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"Fine pitch 3D interconnections with hybrid bonding technology: From ..."

Lucile Arnaud et al. (2018)

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DOI: 10.1109/IRPS.2018.8353591

access: closed

type: Conference or Workshop Paper

metadata version: 2023-08-28

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  dblp key:
  - conf/irps/ArnaudMJJLFEEBB18
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  - https://dblp.org/rec/conf/irps/ArnaudMJJLFEEBB18
Lucile Arnaud, Stéphane Moreau, Amadine Jouve, Imed Jani, Didier Lattard, F. Fournel, C. Euvrard, Y. Exbrayat, Viorel Balan, Nicolas Bresson, S. Lhostis, J. Jourdon, E. Deloffre, S. Guillaumet, Alexis Farcy, Simon Gousseau, M. Arnoux:
Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability. IRPS 2018: 4

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