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Publication search results
found 23 matches
- 2024
- Vishwani D. Agrawal:
Editorial. J. Electron. Test. 40(1): 1-2 (2024) - Vishwani D. Agrawal:
Editorial. J. Electron. Test. 40(2): 137-138 (2024) - Rachana Ahirwar, Manisha Pattanaik, Pankaj Srivastava:
Radiation Hardened by Design-based Voltage Controlled Oscillator for Low Power Phase Locked Loop Application. J. Electron. Test. 40(2): 171-184 (2024) - Bahman Arasteh
, Sahar Golshan, Shiva Shami, Farzad Kiani:
Sahand: A Software Fault-Prediction Method Using Autoencoder Neural Network and K-Means Algorithm. J. Electron. Test. 40(2): 229-243 (2024) - Alberto Bosio
, Samuele Germiniani
, Graziano Pravadelli
, Marcello Traiola
:
Syntactic and Semantic Analysis of Temporal Assertions to Support the Approximation of RTL Designs. J. Electron. Test. 40(2): 199-214 (2024) - Rongxing Cao
, Yan Liu, Yulong Cai, Bo Mei, Lin Zhao, Jiayu Tian, Shuai Cui, He Lv, Xianghua Zeng, Yuxiong Xue:
Comparison of Single Event Effect and Space Electrostatic Discharge Effect on FPGA Signal Transmission. J. Electron. Test. 40(2): 185-197 (2024) - Víctor H. Champac, Hector Villacorta, Roberto Gómez-Fuentes, Fabian Vargas, Jaume Segura:
Failure Probability due to Radiation-Induced Effects in FinFET SRAM Cells under Process Variations. J. Electron. Test. 40(1): 75-86 (2024) - Josie E. Rodriguez Condia
, Juan-David Guerrero-Balaguera
, Edward Javier Patiño Nuñez, Robert Limas Sierra
, Matteo Sonza Reorda
:
Investigating and Reducing the Architectural Impact of Transient Faults in Special Function Units for GPUs. J. Electron. Test. 40(2): 215-228 (2024) - Thiago Santos Copetti
, Moritz Fieback, Tobias Gemmeke, Said Hamdioui, Letícia Maria Veiras Bolzani Poehls:
A DfT Strategy for Guaranteeing ReRAM's Quality after Manufacturing. J. Electron. Test. 40(2): 245-257 (2024) - Chen Dong
, Xiao Chen, Zhenyi Chen:
Reactant and Waste Minimization during Sample Preparation on Micro-Electrode-Dot-Array Digital Microfluidic Biochips using Splitting Trees. J. Electron. Test. 40(1): 87-99 (2024) - Linsen Huang:
Analysis of the Lifecycles of Automotive Resistor Lead in Random Vibration. J. Electron. Test. 40(1): 101-106 (2024) - Zhengfeng Huang, Zishuai Li
, Liting Sun, Huaguo Liang, Tianming Ni, Aibin Yan:
A Quadruple-Node Upsets Hardened Latch Design Based on Cross-Coupled Elements. J. Electron. Test. 40(1): 19-30 (2024) - Hala Ibrahim, Haytham Azmi, M. Watheq El-Kharashi
, Mona Safar:
Non-Invasive Hardware Trojans Modeling and Insertion: A Formal Verification Approach. J. Electron. Test. 40(1): 117-135 (2024) - Baojun Liu
, Li Cai, Chuang Li:
An Analytical Model for Deposited Charge of Single Event Transient (SET) in FinFET. J. Electron. Test. 40(2): 159-169 (2024) - Bokka Raveendranadh, Sadasivam Tamilselvan:
Simulation-based Analysis of RPL Routing Attacks and Their Impact on IoT Network Performance. J. Electron. Test. 40(2): 259-273 (2024) - Soham Roy
, Spencer K. Millican, Vishwani D. Agrawal:
A Survey and Recent Advances: Machine Intelligence in Electronic Testing. J. Electron. Test. 40(2): 139-158 (2024) - M. N. Saranya
, Rathnamala Rao:
Design and Verification of an Asynchronous NoC Router Architecture for GALS Systems. J. Electron. Test. 40(1): 61-74 (2024) - Yuling Shang, Songyi Wei, Chunquan Li
, Xiaojing Ye, Lizhen Zeng, Wei Hu, Xiang He, Jinzhuo Zhou:
An End-to-End Mutually Exclusive Autoencoder Method for Analog Circuit Fault Diagnosis. J. Electron. Test. 40(1): 5-18 (2024) - Ching-Yi Wen, Shi-Yu Huang
:
Instant Test and Repair for TSVs using Differential Signaling. J. Electron. Test. 40(2): 275-287 (2024) - 2023 JETTA Reviewers. J. Electron. Test. 40(1): 3-4 (2024)
- Hui Xu, Xuewei Qin, Ruijun Ma, Chaoming Liu, Shuo Zhu, Jun Wang, Huaguo Liang:
A High-Performance Quadruple-Node-Upset-Tolerant Latch Design and an Algorithm for Tolerance Verification of Hardened Latches. J. Electron. Test. 40(1): 45-60 (2024) - Shun-Hua Yang, Shi-Yu Huang
:
General Fault and Soft-Error Tolerant Phase-Locked Loop by Enhanced TMR using A Synchronization-before-Voting Scheme. J. Electron. Test. 40(1): 31-43 (2024) - Shifeng Yu
, Junjie Dai, Junhui Li:
Research on the Reliability of Interconnected Solder Joints of Copper Pillars under Random Vibration. J. Electron. Test. 40(1): 107-116 (2024)
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