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ORCIDMicroelectronics Reliability, Volume 74
Volume 74, July 2017
- Lei Song, Zhiyuan Hu, Mengying Zhang, Xiaonian Liu, Lihua Dai, Zhengxuan Zhang, Shichang Zou:
Influences of silicon-rich shallow trench isolation on total ionizing dose hardening and gate oxide integrity in a 130 nm partially depleted SOI CMOS technology. 1-8 - Chun-Hsing Shih, Yen-Hsiang Lo, Yu-Hsuan Chen, Jr-Jie Tsai:
Impact of gate-to-source/drain misalignments on source-side injection Schottky barrier charge-trapping memory cells evaluated using numerical programming-trapping iterations. 9-14 - Huizhen Huang, Gewang Shuai, Xiuqin Wei, Chuanqiang Yin:
Effects of sulfur addition on the wettability and corrosion resistance of Sn-0.7Cu lead-free solder. 15-21 - Chun-Yu Chen, Jyi-Tsong Lin, Meng-Hsueh Chiang
:
Threshold-voltage variability analysis and modeling for junctionless double-gate transistors. 22-26 - Qingchuan He, Wenhua Chen, Jun Pan, Ping Qian:
A prognostic method for predicting failure of dc/dc converter. 27-33 - Delong Qiu, Liqiang Cao, Qidong Wang, Fengze Hou, Xugang Wang:
Experimental and numerical study of 3D stacked dies under forced air cooling and water immersion cooling. 34-43 - Rituparna Ghosh, Anwesha Kanjilal, Praveen Kumar:
Effect of type of thermo-mechanical excursion on growth of interfacial intermetallic compounds in Cu/Sn-Ag-Cu solder joints. 44-51 - Zhiheng Liao, Chunsheng Guo, Ju Meng, Boyang Jiang, Li Gao, Ya Su, Ruomin Wang, Shiwei Feng:
Thermal evaluation of GaN-based HEMTs with various layer sizes and structural parameters using finite-element thermal simulation. 52-57 - Stanislav Popelka, Pavel Hazdra, V. Záhlava:
Operation of 4H-SiC high voltage normally-OFF V-JFET in radiation hard conditions: Simulations and experiment. 58-66 - Abderrahmane Baïri:
Junction temperature of QFN32 and 64 electronic devices subjected to free convection. Effects of the resin's thermal conductivity. 67-73 - Lihua Dai, Xiaonian Liu, Mengying Zhang, Leqing Zhang, Zhiyuan Hu, Dawei Bi, Zhengxuan Zhang, Shichang Zou:
Degradation induced by TID radiation and hot-carrier stress in 130-nm short channel PDSOI NMOSFETs. 74-80 - Chong Leong Gan, Mohamad Zainudeen Moideen:
Soft error mechanisms, modeling and mitigation. Springer (2016). 81 - Mohammad Azarifar, Nazli Donmezer:
A multiscale analytical correction technique for two-dimensional thermal models of AlGaN/GaN HEMTs. 82-87 - Anirban Sengupta, Deepak Kachave:
Low cost fault tolerance against kc-cycle and km-unit transient for loop based control data flow graphs during physically aware high level synthesis. 88-99 - Xin-long Liu, Zhenbing Cai, Shan-bang Liu, Jin-fang Peng, Minhao Zhu:
Effect of roughness on electrical contact performance of electronic components. 100-109 - Hung-Wei Chen, Mi-Chang Chang:
Improving the ESD self-protection capability of 60 V HV p-channel LDMOS large array device in 0.25 μm BCD process. 110-117 - Artur Wymyslowski:
Guest Editorial: 2016 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. 118-120 - David Leslie, Abhijit Dasgupta, Carlos Morillo:
Viscoplastic properties of pressure-less sintered silver materials using indentation. 121-130 - Bart Vandevelde, Filip Vanhee, Davy Pissoort, Lieven Degrendele, Johan de Baets, Bart Allaert, Ralph Lauwaert, Franco Zanon, Riet Labie, Geert Willems:
Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components. 131-135 - Jens Heilmann, Ivan Nikitin, Uwe Zschenderlein, Daniel May, Klaus Pressel, Bernhard Wunderle:
Reliability experiments of sintered silver based interconnections by accelerated isothermal bending tests. 136-146 - Ali Mazloum-Nejadari, Golta Khatibi, Bernhard Czerny, Martin Lederer, Johann Nicolics, L. Weiss:
Reliability of Cu wire bonds in microelectronic packages. 147-154 - Marta Kuczynska, Natalja Schafet, Ulrich Becker, B. Métais, Alexander Kabakchiev, P. Buhl, Stefan Weihe:
The role of stress state and stress triaxiality in lifetime prediction of solder joints in different packages utilized in automotive electronics. 155-164 - Alicja Palczynska, Alexandru Prisacaru, Przemyslaw Jakub Gromala, Bongtae Han, Dirk Mayer, Tobias Melz:
Towards prognostics and health monitoring: The potential of fault detection by piezoresistive silicon stress sensor. 165-172 - Cheng Qian, Yun Li, Jiajie Fan, Xuejun Fan, Jiajia Fu, Lixia Zhao, Guoqi Zhang:
Studies of the light output properties for a GaN based blue LED using an electro-optical simulation method. 173-178 - Jiajie Fan, Chaohua Yu, Cheng Qian, Xuejun Fan, Guoqi Zhang:
Thermal/luminescence characterization and degradation mechanism analysis on phosphor-converted white LED chip scale packages. 179-185
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