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Publication search results
found 39 matches
- 2018
- Kuan-Ting Chen, Ren-Yu He, Chia-Feng Lee, Ming-Ting Wu, Shu-Tong Chang:
Compact conduction band model for transition-metal dichalcogenide alloys. Microelectron. Reliab. 83: 223-229 (2018) - Shun-Tong Chen, Sheng-min Lin:
Development of a capacitive sensing technology for the measurement of perpendicularity in the narrow, deep slot-walls of micromolds. Microelectron. Reliab. 83: 216-222 (2018) - Hsien-Chin Chiu, Shang-Cyun Chen, Jiun-Wei Chiu, Bo-Hong Li, Hou-Yu Wang, Li-Yi Peng, Hsiang-Chun Wang, Kuang-Po Hsueh:
AlGaN/GaN Schottky barrier diodes on silicon substrates with various Fe doping concentrations in the buffer layers. Microelectron. Reliab. 83: 238-241 (2018) - Jung-Chuan Chou, Siao-Jie Yan, Yi-Hung Liao, Chih-Hsien Lai, Jian-Syun Chen, Hsiang-Yi Chen, Cian-Yi Wu, You-Xiang Wu:
Reaction of NiO film on flexible substrates with buffer solutions and application to flexible arrayed lactate biosensor. Microelectron. Reliab. 83: 249-253 (2018) - Deepak Kumar Dubey, Meenu Singh, Snehasis Sahoo, Jwo-Huei Jou:
Simple-structured efficient white organic light emitting diode via solution process. Microelectron. Reliab. 83: 293-296 (2018) - Rainer Dudek, M. Hildebrand, Sven Rzepka, T. Fries, Ralf Döring, Bettina Seiler, R. W. Ortmann:
Combined simulation and optical measurement technique for investigation of system effects on components solder fatigue. Microelectron. Reliab. 83: 162-172 (2018) - Peter Ersland, Roberto Menozzi:
Editorial. Microelectron. Reliab. 83: 206 (2018) - Joseph Favata, Sina Shahbazmohamadi:
Realistic non-destructive testing of integrated circuit bond wiring using 3-D X-ray tomography, reverse engineering, and finite element analysis. Microelectron. Reliab. 83: 91-100 (2018) - Asit Kumar Gain, Liangchi Zhang:
High-temperature and humidity change the microstructure and degrade the material properties of tin‑silver interconnect material. Microelectron. Reliab. 83: 101-110 (2018) - Chang-Fu Han, Yi-Zhe Guo, Chung-Jen Chung, Chang-Hong Shen, Jen-Fin Lin:
Effects of SiO2 film thickness and operating temperature on thermally-induced failures in through-silicon-via structures. Microelectron. Reliab. 83: 1-13 (2018) - Kazunori Hasegawa, Kousuke Tsuzaki, Shinichi Nishizawa:
DC-bias-voltage dependence of degradation of aluminum electrolytic capacitors. Microelectron. Reliab. 83: 115-118 (2018) - Guo-Lun Huang, Wei-Hao Fu, Chun-Yu Lin:
Investigation and application of vertical NPN devices for RF ESD protection in BiCMOS technology. Microelectron. Reliab. 83: 271-280 (2018) - Yongle Huang, Yifei Luo, Fei Xiao, Binli Liu:
Temperature monitoring inside IGBT modules at forward bias from the cross section and its finite element analysis. Microelectron. Reliab. 83: 187-197 (2018) - Sheng-Lyang Jang, Chih-Chiang Kang, Huan-Chun Wang, Miin-Horng Juang:
Dual-resonance concurrent oscillator. Microelectron. Reliab. 83: 208-215 (2018) - P. C. Juan, K. C. Lin, H. Y. Chu, Y. C. Kuo, H. W. Wang, T. Y. Shih:
Ferroelectric of HfO2 dielectric layer sputtered with TiN or ZrN for sandwich-like metal-insulator-metal capacitors. Microelectron. Reliab. 83: 242-248 (2018) - Hyunwoo Kim, DongJoon Kim, No-Cheol Park, Young-Pil Park:
