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Simon Gousseau

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Journal Articles

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2015
[j1]
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  - journals/mr/GousseauMBFMIBZ15
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  - https://dblp.org/rec/journals/mr/GousseauMBFMIBZ15
Simon Gousseau, Stéphane Moreau, David Bouchu, Alexis Farcy, Pierre Montmitonnet, Karim Inal, François Bay, Marc Zelsmann, Emmanuel Picard, Mathieu Salaün:
Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influence. Microelectron. Reliab. 55(8): 1205-1213 (2015)

Conference and Workshop Papers

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2018
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  - conf/irps/ArnaudMJJLFEEBB18
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Lucile Arnaud, Stéphane Moreau, Amadine Jouve, Imed Jani, Didier Lattard, F. Fournel, C. Euvrard, Y. Exbrayat, Viorel Balan, Nicolas Bresson, S. Lhostis, J. Jourdon, E. Deloffre, S. Guillaumet, Alexis Farcy, Simon Gousseau, M. Arnoux:
Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability. IRPS 2018: 4

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