"Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and ..."

Byung-Suk Lee et al. (2017)

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DOI: 10.1016/J.MICROREL.2017.03.011

access: closed

type: Journal Article

metadata version: 2025-07-04

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Byung-Suk Lee, Yong-Ho Ko, Jung-Hwan Bang, Chang-Woo Lee, Sehoon Yoo, Jun-Ki Kim, Jeong-Won Yoon:
Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications. Microelectron. Reliab. 71: 119-125 (2017)

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