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conf/3dic/SarhanTBDSBFC15 share record
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Hossam Sarhan , Sébastien Thuries , Olivier Billoint , Fabien Deprat , Alexandre Ayres De Sousa , Perrine Batude , Claire Fenouillet-Béranger , Fabien Clermidy : Intermediate BEOL process influence on power and performance for 3DVLSI. 3DIC 2015 : TS1.3.1-TS1.3.5 share record
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Ryouya Shirahama , Sethavut Duangchan , Yusuke Koishikawa , Akiyoshi Baba : Influential factors in low-temperature direct bonding of silicon dioxide. 3DIC 2015 : TS8.16.1-TS8.16.5 share record
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Chao Song , Minxuan Zhang : Improved access pattern for ROB soft error rate mitigation based on 3D integration technology. 3DIC 2015 : TS8.20.1-TS8.20.5 share record
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Kuniaki Sueoka , Akihiro Horibe , T. Aoki , Sayuri Kohara , Kazushige Toriyama , Hiroyuki Mori , Yasumitsu Orii : Vertical integration after stacking (ViaS) process for low-cost and low-stress 3D silicon integration. 3DIC 2015 : TS8.3.1-TS8.3.5 share record
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Daisuke Suga , Masaki Hashizume , Hiroyuki Yotsuyanagi , Shyue-Kung Lu : Electrical interconnect test method of 3D ICs by injected charge volume. 3DIC 2015 : TS8.19.1-TS8.19.6 share record
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Isao Sugaya , Hajime Mitsuishi , Hidehiro Maeda , Kazuya Okamoto : New precision wafer bonding technologies for 3DIC. 3DIC 2015 : TS7.1.1-TS7.1.7 share record
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Jubee Tada , Ryusuke Egawa , Hiroaki Kobayashi : Design of a 3-D stacked floating-point Goldschmidt divider. 3DIC 2015 : TS8.28.1-TS8.28.4 share record
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Hiroshi Taka , Katsumasa Suzuki , Norihiro Tsujioka , Shoichi Murakami : Development of high-quality low-temperature (≤ 120°C) PECVD-SiN films by organosilane. 3DIC 2015 : TS8.2.1-TS8.2.4 export record
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conf/3dic/TakigawaNIKHKA15 share record
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Ryo Takigawa , Kohei Nitta , Akihiro Ikeda , Mitsuaki Kumazawa , Toshiharu Hirai , Michio Komatsu , Tanemasa Asano : High-speed via hole filling using electrophoresis of Ag nanoparticles. 3DIC 2015 : TS5.4.1-TS5.4.4 share record
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Seiya Tanikawa , Hisashi Kino , Takafumi Fukushima , Mitsumasa Koyanagi , Tetsu Tanaka : Novel local stress evaluation method in 3D IC using DRAM cell array with planar mOS capacitors. 3DIC 2015 : TS3.1.1-TS3.1.4 share record
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Tsung-Yen Tsai , Chien-Hung Lin , Chia-Lin Lee , Shan-Chun Yang , Kuan-Neng Chen : An ultra-fast temporary bonding and release process based on thin photolysis polymer in 3D integration. 3DIC 2015 : TS8.8.1-TS8.8.5 export record
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conf/3dic/VelenisDHSMPMML15 share record
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Dimitrios Velenis , Mikael Detalle , Geert Hellings , Mirko Scholz , Erik Jan Marinissen , Geert Van der Plas , Antonio La Manna , Andy Miller , Dimitri Linten , Eric Beyne : Processing active devices on Si interposer and impact on cost. 3DIC 2015 : TS11.2.1-TS11.2.4 export record
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conf/3dic/VianneFFCCLCPRE15 share record
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Benjamin Vianne , Alexis Farcy , Vincent Fiori , Cédrick Chappaz , Norbert Chevrier , G. Lobascio , Pascal Chausse , F. Ponthenier , A. Ruckly , Stephanie Escoubas , Olivier Thomas : Stress management strategy to limit die curvature during silicon interposer integration. 3DIC 2015 : TS11.4.1-TS11.4.7 export record
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conf/3dic/VivetBCDGPPTGLJ15 share record
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Pascal Vivet , Christian Bernard , Fabien Clermidy , Denis Dutoit , Eric Guthmuller , Ivan Miro Panades , Gaël Pillonnet , Yvain Thonnart , Arnaud Garnier , Didier Lattard , Amandine Jouve , Franck Bana , Thierry Mourier , Séverine Cheramy : 3D advanced integration technology for heterogeneous systems. 3DIC 2015 : FS6.1-FS6.3 export record
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conf/3dic/WangHCYKCCCLJTL15 share record
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Chuei-Tang Wang , Jeng-Shien Hsieh , Victor C. Y. Chang , En-Hsiang Yeh , Feng-Wei Kuo , Hsu-Hsien Chen , Chih-Hua Chen , Huan-Neng Ron Chen , Ying-Ta Lu , Chewnpu Jou , Hao-Yi Tsai , C. S. Liu , Doug C. H. Yu : Power saving and noise reduction of 28nm CMOS RF system integration using integrated fan-out wafer level packaging (InFO-WLP) technology. 3DIC 2015 : TS6.3.1-TS6.3.4 share record
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Xin Wu : 3D-IC technologies and 3D FPGA. 3DIC 2015 : KN1.1-KN1.4 share record
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Eric J. Wyers , T. Robert Harris , Wallace Shep Pitts , Jordan E. Massad , Paul D. Franzon : Characterization of the mechanical stress impact on device electrical performance in the CMOS and III-V HEMT/HBT heterogeneous integration environment. 3DIC 2015 : TS8.27.1-TS8.27.4 export record
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conf/3dic/YamashitaKSHA15 share record
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Kosuke Yamashita , Shunji Kurooka , Koji Shirakawa , Yoshinori Hotta , Hirofumi Abe : Copper-filled anodized aluminum oxide a potential material for chip to chip bonding. 3DIC 2015 : TS8.1.1-TS8.1.5 share record
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Yangyang Yan , Yingtao Ding , Qianwen Chen , Kang Wook Lee , Takafumi Fukushima , Mitsumasa Koyanagi : Vacuum-assisted-spin-coating of polyimide liner for high-aspect-ratio TSVs applications. 3DIC 2015 : TS5.2.1-TS5.2.5 export record
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conf/3dic/YotsuyanagiFH15 share record
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Hiroyuki Yotsuyanagi , Akihiro Fujiwara , Masaki Hashizume : On TSV array defect detection method using two ring-oscillators considering signal transitions at adjacent TSVs. 3DIC 2015 : TS8.24.1-TS8.24.4 share record
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2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015. IEEE 2015 , ISBN 978-1-4673-9385-0 [contents]