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Deuk Hyoun Heo
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Publications
- 2023
- [c28]Chukwufumnanya Ogbogu, Soumen Mohapatra, Biresh Kumar Joardar, Janardhan Rao Doppa, Deuk Heo, Krishnendu Chakrabarty, Partha Pratim Pande:
Energy-Efficient ReRAM-Based ML Training via Mixed Pruning and Reconfigurable ADC. ISLPED 2023: 1-6 - 2022
- [j34]Zhiyuan Zhou, Nghia Tang, Bai Nguyen, Wookpyo Hong, Partha Pratim Pande, Ram K. Krishnamurthy, Deukhyoun Heo:
An Inductor-First Single-Inductor Multiple-Output Hybrid DC-DC Converter With Integrated Flying Capacitor for SoC Applications. IEEE Trans. Circuits Syst. I Regul. Pap. 69(12): 4823-4836 (2022) - 2020
- [j30]Aqeeb Iqbal Arka, Srinivasan Gopal, Janardhan Rao Doppa, Deukhyoun Heo, Partha Pratim Pande:
Making a Case for Partially Connected 3D NoC: NFIC versus TSV. ACM J. Emerg. Technol. Comput. Syst. 16(4): 41:1-41:17 (2020) - [j28]Wookpyo Hong, Zhiyuan Zhou, Bai Nguyen, Nghia Tang, Jong-Hoon Kim, Partha Pratim Pande, Deukhyoun Heo:
Analysis and Design Method of Multiple-Output Switched-Capacitor Voltage Regulators With a Reduced Number of Power Electronic Components. IEEE Trans. Circuits Syst. I Regul. Pap. 67-I(9): 3234-3247 (2020) - [j27]Srinivasan Gopal, Sourav Das, Partha Pratim Pande, Deukhyoun Heo:
A Hybrid 3D Interconnect With 2x Bandwidth Density Employing Orthogonal Simultaneous Bidirectional Signaling for 3D NoC. IEEE Trans. Circuits Syst. 67-I(11): 3919-3932 (2020) - [c26]Zhiyuan Zhou, Nghia Tang, Bai Noi Nguyen, Wookpyo Hong, Partha Pratim Pande, Deukhyoun Heo:
A Wide Output Voltage Range Single-Input-Multi-Output Hybrid DC-DC Converter Achieving 87.5% Peak Efficiency With a Fast Response Time and Low Cross Regulation for DVFS Applications. CICC 2020: 1-4 - [c25]Zhiyuan Zhou, Syrine Belakaria, Aryan Deshwal, Wookpyo Hong, Janardhan Rao Doppa, Partha Pratim Pande, Deukhyoun Heo:
Design of Multi-Output Switched-Capacitor Voltage Regulator via Machine Learning. DATE 2020: 502-507 - 2019
- [j22]Massimo Alioto, Magdy S. Abadir, Tughrul Arslan, Chirn Chye Boon, Andreas Burg, Chip-Hong Chang, Meng-Fan Chang, Yao-Wen Chang, Poki Chen, Pasquale Corsonello, Paolo Crovetti, Shiro Dosho, Rolf Drechsler, Ibrahim Abe M. Elfadel, Ruonan Han, Masanori Hashimoto, Chun-Huat Heng, Deukhyoun Heo, Tsung-Yi Ho, Houman Homayoun, Yuh-Shyan Hwang, Ajay Joshi, Rajiv V. Joshi, Tanay Karnik, Chulwoo Kim, Tony Tae-Hyoung Kim, Jaydeep Kulkarni, Volkan Kursun, Yoonmyung Lee, Hai Helen Li, Huawei Li, Prabhat Mishra, Baker Mohammad, Mehran Mozaffari Kermani, Makoto Nagata, Koji Nii, Partha Pratim Pande, Bipul C. Paul, Vasilis F. Pavlidis, José Pineda de Gyvez, Ioannis Savidis, Patrick Schaumont, Fabio Sebastiano, Anirban Sengupta, Mingoo Seok, Mircea R. Stan, Mark M. Tehranipoor, Aida Todri-Sanial, Marian Verhelst, Valerio Vignoli, Xiaoqing Wen, Jiang Xu, Wei Zhang, Zhengya Zhang, Jun Zhou, Mark Zwolinski, Stacey Weber:
