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"Realistic non-destructive testing of integrated circuit bond wiring using ..."

Joseph Favata, Sina Shahbazmohamadi (2018)

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DOI: 10.1016/J.MICROREL.2018.02.015

access: closed

type: Journal Article

metadata version: 2020-10-26

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Joseph Favata, Sina Shahbazmohamadi:
Realistic non-destructive testing of integrated circuit bond wiring using 3-D X-ray tomography, reverse engineering, and finite element analysis. Microelectron. Reliab. 83: 91-100 (2018)

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