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M. Argoud

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2010 – 2019

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2015
[c2]
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  - conf/3dic/JouveSGDCAABDFC15
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Amadine Jouve, Y. Sinquin, Arnaud Garnier, M. Daval, Pascal Chausse, M. Argoud, N. Allouti, Laurence Baud, Jérôme Dechamp, R. Franiatte, Séverine Cheramy, H. Kato, K. Kondo:
Silicon based dry-films evaluation for 2.5D and 3D Wafer-Level system integration improvement. 3DIC 2015: TS1.4.1-TS1.4.8
2013
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Sylvain Joblot, Alexis Farcy, Nicolas Hotellier, Amadine Jouve, François de Crecy, Arnaud Garnier, M. Argoud, C. Ferrandon, J.-P. Colonna, R. Franiatte, C. Laviron, Séverine Cheramy:
Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration. 3DIC 2013: 1-7

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