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Publication search results
found 81 matches
- 2015
- Yuuki Araga, Kikuchi Katsuya, Masahiro Aoyagi:
Guard-ring monitoring system for inspecting defects in TSV-based data buses. 3DIC 2015: TS8.18.1-TS8.18.5 - Noboru Asahi, Yoshinori Miyamoto, Masatsugu Nimura, Yoshihito Mizutani, Yoshiyuki Arai:
High productivity thermal compression bonding for 3D-IC. 3DIC 2015: TS7.3.1-TS7.3.5 - Rozalia Beica:
3D integration: Applications and market trends. 3DIC 2015: TS5.1.1-TS5.1.7 - Eric Beyne:
3D system integration research at IMEC. 3DIC 2015: FS1.1 - Tung Thanh Bui, Naoya Watanabe, Masahiro Aoyagi, Katsuya Kikuchi:
Twice-etched silicon approach for via-last through-silicon-via with a Parylene-HT liner. 3DIC 2015: TS8.6.1-TS8.6.4 - Chuan-An Cheng, Ryuichi Sugie, Tomoyuki Uchida, Kou-Hua Chen, Chi-Tsung Chiu, Kuan-Neng Chen:
Electrical investigation of Cu pumping in through-silicon vias for BEOL reliability in 3D integration. 3DIC 2015: TS8.12.1-TS8.12.4 - Sumin Choi, Heegon Kim, Daniel H. Jung, Jonghoon J. Kim, Jaemin Lim, Hyunsuk Lee, Kyungjun Cho, Joungho Kim, Hyungsoo Kim, Yong-Ju Kim, Yunsaing Kim:
Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC. 3DIC 2015: TS8.25.1-TS8.25.5 - Yuan Yuan Dai, Mei Zhen Ng, P. Anantha, Chee Lip Gan, Chuan Seng Tan:
Copper micro and nano particles mixture for 3D interconnections application. 3DIC 2015: TS8.9.1-TS8.9.5 - Mohamed N. ElBahey, DiaaEldin S. Khalil, Hani Fikry Ragai:
Proposed static timing analysis framework for extracted 3D integrated circuits (3D-STA). 3DIC 2015: TS8.33.1-TS8.33.4 - Paul D. Franzon, Eric Rotenberg, James Tuck, W. Rhett Davis, Huiyang Zhou, Joshua Schabel, Zhenqian Zhang, J. Brandon Dwiel, Elliott Forbes, Joonmoo Huh, Marcus Tshibangu, Steve Lipa:
Computing in 3D. 3DIC 2015: TS6.1.1-TS6.1.2 - Hua-Cheng Fu, Shi-Yu Huang, Ding-Ming Kwai, Yung-Fa Chou:
Temperature-aware online testing of power-delivery TSVs. 3DIC 2015: TS10.3.1-TS10.3.6 - Takafumi Fukushima, Taku Suzuki, Hideto Hashiguchi, Chisato Nagai, Jichoel Bea, Hiroyuki Hashimoto, Mariappan Murugesan, Kang Wook Lee, Tetsu Tanaka, Kazushi Asami, Yasuhiro Kitamura, Mitsumasa Koyanagi:
Transfer and non-transfer stacking technologies based on chip-to-wafer self-asembly for high-throughput and high-precision alignment and microbump bonding. 3DIC 2015: TS7.4.1-TS7.4.4 - Masahide Goto, Kei Hagiwara, Yoshinori Iguchi, Hiroshi Ohtake, Takuya Saraya, Masaharu Kobayashi, Eiji Higurashi, Hiroshi Toshiyoshi, Toshiro Hiramoto:
Three-dimensional integrated circuits and stacked CMOS image sensors using direct bonding of SOI layers. 3DIC 2015: TS9.2.1-TS9.2.4 - Daniel S. Green, Carl L. Dohrman, Jeffrey Demmin, Tsu-Hsi Chang:
Path to 3D heterogeneous integration. 3DIC 2015: FS7.1-FS7.3 - Armin Grünewald, Michael G. Wahl, Rainer Brück:
