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"Evaluating the material properties of underfill for a reliable 3D TSV ..."

Hyungseok Yoon et al. (2017)

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DOI: 10.1016/J.MICROREL.2017.02.010

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/YoonCBMEJ17
Hyungseok Yoon, Kwang-Seong Choi, Hyun-Cheol Bae, Jong-Tae Moon, Yong-Sung Eom, Insu Jeon:
Evaluating the material properties of underfill for a reliable 3D TSV integration package using numerical analysis. Microelectron. Reliab. 71: 41-50 (2017)

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