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"Three-dimensional integrated circuits and stacked CMOS image sensors using ..."
Masahide Goto et al. (2015)
- Masahide Goto
, Kei Hagiwara, Yoshinori Iguchi, Hiroshi Ohtake, Takuya Saraya, Masaharu Kobayashi, Eiji Higurashi
, Hiroshi Toshiyoshi, Toshiro Hiramoto:
Three-dimensional integrated circuits and stacked CMOS image sensors using direct bonding of SOI layers. 3DIC 2015: TS9.2.1-TS9.2.4
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