Editorial TVLSI Positioning - Continuing and Accelerating an Upward Trajectory. IEEE Trans. Very Large Scale Integr. Syst. 27(2): 253-280 (2019) - [j21]Wookpyo Hong, Bai Nguyen, Zhiyuan Zhou, Nghia Tang, Jong-Hoon Kim, Partha Pratim Pande, Deukhyoun Heo:
A Dual-Output Step-Down Switched-Capacitor Voltage Regulator With a Flying Capacitor Crossing Technique for Enhanced Power Efficiency. IEEE Trans. Very Large Scale Integr. Syst. 27(12): 2861-2871 (2019) - 2018
- [j20]Srinivasan Gopal, Pawan Agarwal, Joe Baylon, Luke Renaud, Sheikh Nijam Ali, Partha Pratim Pande, Deukhyoun Heo:
A Spatial Multi-Bit Sub-1-V Time-Domain Matrix Multiplier Interface for Approximate Computing in 65-nm CMOS. IEEE J. Emerg. Sel. Topics Circuits Syst. 8(3): 506-518 (2018) - [j19]Pawan Agarwal, Jong-Hoon Kim, Partha Pratim Pande, Deukhyoun Heo:
Zero-Power Feed-Forward Spur Cancelation for Supply-Regulated CMOS Ring PLLs. IEEE Trans. Very Large Scale Integr. Syst. 26(4): 653-662 (2018) - [j18]Joe Baylon, Xinmin Yu, Srinivasan Gopal, Reza Molavi, Shahriar Mirabbasi, Partha Pratim Pande, Deukhyoun Heo:
A 16-Gb/s Low-Power Inductorless Wideband Gain-Boosted Baseband Amplifier With Skewed Differential Topology for Wireless Network-on-Chip. IEEE Trans. Very Large Scale Integr. Syst. 26(11): 2406-2418 (2018) - [j17]Srinivasan Gopal, Sourav Das, Pawan Agarwal, Sheikh Nijam Ali, Deukhyoun Heo, Partha Pratim Pande:
High-Performance and Small-Form Factor Near-Field Inductive Coupling for 3-D NoC. IEEE Trans. Very Large Scale Integr. Syst. 26(12): 2921-2934 (2018) - 2017
- [j16]Xian Li, Karthi Duraisamy, Joe Baylon, Turbo Majumder, Guopeng Wei, Paul Bogdan, Deukhyoun Heo, Partha Pratim Pande:
A Reconfigurable Wireless NoC for Large Scale Microbiome Community Analysis. IEEE Trans. Computers 66(10): 1653-1666 (2017) - [c19]Sourav Das, Srinivasan Gopal, Deukhyoun Heo, Partha Pratim Pande:
Energy-efficient and robust 3D NoCs with contactless vertical links (Invited paper). ICCAD 2017: 1-6 - [c18]Srinivasan Gopal, Sourav Das, Deukhyoun Heo, Partha Pratim Pande:
Energy and Area Efficient Near Field Inductive Coupling: A Case Study on 3D NoC. NOCS 2017: 5:1-5:8 - 2015
- [j14]Jacob Murray, Nghia Tang, Partha Pratim Pande, Deukhyoun Heo, Behrooz A. Shirazi:
DVFS Pruning for Wireless NoC Architectures. IEEE Des. Test 32(2): 29-38 (2015) - [j13]Xinmin Yu, Hooman Rashtian, Shahriar Mirabbasi, Partha Pratim Pande, Deuk Hyoun Heo:
An 18.7-Gb/s 60-GHz OOK Demodulator in 65-nm CMOS for Wireless Network-on-Chip. IEEE Trans. Circuits Syst. I Regul. Pap. 62-I(3): 799-806 (2015) - 2014
- [j10]Xinmin Yu, Joe Baylon, Paul Wettin, Deuk Hyoun Heo, Partha Pratim Pande, Shahriar Mirabbasi:
