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"Die stacking using 3D-wafer level packaging copper/polymer through-si via ..."

Yann Civale et al. (2009)

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DOI: 10.1109/3DIC.2009.5306559

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

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  - conf/3dic/CivaleTPJADSTB09
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  - https://dblp.org/rec/conf/3dic/CivaleTPJADSTB09
Yann Civale, Deniz Sabuncuoglu Tezcan, Harold G. G. Philipsen, P. Jaenen, Rahul Agarwal, F. Duval, Philippe Soussan, Youssef Travaly, Eric Beyne:
Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping. 3DIC 2009: 1-4

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