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ORCIDACM Journal on Emerging Technologies in Computing Systems, Volume 4
Volume 4, Number 1, March 2008
- Tzvetan S. Metodi, Darshan D. Thaker, Andrew W. Cross
, Isaac L. Chuang, Frederic T. Chong:
High-level interconnect model for the quantum logic array architecture. 1:1-1:28 - James Donald, Niraj K. Jha:
Reversible logic synthesis with Fredkin and Peres gates. 2:1-2:19 - Carlotta Guiducci, Christine Nardini:
High parallelism, portability, and broad accessibility: Technologies for genomics. 3:1-3:39
Volume 4, Number 2, April 2008
- Vijaykrishnan Narayanan:
Editorial. 4:1 - R. Iris Bahar, Krishnendu Chakrabarty:
Introduction to joint ACM JETC/TODAES special issue on new, emerging, and specialized technologies. 5:1-5:2 - Shih-Hsien Kuo, Bruce Tidor, Jacob White:
A meshless, spectrally accurate, integral equation solver for molecular surface electrostatics. 6:1-6:30 - Jie Deng, Albert Lin, Gordon C. Wan, H.-S. Philip Wong:
Carbon nanotube transistor compact model for circuit design and performance optimization. 7:1-7:20 - Josep Carmona, Jordi Cortadella, Yousuke Takada, Ferdinand Peper:
Formal methods for the analysis and synthesis of nanometer-scale cellular arrays. 8:1-8:27 - Michael Crocker, Michael T. Niemier, Xiaobo Sharon Hu, Marya Lieberman:
Molecular QCA design with chemically reasonable constraints. 9:1-9:21
Volume 4, Number 3, August 2008
- Alvin R. Lebeck, Krishnendu Chakrabarty:
Introduction to DAC 2007 special section. 10:1-10:2 - Tao Xu, Krishnendu Chakrabarty:
Integrated droplet routing and defect tolerance in the synthesis of digital microfluidic biochips. 11:1-11:24 - Tsung-Ching Huang, Kwang-Ting (Tim) Cheng, Huai-Yuan Tseng, Chen-Pang Kung:
Reliability analysis for flexible electronics: Case study of integrated a-Si: H TFT scan driver. 12:1-12:23 - Jing Li, Aditya Bansal, Swaroop Ghosh, Kaushik Roy:
An alternate design paradigm for low-power, low-cost, testable hybrid systems using scaled LTPS TFTs. 13:1-13:19 - Reza M. Rad, Mohammad Tehranipoor:
SCT: A novel approach for testing and configuring nanoscale devices. 14:1-14:24
Volume 4, Number 4, October 2008
- Yuan Xie, Jason Cong, Paul D. Franzon:
Editorial: Special issue on 3D integrated circuits and microarchitectures. 15:1-15:2 - Taeho Kgil, Ali G. Saidi, Nathan L. Binkert, Steven K. Reinhardt, Krisztián Flautner, Trevor N. Mudge:
PicoServer: Using 3D stacking technology to build energy efficient servers. 16:1-16:34 - Yuchun Ma, Yongxiang Liu, Eren Kursun, Glenn Reinman, Jason Cong:
Investigating the effects of fine-grain three-dimensional integration on microarchitecture design. 17:1-17:30 - Yong Zhan, Sachin S. Sapatnekar:
Automated module assignment in stacked-Vdd designs for high-efficiency power delivery. 18:1-18:20 - Cesare Ferri, Sherief Reda, R. Iris Bahar:
Parametric yield management for 3D ICs: Models and strategies for improvement. 19:1-19:22 - Nobuaki Miyakawa, Eiri Hashimoto, Takanori Maebashi, Natsuo Nakamura, Yutaka Sacho, Shigeto Nakayama, Shinjiro Toyoda:
Multilayer stacking technology using wafer-to-wafer stacked method. 20:1-20:15
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