Acoustic noise and vibration analysis of solid state drive induced by multi-layer ceramic capacitors. Microelectron. Reliab. 83: 136-145 (2018) - Erry Dwi Kurniawan, Hao Yang, Chia-Chou Lin, Yung-Chun Wu:
Effect of fin shape of tapered FinFETs on the device performance in 5-nm node CMOS technology. Microelectron. Reliab. 83: 254-259 (2018) - Ke-Jing Lee, Yu-Chi Chang, Cheng-Jung Lee, Li-Wen Wang, Yeong-Her Wang:
Resistive switching properties of alkaline earth oxide-based memory devices. Microelectron. Reliab. 83: 281-285 (2018) - Changyong Lee, Daeil Kwon:
A similarity based prognostics approach for real time health management of electronics using impedance analysis and SVM regression. Microelectron. Reliab. 83: 77-83 (2018) - Chang-Chun Lee, Chuan-Hsi Liu, Dian-Yong Li, Chia-Ping Hsieh:
Effect of contact-etch-stop-layer and Si1-xGex channel mechanical properties on nano-scaled short channel NMOSFETs with dummy gate arrays. Microelectron. Reliab. 83: 230-234 (2018) - Lei Li, Weichao Jin, Huisheng Yang, Kewei Gao, Pengwen Guo, Xiaolu Pang, Alex A. Volinsky:
First principles calculations study of crystallographic orientation effects on SiC/Ti and SiC/Cr interfaces. Microelectron. Reliab. 83: 119-126 (2018) - J. B. Libot, Joël Alexis, Olivier Dalverny, L. Arnaud, P. Milesi, F. Dulondel:
Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cycling. Microelectron. Reliab. 83: 64-76 (2018) - Chuan-Hsi Liu, Chun-Hu Cheng, Chin-Pao Cheng, Juin J. Liou:
Editorial: IEDMS 2016. Microelectron. Reliab. 83: 207 (2018) - Tien Tung Luong, Yen-Teng Ho, Yuen Yee Wong, Shane Chang, Edward Yi Chang:
Phase separation-suppressed and strain-modulated improvement of crystalline quality of AlGaN epitaxial layer grown by MOCVD. Microelectron. Reliab. 83: 286-292 (2018) - Haoran Ma, Anil Kunwar, Jun Chen, Lin Qu, Yunpeng Wang, Xueguan Song, Peter Råback, Haitao Ma, Ning Zhao:
Study of electrochemical migration based transport kinetics of metal ions in Sn-9Zn alloy. Microelectron. Reliab. 83: 198-205 (2018) - Victor M. Goncalves Martins, Paulo Ricardo Cechelero Villa, Rodrigo Travessini, Marcelo Daniel Berejuck, Eduardo Augusto Bezerra:
A dynamic partial reconfiguration design flow for permanent faults mitigation in FPGAs. Microelectron. Reliab. 83: 50-63 (2018) - Hossein Mohammadi, Huda Abdullah, Chang Fu Dee, P. Susthitha Menon:
A modified two dimensional analytical model for short-channel fully depleted SOI MESFET's. Microelectron. Reliab. 83: 173-179 (2018) - Parizad Shojaee Nasirabadi, Jesper Henri Hattel:
A 3D numerical study of humidity evolution and condensation risk on a printed circuit board (PCB) exposed to harsh ambient conditions. Microelectron. Reliab. 83: 39-49 (2018) - Jiangbo Pu, Youcong Jiang, Xiaobo Xie, Xiaogang Chen, Ming Liu, Shengpu Xu:
Low cost sensor network for obstacle avoidance in share-controlled smart wheelchairs under daily scenarios. Microelectron. Reliab. 83: 180-186 (2018) - Pushparajah Rajaguru, H. Lu, Chris Bailey, Alberto Castellazzi, V. Pathirana, N. Udugampola, Florin Udrea:
Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables. Microelectron. Reliab. 83: 146-156 (2018)
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