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ORCIDKhanh N. Dang
Person information
- affiliation: University of Aizu, Adaptive Systems Laboratory, Aizuwakamatsu, Japan
- affiliation: Vietnam National University, VNU University of Engineering and Technology, SISLAB, Hanoi, Vietnam
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2020 – today
- 2023
[j15]Williams Yohanna Yerima
, Ogbodo Mark Ikechukwu, Khanh N. Dang, Abderazek Ben Abdallah:
Fault-Tolerant Spiking Neural Network Mapping Algorithm and Architecture to 3D-NoC-Based Neuromorphic Systems. IEEE Access 11: 52429-52443 (2023)- [j14]Ngo-Doanh Nguyen, Xuan-Tu Tran, Abderazek Ben Abdallah, Khanh N. Dang:
An In-Situ Dynamic Quantization With 3D Stacking Synaptic Memory for Power-Aware Neuromorphic Architecture. IEEE Access 11: 82377-82389 (2023) - [j13]Williams Yohanna Yerima, Khanh N. Dang, Abderazek Ben Abdallah:
R-MaS3N: Robust Mapping of Spiking Neural Networks to 3D-NoC-Based Neuromorphic Systems for Enhanced Reliability. IEEE Access 11: 94664-94678 (2023) - [j12]Khanh N. Dang, Nguyen Anh Vu Doan, Ngo-Doanh Nguyen, Abderazek Ben Abdallah:
HeterGenMap: An Evolutionary Mapping Framework for Heterogeneous NoC-Based Neuromorphic Systems. IEEE Access 11: 144095-144112 (2023) - [j11]Ngo-Doanh Nguyen, Akram Ben Ahmed, Abderazek Ben Abdallah, Khanh N. Dang:
Power-Aware Neuromorphic Architecture With Partial Voltage Scaling 3-D Stacking Synaptic Memory. IEEE Trans. Very Large Scale Integr. Syst. 31(12): 2016-2029 (2023) - [c18]Williams Yohanna Yerima, Khanh N. Dang, Abderazek Ben Abdallah:
Fault Recovery in Spiking Neural Networks Through Target and Selection of Faulty Neurons for 3D Spiking Neuromorphic Processors. ICKII 2023: 136-141 - [c17]Zhishang Wang, Khanh N. Dang, Abderazek Ben Abdallah:
Interlinked Chain Method for Blockchain-Based Collaborative Learning in Vehicular Networks. MCSoC 2023: 354-359 - [c16]Ngo-Doanh Nguyen, Khanh N. Dang:
A Novel Yield Improvement Approach for 3D Stacking Neuromorphic Architecture. MCSoC 2023: 392-398 - 2022
- [b1]Abderazek Ben Abdallah, Khanh N. Dang:
Neuromorphic Computing Principles and Organization. Springer 2022, ISBN 978-3-030-92524-6, pp. 1-244 - [j10]Duy-Anh Nguyen, Xuan-Tu Tran, Khanh N. Dang, Francesca Iacopi:
A low-power, high-accuracy with fully on-chip ternary weight hardware architecture for Deep Spiking Neural Networks. Microprocess. Microsystems 90: 104458 (2022) - [j9]Khanh N. Dang, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran:
HotCluster: A Thermal-Aware Defect Recovery Method for Through-Silicon-Vias Toward Reliable 3-D ICs Systems. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41(4): 799-812 (2022) - [j8]Khanh N. Dang, Nguyen Anh Vu Doan, Abderazek Ben Abdallah:
MigSpike: A Migration Based Algorithms and Architecture for Scalable Robust Neuromorphic Systems. IEEE Trans. Emerg. Top. Comput. 10(2): 602-617 (2022) - [c15]Tomohide Fukuchi, Ogbodo Mark Ikechukwu, Jiangkun Wang, Khanh N. Dang, Abderazek Ben Abdallah:
Efficient Pneumonia Detection Method and Implementation in Chest X-ray Images Based on a Neuromorphic Spiking Neural Network. ICCCI 2022: 311-321 - 2021
- [j7]Ogbodo Mark Ikechukwu, Khanh N. Dang, Abderazek Ben Abdallah:
On the Design of a Fault-Tolerant Scalable Three Dimensional NoC-Based Digital Neuromorphic System With On-Chip Learning. IEEE Access 9: 64331-64345 (2021) - [c14]Ogbodo Mark Ikechukwu, Khanh N. Dang, Abderazek Ben Abdallah:
Energy-Efficient Spike-Based Scalable Architecture for Next-Generation Cognitive AI Computing Systems. UNet 2021: 225-238 - 2020
- [j6]Khanh N. Dang, Michael Conrad Meyer, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran:
A Non-Blocking Non-Degrading Multiple Defects Link Testing Method for 3D-Networks-on-Chip. IEEE Access 8: 59571-59589 (2020) - [j5]Khanh N. Dang, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran:
A Thermal-Aware On-Line Fault Tolerance Method for TSV Lifetime Reliability in 3D-NoC Systems. IEEE Access 8: 166642-166657 (2020) - [j4]Khanh N. Dang, Akram Ben Ahmed, Yuichi Okuyama, Abderazek Ben Abdallah:
Scalable Design Methodology and Online Algorithm for TSV-Cluster Defects Recovery in Highly Reliable 3D-NoC Systems. IEEE Trans. Emerg. Top. Comput. 8(3): 577-590 (2020) - [j3]Khanh N. Dang, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran:
