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"High-temperature and humidity change the microstructure and degrade the ..."

Asit Kumar Gain, Liangchi Zhang (2018)

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DOI: 10.1016/J.MICROREL.2018.02.022

access: closed

type: Journal Article

metadata version: 2020-02-22

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Asit Kumar Gain, Liangchi Zhang:
High-temperature and humidity change the microstructure and degrade the material properties of tin‑silver interconnect material. Microelectron. Reliab. 83: 101-110 (2018)

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