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"Influence of wafer thinning process on backside damage in 3D integration."

Tadao Nakamura et al. (2013)

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DOI: 10.1109/3DIC.2013.6702400

access: closed

type: Conference or Workshop Paper

metadata version: 2020-10-25

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  dblp key:
  - conf/3dic/NakamuraMKKMKSHKAUO13
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  persistent URL:
  - https://dblp.org/rec/conf/3dic/NakamuraMKKMKSHKAUO13
Tadao Nakamura, Yoriko Mizushima, Hideki Kitada, Young-Suk Kim, Nobuhide Maeda, Shoichi Kodama, Ryuichi Sugie, Hiroshi Hashimoto, Akihito Kawai, Kazuhisa Arai, Akira Uedono, Takayuki Ohba:
Influence of wafer thinning process on backside damage in 3D integration. 3DIC 2013: 1-6

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