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"Cu pumping in TSVs: Effect of pre-CMP thermal budget."

Ingrid De Wolf et al. (2011)

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DOI: 10.1016/J.MICROREL.2011.06.003

access: closed

type: Journal Article

metadata version: 2023-05-01

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  - https://dblp.org/rec/journals/mr/WolfCPLRPVOVB11
Ingrid De Wolf, Kris Croes, O. Varela Pedreira, Riet Labie, Augusto Redolfi, M. Van De Peer, Kris Vanstreels, C. Okoro, Bart Vandevelde, Eric Beyne:
Cu pumping in TSVs: Effect of pre-CMP thermal budget. Microelectron. Reliab. 51(9-11): 1856-1859 (2011)

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