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ORCIDMicroelectronics Reliability, Volume 71
Volume 71, April 2017
- Jizhi Liu, Qian Lingli, Tian Rui, Zhiwei Liu, Zhao Liu, Cheng Hui:
Self-triggered stacked silicon-controlled rectifier structure (STSSCR) for on-chip electrostatic discharge (ESD) protection. 1-5 - Claudiu Ionita
, Muhammad Nawaz, Kalle Ilves:
On the short-circuit and avalanche ruggedness reliability assessment of SiC MOSFET modules. 6-16 - M. Shokravi:
Dynamic pull-in and pull-out analysis of viscoelastic nanoplates under electrostatic and Casimir forces via sinusoidal shear deformation theory. 17-28 - Junji Sakamoto, Hisakazu Ohara, Tadahiro Shibutani:
Finite element analysis of thermal and mechanical stresses due to the grain anisotropy of polycrystalline β-Sn. 29-34 - Brendan Ubochi, Soroush Faramehr, Khaled Ahmeda, Petar Igic, Karol Kalna:
Operational frequency degradation induced trapping in scaled GaN HEMTs. 35-40 - Hyungseok Yoon, Kwang-Seong Choi, Hyun-Cheol Bae, Jong-Tae Moon, Yong-Sung Eom, Insu Jeon:
Evaluating the material properties of underfill for a reliable 3D TSV integration package using numerical analysis. 41-50 - Qi Chen, Run Hu, Xiaobing Luo:
A statistical study to identify the effects of packaging structures on lumen reliability of LEDs. 51-55 - Furat Al-Obaidy, Farhang Yazdani, Farah A. Mohammadi:
Fault detection using thermal image based on soft computing methods: Comparative study. 56-64 - Xuecheng Du, Shuhuan Liu, Dongyang Luo, Yao Zhang, Xiaozhi Du, Chaohui He, Xiaotang Ren, Weitao Yang, Yuan Yuan:
Single event effects sensitivity of low energy proton in Xilinx Zynq-7010 system-on chip. 65-70 - Shuibao Liang, Changbo Ke, Wenjing Ma, Minbo Zhou, Xinping Zhang:
Numerical simulations of migration and coalescence behavior of microvoids driven by diffusion and electric field in solder interconnects. 71-81 - Hiep Tran, Masturina Kracica, Dougal McCulloch, Edwin Mayes, Anthony Holland, James Partridge:
Energetic deposition, measurement and simulation of graphitic contacts to 6H-SiC. 82-85 - Peijian Zhang, Xue Wu, Qianning Yi, Wensuo Chen, Yonghui Yang, Kunfeng Zhu, Kaizhou Tan, Yi Zhong:
A comparison of the effects of cobalt-60 γ ray irradiation on DPSA bipolar transistors at high and low injection levels. 86-90 - Alice Lassnig, Martin Lederer, Golta Khatibi, Rainer Pelzer, W. Robl, Michael Nelhiebel:
High cycle fatigue testing of thermosonic ball bonds. 91-98 - Rongmei Chen, Wei Chen, Xiaoqiang Guo, Chen Shen, Fengqi Zhang, Lisang Zheng, Wen Zhao, Lili Ding, Yinhong Luo, Hongxia Guo, Yuanming Wang, Yinong Liu:
Improved on-chip self-triggered single-event transient measurement circuit design and applications. 99-105 - L. Liu, S. Li, Y. M. Zhou, L. Y. Liu, Xian An Cao:
High-current stressing of organic light-emitting diodes with different electron-transport materials. 106-110 - Jiang Xia, Guoyuan Li, Bin Li, LanXian Cheng, Bin Zhou:
Fatigue life prediction of Package-on-Package stacking assembly under random vibration loading. 111-118 - Byung-Suk Lee, Yong-Ho Ko, Jung-Hwan Bang, Chang-Woo Lee, Sehoon Yoo, Jun-Ki Kim, Jeong-Won Yoon:
Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications. 119-125 - Shihai Tan, Jing Han, Fu Guo:
Effects of twin grain boundaries on the subgrain rotation of the solder joint during thermal shock. 126-133 - Yilong Chen, Jianyuan Jia, Hongzhi Fu, Zhaofei Zhu:
Development of numerical algorithm to guide solder joint structure and component structural design during manufacturing. 134-142
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