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ORCIDIEEE Micro, Volume 45
Volume 45, Number 1, January - February 2025
- Hsien-Hsin S. Lee
:
Rise of the Agentic AI Workforce. 4-5 - Debendra Das Sharma, Nam Sung Kim:
Special Issue on Interconnects for Chiplet Integration Technologies. 6-8 - Boyd Phelps, Arif Khan:
Disaggregated Designs: Technology Challenges and Enablers. 9-15 - Peter Z. Onufryk, Swadesh Choudhary:
UCIe: Standard for an Open Chiplet Ecosystem. 16-25 - Au Huynh, Kent Stahn, Manuel Mota, Christian de Verteuil, Jennifer Pyon, Reza Movahedinia:
UCIe Standard: Enhancing Die-to-Die Connectivity in Modern Packaging. 26-34 - Tony Chan Carusone, Dustin Dunwell, Sundeep Gupta, Letizia Giuliano, Adrien Auge, Michael Klempa, Sue Hung Fung:
Co-Design of Interchiplet, Package, and System Interconnect Protocols. 35-40 - Wei Tang, Chester Liu, Zhengya Zhang:
Energy-Efficient Parallel Interconnects for Chiplet Integration. 41-47 - Durand Jarrett-Amor, Tony Chan Carusone:
A Comparison of Single-Ended, NRZ Unidirectional Signaling and Single-Ended, NRZ Simultaneous-Bidirectional Signaling for Die-to-Die Links. 48-56 - Alan Smith, Gabriel H. Loh, Samuel Naffziger, John J. Wuu, Nathan Kalyanasundharam, Eric Chapman, Raja Swaminathan, Tyrone Huang, Wonjun Jung, Alexander Kaganov, Hugh McIntyre, Ramon Mangaser:
Interconnect Design for Heterogeneous Integration of Chiplets in the AMD Instinct MI300X Accelerator. 57-66 - Sridhar Muthrasanallur, Yervant Zorian:
A Test, Debug, and Silicon Lifecycle Management Architecture for a UCIe-Based Open Chiplet Ecosystem. 67-74 - Thommas K. S. Flores, Ivanovitch Silva, Mariana Azevedo, Thaís Medeiros, Morsinaldo Medeiros, Daniel G. Costa, Paolo Ferrari, Emiliano Sisinni:
Advancing Tiny Machine Learning Operations: Robust Model Updates in the Internet of Intelligent Vehicles. 76-86 - Tomasz Szydlo, Marcin Nagy:
Management of TinyML-Enabled Internet of Things Devices. 87-94 - Joshua J. Yi:
A Review of Wisconsin Alumni Research Foundation v. Apple - Part II. 95-100 - Shane Greenstein:
Spillovers, Bottlenecks, and More Invention After Invention. 101-103 - Mariam Elgamal, Yueying Lisa Li:
Measuring What Matters: A Fireside Chat With Joel Emer. 104-112
Volume 45, Number 2, March - April 2025
- Hsien-Hsin S. Lee:
Taiwan Semiconductor Manufacturing Company's $165 Billion Bet. 4-5 - Whit Schonbein, Joseph Schuchart:
Special Issue on Hot Interconnects 31. 6-7 - Quentin Anthony, Benjamin Michalowicz, Jacob Hatef, Lang Xu, Mustafa Abduljabbar, Aamir Shafi, Hari Subramoni, Dhabaleswar K. Panda:
Understanding and Characterizing Communication Characteristics for Distributed Transformer Models. 8-17 - Weiyang Wang, Manya Ghobadi:
Spine-Free Networks for Large Language Model Training. 18-25 - Manjunath Gorentla Venkata, Valentine Petrov, Sergey Lebedev, Devendar Bureddy, Ferrol Aderholdt, Joshua Ladd, Gil Bloch, Mike Dubman, Gilad Shainer:
Unified Collective Communication: A Unified Library for CPU, GPU, and DPU Collectives. 26-35 - Tu Tran, Goutham Kalikrishna Reddy Kuncham, Bharath Ramesh, Shulei Xu, Hari Subramoni, Dhabaleswar K. Panda:
OHIO: Enhancing RDMA Scalability in Alltoall With Optimized Communication Overlap. 36-45 - Jinsun Yoo, William Won, Meghan Cowan, Nan Jiang, Benjamin Klenk, Srinivas Sridharan, Tushar Krishna:
Toward a Standardized Representation for Deep Learning Collective Algorithms. 46-55 - Cristina Olmedilla, Jesús Escudero-Sahuquillo, Pedro Javier García, Francisco J. Quiles, Wenhao Sun, Long Yan, Yunping Lyu, José Duato:
ECP: Improving the Accuracy of Congesting-Packets Identification in High-Performance Interconnection Networks. 56-64 - Ryusuke Egawa, Yasutaka Wada:
Special Issue on COOL Chips. 65-66 - Jueun Jung, Seungbin Kim, Bokyoung Seo, Wuyoung Jang, Sangho Lee, Jeongmin Shin, Donghyeon Han, Kyuho Jason Lee:
A Mobile Semantic Lidar SLAM Processor With Artificial-Intelligence-Based 3-D Perception and Spatiotemporal-Aware Computing. 67-77 - Hoai Luan Pham, Vu Trung Duong Le, Tuan Hai Vu, Van Duy Tran, Van Tinh Nguyen, Thi Diem Tran, Yasuhiko Nakashima:
MRCA 2.0: An Area-Optimized Multigrained Reconfigurable Cryptographic Accelerator for Securing Blockchain-Based Internet of Things Systems. 78-89 - Reoma Matsuo, Yuya Degawa, Hidetsugu Irie, Shuichi Sakai, Ryota Shioya:
Flexible Approximate Computing for Mitigating Branch Divergence in GPUs. 90-100 - Kyungsoo Lee, Sohyun Kim, Joohee Lee, Donguk Moon, Rakie Kim, Honggyu Kim, Hyeongtak Ji, Yunjeong Mun, Youngpyo Joo:
Improving Key-Value Cache Performance With Heterogeneous Memory Tiering: A Case Study of Compute-Express-Link-Based Memory Expansion. 102-113 - Joshua J. Yi:
A Review of Wisconsin Alumni Research Foundation v. Apple - Part III. 114-117 - Shane Greenstein:
Artificial Intelligence and the Jevons Paradox. 118-120 - Doug Burger, Paul Chow, Joel S. Emer, Mark D. Hill, James C. Hoe, Masato Motomura:
Derek Chiou. 122-124
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