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"Thermomigration-induced void formation in Cu-interconnects - Assessment of ..."

Youqi Ding et al. (2023)

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DOI: 10.1109/IRPS48203.2023.10117870

access: closed

type: Conference or Workshop Paper

metadata version: 2024-05-07

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  - conf/irps/DingPLZCFWC23
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Youqi Ding, O. Varela Pedreira, Melina Lofrano, Houman Zahedmanesh, T. Chavez, Hosain Farr, Ingrid De Wolf, Kris Croes:
Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters. IRPS 2023: 1-7

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