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IEEE Micro, Volume 44
Volume 44, Number 1, January - February 2024
- Hsien-Hsin S. Lee
:
Computing With COOL Chips. 4-5 - Ryusuke Egawa
, Yasutaka Wada
:
Special Issue on COOL Chips. 6-7 - Reon Oshio
, Sugahara Takuya, Atsushi Sawada, Mutsumi Kimura
, Renyuan Zhang
, Yasuhiko Nakashima
:
A Compressed Spiking Neural Network Onto a Memcapacitive In-Memory Computing Array. 8-16 - Donghyeon Han
, Junha Ryu
, Sangyeob Kim
, Sangjin Kim
, Jongjun Park
, Hoi-Jun Yoo
:
A Low-Power Artificial-Intelligence-Based 3-D Rendering Processor With Hybrid Deep Neural Network Computing. 17-27 - Sangyeob Kim
, Soyeon Kim
, Seongyon Hong
, Sangjin Kim
, Jiwon Choi
, Donghyeon Han
, Hoi-Jun Yoo
:
COOL-NPU: Complementary Online Learning Neural Processing Unit. 28-37 - Tatsuya Kubo
, Shinya Takamaeda-Yamazaki
:
Cachet: Low-Overhead Integrity Verification on Metadata Cache in Secure Nonvolatile Memory Systems. 38-48 - Jianqing Liu
, Na Gong
:
Privacy by Memory Design: Visions and Open Problems. 49-58 - Cyrius Nugier
, Vincent Migliore
:
Acceleration of a Classic McEliece Postquantum Cryptosystem With Cache Processing. 59-68 - Joshua J. Yi
:
Analysis of Historical Patenting Behavior and Patent Characteristics of Computer Architecture Companies - Part VIII: Patent Families. 70-74 - Shane Greenstein
:
After the Gold Rush. 76-78
Volume 44, Number 2, March - April 2024
- Hsien-Hsin S. Lee
:
Beyond Wires: The Future of Interconnects. 4-5 - Scott Levy
, Whit Schonbein
:
Special Issue on Hot Interconnects 30. 6-7 - Yuke Li
, Arjun Kashyap
, Yanfei Guo
, Xiaoyi Lu
:
Compression Analysis for BlueField-2/-3 Data Processing Units: Lossy and Lossless Perspectives. 8-19 - Rafael Oliveira
, Ada Gavrilovska
:
Comprex: In-Network Compression for Accelerating IoT Analytics at Scale. 20-30 - Liuyao Dai
, Hao Qi, Weicong Chen
, Xiaoyi Lu
:
High-Speed Data Communication With Advanced Networks in Large Language Model Training. 31-40 - Dennis Abts
, John Kim
:
Enabling Artificial Intelligence Supercomputers With Domain-Specific Networks. 41-49 - Debendra Das Sharma
, Swadesh Choudhary:
Pipelined and Partitionable Forward Error Correction and Cyclic Redundancy Check Circuitry Implementation for PCI Express 6.0 and Compute Express Link 3.0. 50-59 - Huseyin Ekin Sumbul
, Jae-sun Seo
, Daniel H. Morris, Edith Beigné
:
A Fully Digital and Row-Pipelined Compute-in-Memory Neural Network Accelerator With System-on-Chip-Level Benchmarking for Augmented/Virtual Reality Applications. 61-70 - Joshua J. Yi
:
Analysis of Historical Patenting Behavior and Patent Characteristics of Computer Architecture Companies - Part IX: Patent Families. 72-77 - Shane Greenstein
:
Party Like It's 1999? 78-80
Volume 44, Number 3, May - June 2024
- Hsien-Hsin S. Lee
:
An Incoming World of Decoupling Siliconomy. 4-5 - Heiner Litz
, Natalia Vassilieva
:
Special Issue on Hot Chips 2023. 6-7 - Ravi Bhargava
, Kai Troester
:
AMD Next-Generation "Zen 4" Core and 4th Gen AMD EPYC Server CPUs. 8-17 - Mahesh Subramony
, David Kramer, Indrani Paul:
AMD Ryzen 7040 Series. 18-24 - Jason Howard
, Joshua B. Fryman, Shamsul Abedin
:
The First Direct Mesh-to-Mesh Photonic Fabric. 25-32 - Amir Gholami
, Zhewei Yao
, Sehoon Kim
, Coleman Hooper
, Michael W. Mahoney
, Kurt Keutzer
:
AI and Memory Wall. 33-39 - Byeongho Kim
, Sanghoon Cha, Sangsoo Park, Jieun Lee, Sukhan Lee, Shinhaeng Kang, Jinin So
, Kyungsoo Kim
, Jin Jung, Jong-Geon Lee
, Sunjung Lee
, Yoonah Paik
, Hyeonsu Kim, Jin-Seong Kim, Won-Jo Lee, Yuhwan Ro
, Yeongon Cho
, Jin Hyun Kim
, Joon-Ho Song, Jaehoon Yu, Seungwon Lee
, Jeonghyeon Cho, Kyomin Sohn
:
The Breakthrough Memory Solutions for Improved Performance on LLM Inference. 40-48 - Sean Lie
:
Inside the Cerebras Wafer-Scale Cluster. 49-57 - Ian Winfield
, Tim Ouradnik
, Joseph Madril
, Michael Matthews
, Guillermo Romero
:
High-Performance Cooling for Power Electronics via Electrochemical Additive Manufacturing. 58-66 - Michael Gibbs
, Kieran Woodward
, Eiman Kanjo
:
Combining Multiple Tiny Machine Learning Models for Multimodal Context-Aware Stress Recognition on Constrained Microcontrollers. 67-75 - Joshua J. Yi
:
Analysis of Historical Patenting Behavior and Patent Characteristics of Computer Architecture Companies - Part X: Patent Families. 76-80 - Shane M. Greenstein
:
The Worlds I See: Curiosity, Exploration, and the Discovery at the Dawn of AI - Fei-Fei Li (New York, NY, USA: Flatiron Books, 2023, 336 pp.). 82-84
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