINTI, Tohoku University. 3DIC 2015: FS2.1-FS2.5 - [c9]K. W. Lee, Chisato Nagai, Ai Nakamura, Hiroki Aizawa, Ji Chel Bea, Mitsumasa Koyanagi, Hideto Hashiguchi, Takafumi Fukushima, Tanaka Tanaka:
Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers. 3DIC 2015: TS1.2.1-TS1.2.4 - [c8]Mariappan Murugesan, Jichoel Bea, Hiroyuki Hashimoto, K. W. Lee, Mitsu Koyanagi, Takafumi Fukushima, Tetsu Tanaka:
Mitigating thermo mechanical stress in high-density 3D-LSI through dielectric liners in Cu- through silicon Via _ µ-RS and µ-XRD study. 3DIC 2015: TS8.10.1-TS8.10.5 - 2014
- [c7]K. W. Lee, Chisato Nagai, Ai Nakamura, Ji Chel Bea, Mariappan Murugesan, Takafumi Fukushima, Tanaka Tanaka, Mitsumasa Koyanagi:
Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV. 3DIC 2014: 1-4 - [c6]Mariappan Murugesan, Takafumi Fukushima, Ji Chel Bea, K. W. Lee, Mitsu Koyanagi, Y. Imai, S. Kimura, Tetsu Tanaka:
Micro-XRD investigation of fine-pitch Cu-TSV induced thermo-mechanical stress in high-density 3D-LSI. 3DIC 2014: 1-4 - 2010
- [j3]Bharath Kalyan, K. W. Lee, W. Sardha Wijesoma:
FISST-SLAM: Finite Set Statistical Approach to Simultaneous Localization and Mapping. Int. J. Robotics Res. 29(10): 1251-1262 (2010) - [c5]Bharath Kalyan, K. W. Lee, W. Sardha Wijesoma, Diluka Moratuwage, Nicholas M. Patrikalakis:
A random finite set based detection and tracking using 3D LIDAR in dynamic environments. SMC 2010: 2288-2292
2000 – 2009
- 2009
- [j2]K. S. Park, K. W. Lee, M. S. Park, D. Kim:
Joint use of DEA and constrained canonical correlation analysis for efficiency valuations involving categorical variables. J. Oper. Res. Soc. 60(12): 1775-1785 (2009) - 2004
- [c4]Javier Ibañez-Guzmán, W. Sardha Wijesoma, K. W. Lee:
Roadmap constrained SLAM in neighborhood environment. ICARCV 2004: 449-454 - 2000
- [j1]K. W. Lee:
Stochastic models for random-request availability. IEEE Trans. Reliab. 49(1): 80-84 (2000)
1990 – 1999
- 1995
- [c3]K. W. Lee, H. N. Lam:
Optimal Sizing of Feedforward Neural Networks: Case Studies. ANNES 1995: 79-82 - [c2]K. W. Lee, H. N. Lam:
Optimising neural network weights using genetic algorithms: a case study. ICNN 1995: 1384-1388
1980 – 1989
- 1987
- [c1]W. Yu, S. Y. Kang, K. W. Lee:
TDX-1: A Distributed System Architecture for High Throughout Telephone Switching. COMPCON 1987: 284-287
Coauthor Index
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