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ORCIDO. Varela Pedreira
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Journal Articles
- 2016
[j2]Kristof Croes, Joke De Messemaeker, Yunlong Li, Wei Guo, Olalla Varela Pedreira
, Vladimir Cherman, Michele Stucchi, Ingrid De Wolf, Eric Beyne:
Reliability Challenges Related to TSV Integration and 3-D Stacking. IEEE Des. Test 33(3): 37-45 (2016)- 2011
- [j1]Ingrid De Wolf, Kris Croes, O. Varela Pedreira, Riet Labie, Augusto Redolfi, M. Van De Peer, Kris Vanstreels, C. Okoro, Bart Vandevelde, Eric Beyne:
Cu pumping in TSVs: Effect of pre-CMP thermal budget. Microelectron. Reliab. 51(9-11): 1856-1859 (2011)
Conference and Workshop Papers
- 2024
- [c13]O. Varela Pedreira, Youqi Ding, D. Coenen, Philippe Roussel, A. S. Saleh, Veerle Simons, Houman Zahedmanesh, Ivan Ciofi, Kris Croes:
De-Coupling Thermo-Migration from Electromigration Using a Dedicated Test Structure. IRPS 2024: 1-5 - 2023
- [c12]Youqi Ding, O. Varela Pedreira, Melina Lofrano, Houman Zahedmanesh, T. Chavez, Hosain Farr, Ingrid De Wolf, Kris Croes:
Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters. IRPS 2023: 1-7 - [c11]Melina Lofrano, Herman Oprins, Xinyue Chang, Bjorn Vermeersch, Olalla Varela Pedreira, Alicja Lesniewska, Vladimir Cherman, Ivan Ciofi, Kristof Croes, Seongho Park, Zsolt Tokei:
Towards accurate temperature prediction in BEOL for reliability assessment (Invited). IRPS 2023: 1-7 - [c10]Olalla Varela Pedreira, Houman Zahedmanesh, Youqi Ding, Ivan Ciofi, Kristof Croes:
Challenges for Interconnect Reliability: From Element to System Level. ISPD 2023: 106 - 2022
- [c9]O. Varela Pedreira, Melina Lofrano, Houman Zahedmanesh, Philippe J. Roussel, Marleen H. van der Veen, Veerle Simons, Emmanuel Chery, Ivan Ciofi, Kris Croes:
Assessment of critical Co electromigration parameters. IRPS 2022: 8 - [c8]Gayle Murdoch, Matin O'Toole, Giulio Marti, Ankit Pokhrel, Diana Tsvetanova, Stefan Decoster, Shreya Kundu, Yusuke Oniki, Arame Thiam, Quoc Toan Le, Olalla Varela Pedreira, Alicja Lesniewska, Gerardo Martinez-Alanis, Seongho Park, Zsolt Tokei:
First demonstration of Two Metal Level Semi-damascene Interconnects with Fully Self-aligned Vias at 18MP. VLSI Technology and Circuits 2022: 1-2 - 2021
- [c7]Alicja Lesniewska, Olalla Varela Pedreira, Melina Lofrano, Gayle Murdoch, Marleen H. van der Veen, Anish Dangol, Naoto Horiguchi, Zsolt Tökei, Kris Croes:
Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps. IRPS 2021: 1-6 - [c6]Houman Zahedmanesh, Olalla Varela Pedreira, Zsolt Tokei, Kristof Croes:
Electromigration limits of copper nano-interconnects. IRPS 2021: 1-6 - 2020
- [c5]Olalla Varela Pedreira, Michele Stucchi, Anshul Gupta, Victor Vega-Gonzalez, Marleen van der Veen, Stephane Lariviere, Christopher J. Wilson, Zsolt Tökei, Kristof Croes:
Metal reliability mechanisms in Ruthenium interconnects. IRPS 2020: 1-7 - 2019
- [c4]Sofie Beyne, Olalla Varela Pedreira, Ingrid De Wolf, Zsolt Tökei, Kristof Croes:
Low-Frequency Noise Measurements to Characterize Cu-Electromigration Down to 44nm Metal Pitch. IRPS 2019: 1-6 - 2018
- [c3]Chen Wu, O. Varela Pedreira, Alicja Lesniewska, Yunlong Li, Ivan Ciofi, Zsolt Tökei, Kris Croes:
Insights into metal drift induced failure in MOL and BEOL. IRPS 2018: 3 - [c2]Sofie Beyne, Shibesh Dutta, Olalla Varela Pedreira, Niels Bosman, Christoph Adelmann, Ingrid De Wolf, Zsolt Tökei, Kristof Croes:
The first observation of p-type electromigration failure in full ruthenium interconnects. IRPS 2018: 6 - 2015
- [c1]Joke De Messemaeker, O. Varela Pedreira, A. Moussa, Nabi Nabiollahi, Kris Vanstreels, Stefaan Van Huylenbroeck, Harold Philipsen, Patrick Verdonck, Bart Vandevelde, Ingrid De Wolf, Eric Beyne, Kris Croes:
Impact of oxide liner properties on TSV Cu pumping and TSV stress. IRPS 2015: 4
Coauthor Index
aka: Kristof Croes
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