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"Thermally stable, packaged aware LV HKMG platforms benchmark to enable low ..."

Alessio Spessot et al. (2022)

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DOI: 10.1109/IMW52921.2022.9779308

access: closed

type: Conference or Workshop Paper

metadata version: 2023-06-16

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Alessio Spessot, Shairfe Muhammad Salahuddin, Ricardo Escobar, Romain Ritzenthaler, Yang Xiang, Rahul Budhwani, Eugenio Dentoni Litta, Elena Capogreco, Joao Bastos, Yangyin Chen, Naoto Horiguchi:
Thermally stable, packaged aware LV HKMG platforms benchmark to enable low power I/O for next 3D NAND generations. IMW 2022: 1-4

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