TSV-OCT: A Scalable Online Multiple-TSV Defects Localization for Real-Time 3-D-IC Systems. IEEE Trans. Very Large Scale Integr. Syst. 28(3): 672-685 (2020) - [c13]Duy-Anh Nguyen, Xuan-Tu Tran, Khanh N. Dang, Francesca Iacopi:
A lightweight Max-Pooling method and architecture for Deep Spiking Convolutional Neural Networks. APCCAS 2020: 209-212 - [c12]Mark Ogbodo, The Vu, Khanh N. Dang, Abderazek Ben Abdallah:
Light-Weight Spiking Neuron Processing Core for Large-Scale 3D-NoC Based Spiking Neural Network Processing Systems. BigComp 2020: 133-139 - [i5]Khanh N. Dang, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran:
Report on power, thermal and reliability prediction for 3D Networks-on-Chip. CoRR abs/2003.08648 (2020) - [i4]Khanh N. Dang, Yuichi Okuyama, Abderazek Ben Abdallah:
Soft-Error and Hard-fault Tolerant Architecture and Routing Algorithm for Reliable 3D-NoC Systems. CoRR abs/2003.09616 (2020) - [i3]Khanh N. Dang, Michael Conrad Meyer, Yuichi Okuyama, Abderazek Ben Abdallah:
Reliability Assessment and Quantitative Evaluation of Soft-Error Resilient 3D Network-on-Chip Systems. CoRR abs/2003.09617 (2020) - [i2]Khanh N. Dang, Abderazek Ben Abdallah:
An Efficient Software-Hardware Design Framework for Spiking Neural Network Systems. CoRR abs/2003.09847 (2020) - [i1]Khanh N. Dang, Michael Conrad Meyer, Yuichi Okuyama, Abderazek Ben Abdallah:
A low-overhead soft-hard fault-tolerant architecture, design and management scheme for reliable high-performance many-core 3D-NoC systems. CoRR abs/2003.11018 (2020)
2010 – 2019
- 2019
- [c11]Khanh N. Dang, Michael Conrad Meyer, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran:
2D-PPC: A single-correction multiple-detection method for Through-Silicon-Via Faults. APCCAS 2019: 109-112 - [c10]Khanh N. Dang, Abderazek Ben Abdallah:
An Efficient Software-Hardware Design Framework for Spiking Neural Network Systems. IINTEC 2019: 155-162 - [c9]Khanh N. Dang, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran:
TSV-IaS: Analytic Analysis and Low-Cost Non-Preemptive on-Line Detection and Correction Method for TSV Defects. ISVLSI 2019: 501-506 - [c8]Khanh N. Dang, Akram Ben Ahmed, Xuan-Tu Tran:
An on-Communication Multiple-TSV Defects Detection and Localization for Real-Time 3D-ICs. MCSoC 2019: 223-228 - 2018
- [c7]Khanh N. Dang, Xuan-Tu Tran:
Parity-Based ECC and Mechanism for Detecting and Correcting Soft Errors in On-Chip Communication. MCSoC 2018: 154-161 - 2017
- [j2]Khanh N. Dang, Michael Conrad Meyer, Yuichi Okuyama, Abderazek Ben Abdallah:
A low-overhead soft-hard fault-tolerant architecture, design and management scheme for reliable high-performance many-core 3D-NoC systems. J. Supercomput. 73(6): 2705-2729 (2017) - [j1]Khanh N. Dang, Akram Ben Ahmed, Xuan-Tu Tran, Yuichi Okuyama, Abderazek Ben Abdallah:
A Comprehensive Reliability Assessment of Fault-Resilient Network-on-Chip Using Analytical Model. IEEE Trans. Very Large Scale Integr. Syst. 25(11): 3099-3112 (2017) - [c6]Shunsuke Mie, Yuichi Okuyama, Yusuke Sato, Ye Chan, Nam-Khanh Dang, Ben Abdallah Abderazek:
Real-Time UAV Attitude Heading Reference System Using Extended Kalman Filter for Programmable SoC. MCSoC 2017: 136-142 - 2016
- [c5]Khanh N. Dang, Michael Conrad Meyer, Yuichi Okuyama, Abderazek Ben Abdallah:
Reliability Assessment and Quantitative Evaluation of Soft-Error Resilient 3D Network-on-Chip Systems. ATS 2016: 161-166 - [c4]Khanh N. Dang, Yuichi Okuyama, Abderazek Ben Abdallah:
Soft-error resilient Network-on-Chip for safety-critical applications. ICICDT 2016: 1-4 - 2015
- [c3]Khanh N. Dang, Michael Conrad Meyer, Yuichi Okuyama, Abderazek Ben Abdallah, Xuan-Tu Tran:
Soft-error resilient 3D Network-on-Chip router. iCAST 2015: 84-90 - 2014
- [c2]Ngoc-Mai Nguyen, Edith Beigné, Suzanne Lesecq, Duy-Hieu Bui, Nam-Khanh Dang, Xuan-Tu Tran:
H.264/AVC hardware encoders and low-power features. APCCAS 2014: 77-80 - [c1]Nam-Khanh Dang, Xuan-Tu Tran, Alain Merirot:
An efficient hardware architecture for inter-prediction in H.264/AVC encoders. DDECS 2014: 294-297
Coauthor Index
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