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Harold Philipsen

Harold G. G. Philipsen

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Conference and Workshop Papers

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2022
[c5]
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  dblp key:
  - conf/imw2/RosmeulenRWFSVK22
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  persistent URL:
  - https://dblp.org/rec/conf/imw2/RosmeulenRWFSVK22
Maarten Rosmeulen, Cesar J. Lockhart de la Rosa, K. Willems, S. Fransen, B.-Y. Shih, Devin Verreck, V. Kalangi, F. Yasin, Harold Philipsen, Y. T. Set, N. Ronchi, W. Van Roy, O. Y. F. Henry, Antonio Arreghini, Geert Van den Bosch, Arnaud Furnémont:
Liquid Memory and the Future of Data Storage. IMW 2022: 1-4
2015
[c4]
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  dblp key:
  - conf/irps/MessemaekerPMNV15
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  - https://dblp.org/rec/conf/irps/MessemaekerPMNV15
Joke De Messemaeker, O. Varela Pedreira, A. Moussa, Nabi Nabiollahi, Kris Vanstreels, Stefaan Van Huylenbroeck, Harold Philipsen, Patrick Verdonck, Bart Vandevelde, Ingrid De Wolf, Eric Beyne, Kris Croes:
Impact of oxide liner properties on TSV Cu pumping and TSV stress. IRPS 2015: 4
2014
[c3]
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  - conf/3dic/InouePVVHST14
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Fumihiro Inoue, Harold Philipsen, Marleen H. van der Veen, Kevin Vandersmissen, Stefaan Van Huylenbroeck, Herbert Struyf, Tetsu Tanaka:
Cu seeding using electroless deposition on Ru liner for high aspect ratio through-Si vias. 3DIC 2014: 1-4
2011
[c2]
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  - conf/3dic/InouePRALMASISSYS11
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  - https://dblp.org/rec/conf/3dic/InouePRALMASISSYS11
Fumihiro Inoue, Harold Philipsen, Alex Radisic, Silvia Armini, Peter Leunissen, Hiroshi Miyake, Ryohei Arima, Tomohiro Shimizu, Toshiaki Ito, Hirofumi Seki, Yuko Shinozaki, Tomohiko Yamamoto, Shoso Shingubara:
Low temperature through-Si via fabrication using electroless deposition. 3DIC 2011: 1-4
2009
[c1]
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  dblp key:
  - conf/3dic/CivaleTPJADSTB09
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Yann Civale, Deniz Sabuncuoglu Tezcan, Harold G. G. Philipsen, P. Jaenen, Rahul Agarwal, F. Duval, Philippe Soussan, Youssef Travaly, Eric Beyne:
Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping. 3DIC 2009: 1-4

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