Architecture and Design of Multichannel Millimeter-Wave Wireless NoC. IEEE Des. Test 31(6): 19-28 (2014) - [j9]Paul Wettin, Ryan Gary Kim, Jacob Murray, Xinmin Yu, Partha Pratim Pande, Amlan Ganguly, Deuk Hyoun Heo:
Design Space Exploration for Wireless NoCs Incorporating Irregular Network Routing. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 33(11): 1732-1745 (2014) - [c16]Paul Wettin, Jacob Murray, Ryan Gary Kim, Xinmin Yu, Partha Pratim Pande, Deuk Hyoun Heo:
Performance evaluation of wireless NoCs in presence of irregular network routing strategies. DATE 2014: 1-6 - [c15]Jacob Murray, Paul Wettin, Ryan Gary Kim, Xinmin Yu, Partha Pratim Pande, Behrooz A. Shirazi, Deuk Hyoun Heo:
Thermal hotspot reduction in mm-Wave wireless NoC architectures. ISQED 2014: 645-652 - [c14]Radu Marculescu, Partha Pratim Pande, Deuk Hyoun Heo, Hiroki Matsutani:
Introduction to the special session on "Interconnect enhances architecture: Evolution of wireless NoC from planar to 3D". NOCS 2014: 174-175 - 2013
- [j5]Sujay Deb, Kevin Chang, Xinmin Yu, Suman Prasad Sah, Miralem Cosic, Amlan Ganguly, Partha Pratim Pande, Benjamin Belzer, Deuk Hyoun Heo:
Design of an Energy-Efficient CMOS-Compatible NoC Architecture with Millimeter-Wave Wireless Interconnects. IEEE Trans. Computers 62(12): 2382-2396 (2013) - [c13]Paul Wettin, Partha Pratim Pande, Deuk Hyoun Heo, Benjamin Belzer, Sujay Deb, Amlan Ganguly:
Design space exploration for reliable mm-wave wireless NoC architectures. ASAP 2013: 79-82 - 2012
- [j4]Sujay Deb, Amlan Ganguly, Partha Pratim Pande, Benjamin Belzer, Deuk Hyoun Heo:
Wireless NoC as Interconnection Backbone for Multicore Chips: Promises and Challenges. IEEE J. Emerg. Sel. Topics Circuits Syst. 2(2): 228-239 (2012) - [j2]Kevin Chang, Sujay Deb, Amlan Ganguly, Xinmin Yu, Suman Prasad Sah, Partha Pratim Pande, Benjamin Belzer, Deuk Hyoun Heo:
Performance evaluation and design trade-offs for wireless network-on-chip architectures. ACM J. Emerg. Technol. Comput. Syst. 8(3): 23:1-23:25 (2012) - [c10]Sujay Deb, Kevin Chang, Miralem Cosic, Amlan Ganguly, Partha Pratim Pande, Deuk Hyoun Heo, Benjamin Belzer:
CMOS compatible many-core noc architectures with multi-channel millimeter-wave wireless links. ACM Great Lakes Symposium on VLSI 2012: 165-170 - [c9]Sujay Deb, Kevin Chang, Amlan Ganguly, Xinmin Yu, Christof Teuscher, Partha Pratim Pande, Deuk Hyoun Heo, Benjamin Belzer:
Design of an efficient NoC architecture using millimeter-wave wireless links. ISQED 2012: 165-172 - 2010
- [c8]Sujay Deb, Amlan Ganguly, Kevin Chang, Partha Pratim Pande, Benjamin Belzer, Deuk Hyoun Heo:
Enhancing performance of network-on-chip architectures with millimeter-wave wireless interconnects. ASAP 2010: 73-80
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