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"Degradation Estimation and Prediction of Electronic Packages Using ..."

Alexandru Prisacaru et al. (2022)

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DOI: 10.1109/TIE.2021.3068681

access: closed

type: Journal Article

metadata version: 2023-08-28

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  - https://dblp.org/rec/journals/tie/PrisacaruGHZ22
Alexandru Prisacaru, Przemyslaw Gromala, Bongtae Han, Guo Qi Zhang:
Degradation Estimation and Prediction of Electronic Packages Using Data-Driven Approach. IEEE Trans. Ind. Electron. 69(3): 2996-3006 (2022)

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