Cost modeling and analysis for the design, manufacturing and test of 3D-ICs. 3DIC 2015: TS8.32.1-TS8.32.6 - Shogo Hachiya, Takahiro Onagi, Sheyang Ning, Ken Takeuchi:
Comprehensive comparison of 3D-TSV integrated solid-state drives (SSDs) with storage class memory and NAND flash memory. 3DIC 2015: TS6.2.1-TS6.2.5 - T. Robert Harris, Eric J. Wyers, Lee Wang, Samuel Graham, Georges Pavlidis, Paul D. Franzon, W. Rhett Davis:
Thermal simulation of heterogeneous GaN/ InP/silicon 3DIC stacks. 3DIC 2015: TS10.2.1-TS10.2.4 - Andy Heinig, Muhammad Waqas Chaudhary, Peter Schneider, Peter Ramm, Josef Weber:
Current and future 3D activities at Fraunhofer. 3DIC 2015: FS4.1-FS4.3 - Andy Heinig, Robert Fischbach:
Enabling automatic system design optimization through Assembly Design Kits. 3DIC 2015: TS8.31.1-TS8.31.5 - Cui Huang, Dong Wu, Liyang Pan, Zheyao Wang:
Air-gap/SiO2 liner TSVs with improved electrical performance. 3DIC 2015: TS8.7.1-TS8.7.5 - Insu Hwang, Jihye Kim, Youngwoo Kim, Jonghyun Cho, Joungho Kim:
Noise coupling modeling and analysis of through glass via(TGV). 3DIC 2015: TS8.34.1-TS8.34.5 - Hiroaki Ikeda, Shigenobu Sekine, Ryuji Kimura, Koichi Shimokawa, Keiji Okada, Hiroaki Shindo, Tatsuya Ooi, Rei Tamaki, Makoto Nagata:
Nano-Function materials for TSV technologies. 3DIC 2015: TS5.3.1-TS5.3.6 - Keiichiro Iwanabe, Tanemasa Asano:
Room-temperature bonding mechanism of compliant bump with ultrasonic assist. 3DIC 2015: TS8.15.1-TS8.15.4 - Subramanian S. Iyer:
Invited talk: Some challenges in scaling 3D ICs to a broader application set. 3DIC 2015: TS1.1.1 - Amadine Jouve, Y. Sinquin, Arnaud Garnier, M. Daval, Pascal Chausse, M. Argoud, N. Allouti, Laurence Baud, Jérôme Dechamp, R. Franiatte, Séverine Cheramy, H. Kato, K. Kondo:
Silicon based dry-films evaluation for 2.5D and 3D Wafer-Level system integration improvement. 3DIC 2015: TS1.4.1-TS1.4.8 - Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Sukjin Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi:
Modeling and analysis of defects in through silicon via channel for non-invasive fault isolation. 3DIC 2015: TS8.29.1-TS8.29.4 - Tadashi Kamada:
The issues of automated driving vehicle and the expectations for 3D integration technology. 3DIC 2015: KN2.1-KN2.4 - Shuuichi Kariyazaki, Kenichi Kuboyama, Ryuichi Oikawa, Takuo Funaya:
New signal skew cancellation method for 2 Gbps transmission in glass and organic interposers to achieve 2.5D package employing next generation high bandwidth memory (HBM). 3DIC 2015: TS2.3.1-TS2.3.5 - Jin Kawakita, Barbara Horváth, Toyohiro Chikyow:
Fast filling of through-silicon via (TSV) with conductive polymer/metal composites. 3DIC 2015: TS8.14.1-TS8.14.5 - Joungho Kim:
Active Si interposer for 3D IC integrations. 3DIC 2015: TS11.1.1-TS11.1.3
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