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Lucile Arnaud
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2020 – today
- 2022
- [c10]Aziliz Le Clainche, Camille Nasarre, Jing Qian, Juliette Barraux, Emma Plumey, Lucile Arnaud, Solène Cauchie, Philippe Meis:
Apocalypse Dog. SIGGRAPH Asia Computer Animation Festival 2022: 9:1 - 2021
- [j3]Pascal Vivet, Eric Guthmuller, Yvain Thonnart, Gaël Pillonnet, César Fuguet Tortolero, Ivan Miro-Panades, Guillaume Moritz, Jean Durupt, Christian Bernard, Didier Varreau, Julian J. H. Pontes, Sébastien Thuries, David Coriat, Michel Harrand, Denis Dutoit, Didier Lattard, Lucile Arnaud, Jean Charbonnier, Perceval Coudrain, Arnaud Garnier, Frédéric Berger, Alain Gueugnot, Alain Greiner, Quentin L. Meunier, Alexis Farcy, Alexandre Arriordaz, Séverine Cheramy, Fabien Clermidy:
IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management. IEEE J. Solid State Circuits 56(1): 79-97 (2021) - [c9]Christophe Dubarry, Lucile Arnaud, Maria-Luisa Calvo-Muñoz, Gaëlle Mauguen, Stéphane Moreau, R. Crochemore, Nicolas Bresson, Bernard Aventurier:
3D interconnection using copper direct hybrid bonding for GaN on silicon wafer. 3DIC 2021: 1-4 - 2020
- [c8]Pascal Vivet, Eric Guthmuller, Yvain Thonnart, Gaël Pillonnet, Guillaume Moritz, Ivan Miro-Panades, César Fuguet Tortolero, Jean Durupt, Christian Bernard, Didier Varreau, Julian J. H. Pontes, Sébastien Thuries, David Coriat, Michel Harrand, Denis Dutoit, Didier Lattard, Lucile Arnaud, Jean Charbonnier, Perceval Coudrain, Arnaud Garnier, Frédéric Berger, Alain Gueugnot, Alain Greiner, Quentin L. Meunier, Alexis Farcy, Alexandre Arriordaz, Séverine Cheramy, Fabien Clermidy:
2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm2 Inter-Chiplet Interconnects and 156mW/mm2@ 82%-Peak-Efficiency DC-DC Converters. ISSCC 2020: 46-48
2010 – 2019
- 2019
- [c7]Imed Jani, Didier Lattard, Pascal Vivet, Lucile Arnaud, Edith Beigné:
Misalignment Analysis and Electrical Performance of High Density 3D-IC interconnects. 3DIC 2019: 1-4 - 2018
- [c6]Imed Jani, Didier Lattard, Pascal Vivet, Lucile Arnaud, Edith Beigné:
BISTs for post-bond test and electrical analysis of high density 3D interconnect defects. ETS 2018: 1-6 - [c5]Lucile Arnaud, Stéphane Moreau, Amadine Jouve, Imed Jani, Didier Lattard, F. Fournel, C. Euvrard, Y. Exbrayat, Viorel Balan, Nicolas Bresson, S. Lhostis, J. Jourdon, E. Deloffre, S. Guillaumet, Alexis Farcy, Simon Gousseau, M. Arnoux:
Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability. IRPS 2018: 4 - 2016
- [c4]Séverine Cheramy, Amandine Jouve, Lucile Arnaud, Claire Fenouillet-Béranger, Perrine Batude, Maud Vinet:
Towards high density 3D interconnections. 3DIC 2016: 1-2 - [c3]Séverine Cheramy, Amadine Jouve, Lucile Arnaud, Claire Fenouillet-Béranger, Perrine Batude, Maud Vinet:
Towards high density 3D interconnections. 3DIC 2016: 1-5 - [c2]Didier Lattard, Lucile Arnaud, Arnaud Garnier, Nicolas Bresson, Franck Bana, R. Segaud, Amadine Jouve, H. Jacquinot, Stéphane Moreau, Karim Azizi-Mourier, C. Chantre, Pascal Vivet, Gaël Pillonnet, F. Casset, F. Ponthenier, Alexis Farcy, S. Lhostis, Jean Michailos, Alexandre Arriordaz, Séverine Cheramy:
ITAC: A complete 3D integration test platform. 3DIC 2016: 1-4 - 2015
- [c1]Giulio Marti, Lucile Arnaud, David Ney, Yves Wouters:
Interconnect design study for electromigration reliability improvement. IRPS 2015: 2 - 2014
- [j2]Giulio Marti, Lucile Arnaud, Yves Wouters:
Study of EM void nucleation and mechanic relaxation effects. Microelectron. Reliab. 54(9-10): 1692-1696 (2014) - 2013
- [j1]Thomas Frank, Stéphane Moreau, Cédrick Chappaz, Patrick Leduc, Lucile Arnaud, Aurélie Thuaire, Emmanuel Chery, F. Lorut, Lorena Anghel, Gilles Poupon:
Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric. Microelectron. Reliab. 53(1): 17-29 (2013)
Coauthor Index
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